JPH0563095B2 - - Google Patents
Info
- Publication number
- JPH0563095B2 JPH0563095B2 JP63011867A JP1186788A JPH0563095B2 JP H0563095 B2 JPH0563095 B2 JP H0563095B2 JP 63011867 A JP63011867 A JP 63011867A JP 1186788 A JP1186788 A JP 1186788A JP H0563095 B2 JPH0563095 B2 JP H0563095B2
- Authority
- JP
- Japan
- Prior art keywords
- lead wires
- powder
- lead wire
- silicone resin
- electronic component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000843 powder Substances 0.000 claims description 27
- 238000000576 coating method Methods 0.000 claims description 14
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 12
- 239000011248 coating agent Substances 0.000 claims description 9
- 229920002050 silicone resin Polymers 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 5
- 238000004806 packaging method and process Methods 0.000 claims description 2
- 229920005989 resin Polymers 0.000 description 8
- 239000011347 resin Substances 0.000 description 8
- 239000003973 paint Substances 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 238000010292 electrical insulation Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000007654 immersion Methods 0.000 description 2
- 238000012858 packaging process Methods 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 1
- 239000003985 ceramic capacitor Substances 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000008595 infiltration Effects 0.000 description 1
- 238000001764 infiltration Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- LLZRNZOLAXHGLL-UHFFFAOYSA-J titanic acid Chemical compound O[Ti](O)(O)O LLZRNZOLAXHGLL-UHFFFAOYSA-J 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- 230000003313 weakening effect Effects 0.000 description 1
Landscapes
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63011867A JPH01189112A (ja) | 1988-01-23 | 1988-01-23 | 電子部品の静電粉体外装方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63011867A JPH01189112A (ja) | 1988-01-23 | 1988-01-23 | 電子部品の静電粉体外装方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01189112A JPH01189112A (ja) | 1989-07-28 |
| JPH0563095B2 true JPH0563095B2 (enrdf_load_stackoverflow) | 1993-09-09 |
Family
ID=11789672
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63011867A Granted JPH01189112A (ja) | 1988-01-23 | 1988-01-23 | 電子部品の静電粉体外装方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01189112A (enrdf_load_stackoverflow) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7286414B2 (en) | 1995-02-27 | 2007-10-23 | Btg International Inc. | Memory apparatus including programmable non-volatile multi-bit memory cell, and apparatus and method for demarcating memory states of the cell |
-
1988
- 1988-01-23 JP JP63011867A patent/JPH01189112A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7286414B2 (en) | 1995-02-27 | 2007-10-23 | Btg International Inc. | Memory apparatus including programmable non-volatile multi-bit memory cell, and apparatus and method for demarcating memory states of the cell |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH01189112A (ja) | 1989-07-28 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |