JPH0562590B2 - - Google Patents

Info

Publication number
JPH0562590B2
JPH0562590B2 JP5972087A JP5972087A JPH0562590B2 JP H0562590 B2 JPH0562590 B2 JP H0562590B2 JP 5972087 A JP5972087 A JP 5972087A JP 5972087 A JP5972087 A JP 5972087A JP H0562590 B2 JPH0562590 B2 JP H0562590B2
Authority
JP
Japan
Prior art keywords
ppo
resin composition
resin
layer
impregnated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP5972087A
Other languages
English (en)
Japanese (ja)
Other versions
JPS63224941A (ja
Inventor
Shuji Maeda
Takaaki Sakamoto
Munehiko Ito
Takahiro Heiuchi
Takayoshi Koseki
Hideto Misawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP5972087A priority Critical patent/JPS63224941A/ja
Publication of JPS63224941A publication Critical patent/JPS63224941A/ja
Publication of JPH0562590B2 publication Critical patent/JPH0562590B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0313Organic insulating material
    • H05K1/032Organic insulating material consisting of one material
    • H05K1/0326Organic insulating material consisting of one material containing O
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0313Organic insulating material
    • H05K1/0353Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/036Multilayers with layers of different types

Landscapes

  • Laminated Bodies (AREA)
  • Reinforced Plastic Materials (AREA)
JP5972087A 1987-03-15 1987-03-15 プリント配線板材料 Granted JPS63224941A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5972087A JPS63224941A (ja) 1987-03-15 1987-03-15 プリント配線板材料

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5972087A JPS63224941A (ja) 1987-03-15 1987-03-15 プリント配線板材料

Publications (2)

Publication Number Publication Date
JPS63224941A JPS63224941A (ja) 1988-09-20
JPH0562590B2 true JPH0562590B2 (zh) 1993-09-08

Family

ID=13121318

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5972087A Granted JPS63224941A (ja) 1987-03-15 1987-03-15 プリント配線板材料

Country Status (1)

Country Link
JP (1) JPS63224941A (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4913955A (en) * 1987-06-05 1990-04-03 Shin-Kobe Electric Machinery Co., Ltd. Epoxy resin laminate

Also Published As

Publication number Publication date
JPS63224941A (ja) 1988-09-20

Similar Documents

Publication Publication Date Title
JP3633673B2 (ja) プリプレグ及び積層板
JPS63159443A (ja) 積層板
JPH0579686B2 (zh)
JPH0583166B2 (zh)
JP4852292B2 (ja) 銅張り積層板
JPH0310650B2 (zh)
JPH0562590B2 (zh)
JP2563137B2 (ja) 難燃化ポリフェニレンオキサイド系樹脂組成物
JPH0564586B2 (zh)
JPS62235335A (ja) 金属箔張積層板の製法
JP2965277B2 (ja) ポリフェニレンオキサイド系樹脂組成物とこれを用いた金属箔張積層板
JPS62121759A (ja) ポリフエニレンオキサイド系樹脂組成物およびこの樹脂組成物からなるシ−ト
JPS62148564A (ja) ポリフエニレンオキサイド樹脂組成物
JPS6329598A (ja) フレキシブル回路板の実装方法
JPH07247416A (ja) 難燃性を有するポリフェニレンエーテル樹脂組成物
JPH0562589B2 (zh)
JPH0734497B2 (ja) 高周波用積層板の製造方法
JPS62148565A (ja) ポリフエニレンオキサイド樹脂組成物
JPH08208778A (ja) 新規な難燃性強靱化ポリフェニレンエーテル系樹脂組成物
JP2000226509A (ja) 熱硬化性樹脂組成物及び積層板
JPH01215851A (ja) 難燃化ポリフェニレンオキサイド系樹脂組成物とその金属張積層板
JPH04239018A (ja) 新規な硬化性ポリフェニレンエーテル・エポキシ樹脂組成物並びにこれを用いた複合材料および積層体
JPH0734498B2 (ja) 高周波用積層板の製造方法
JPH07247415A (ja) 難燃化硬化性ポリフェニレンエーテル樹脂組成物
JPH03166255A (ja) 難燃化ポリフェニレンオキサイド系樹脂組成物

Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term