JPH0562477B2 - - Google Patents
Info
- Publication number
- JPH0562477B2 JPH0562477B2 JP17729283A JP17729283A JPH0562477B2 JP H0562477 B2 JPH0562477 B2 JP H0562477B2 JP 17729283 A JP17729283 A JP 17729283A JP 17729283 A JP17729283 A JP 17729283A JP H0562477 B2 JPH0562477 B2 JP H0562477B2
- Authority
- JP
- Japan
- Prior art keywords
- chip
- board
- circuit
- substrate
- mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000758 substrate Substances 0.000 claims description 19
- 238000000034 method Methods 0.000 claims description 12
- 238000007789 sealing Methods 0.000 claims 2
- 239000004020 conductor Substances 0.000 description 5
- 239000011521 glass Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 229920002678 cellulose Polymers 0.000 description 1
- 239000001913 cellulose Substances 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000000123 paper Substances 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000012209 synthetic fiber Substances 0.000 description 1
- 229920002994 synthetic fiber Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17729283A JPS6068691A (ja) | 1983-09-26 | 1983-09-26 | チップ−オン−ボ−ド実装基板における電気的部品又は素子のリフロ−方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17729283A JPS6068691A (ja) | 1983-09-26 | 1983-09-26 | チップ−オン−ボ−ド実装基板における電気的部品又は素子のリフロ−方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6068691A JPS6068691A (ja) | 1985-04-19 |
| JPH0562477B2 true JPH0562477B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1993-09-08 |
Family
ID=16028467
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17729283A Granted JPS6068691A (ja) | 1983-09-26 | 1983-09-26 | チップ−オン−ボ−ド実装基板における電気的部品又は素子のリフロ−方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6068691A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1989007779A1 (fr) * | 1988-02-16 | 1989-08-24 | Fujitsu Limited | Procede de fixation d'elements optiques cylindriques et d'elements electriques |
| JP5314269B2 (ja) * | 2007-11-27 | 2013-10-16 | パナソニック株式会社 | 実装方法およびダイボンド装置 |
-
1983
- 1983-09-26 JP JP17729283A patent/JPS6068691A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6068691A (ja) | 1985-04-19 |
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