JPH055655Y2 - - Google Patents
Info
- Publication number
- JPH055655Y2 JPH055655Y2 JP1988066702U JP6670288U JPH055655Y2 JP H055655 Y2 JPH055655 Y2 JP H055655Y2 JP 1988066702 U JP1988066702 U JP 1988066702U JP 6670288 U JP6670288 U JP 6670288U JP H055655 Y2 JPH055655 Y2 JP H055655Y2
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- hole
- terminal
- conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229910000679 solder Inorganic materials 0.000 claims description 14
- 230000037431 insertion Effects 0.000 description 10
- 238000003780 insertion Methods 0.000 description 10
- 238000005516 engineering process Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Multi-Conductor Connections (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1988066702U JPH055655Y2 (xx) | 1988-05-20 | 1988-05-20 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1988066702U JPH055655Y2 (xx) | 1988-05-20 | 1988-05-20 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH01170961U JPH01170961U (xx) | 1989-12-04 |
JPH055655Y2 true JPH055655Y2 (xx) | 1993-02-15 |
Family
ID=31292098
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1988066702U Expired - Lifetime JPH055655Y2 (xx) | 1988-05-20 | 1988-05-20 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH055655Y2 (xx) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007060445A (ja) * | 2005-08-26 | 2007-03-08 | Hosiden Corp | 電気音響変換器の端子取り付け方法と構造並びに電気音響変換器 |
JP5711542B2 (ja) * | 2011-01-13 | 2015-05-07 | 矢崎総業株式会社 | 基板接続用端子および回路基板の保持構造 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01170961A (ja) * | 1987-12-25 | 1989-07-06 | Matsushita Graphic Commun Syst Inc | 光プリンタ |
-
1988
- 1988-05-20 JP JP1988066702U patent/JPH055655Y2/ja not_active Expired - Lifetime
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01170961A (ja) * | 1987-12-25 | 1989-07-06 | Matsushita Graphic Commun Syst Inc | 光プリンタ |
Also Published As
Publication number | Publication date |
---|---|
JPH01170961U (xx) | 1989-12-04 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CA1238114A (en) | Chip carrier mounting apparatus | |
JPH0686265U (ja) | 電子部品およびその実装構造 | |
JPH055655Y2 (xx) | ||
JPH11288751A (ja) | プリント配線基板への端子の取付構造 | |
JPH05226803A (ja) | 実装回路基板 | |
JPH0615416Y2 (ja) | チツプ型ソケツト | |
JPH0349415Y2 (xx) | ||
JP2560143Y2 (ja) | Fpc接続用コネクタ | |
JPH0244468Y2 (xx) | ||
JP2502578Y2 (ja) | 電力用半導体モジュ―ル | |
JPH0447905Y2 (xx) | ||
JP2589315Y2 (ja) | 基板実装コネクタ | |
JPH0711485Y2 (ja) | チップ部品の接続固定装置 | |
JPS6039201U (ja) | タ−ミナルの固定装置 | |
JP2603084Y2 (ja) | コネクタ | |
JP2594365B2 (ja) | 配線基板及び配線基板の接続方法 | |
JPH0236266Y2 (xx) | ||
JP2913359B2 (ja) | Pcカード用コネクタ | |
JPH0412665Y2 (xx) | ||
JPH0726803Y2 (ja) | ネットワーク抵抗器 | |
JPH0343727Y2 (xx) | ||
JPH0316089Y2 (xx) | ||
JPH03129681A (ja) | 表面実装用電子部品 | |
JPS5827518Y2 (ja) | 圧接形コネクタ | |
JPH03134972A (ja) | 表面実装用電子部品 |