JPH0555579B2 - - Google Patents

Info

Publication number
JPH0555579B2
JPH0555579B2 JP61120790A JP12079086A JPH0555579B2 JP H0555579 B2 JPH0555579 B2 JP H0555579B2 JP 61120790 A JP61120790 A JP 61120790A JP 12079086 A JP12079086 A JP 12079086A JP H0555579 B2 JPH0555579 B2 JP H0555579B2
Authority
JP
Japan
Prior art keywords
wire
bonding
gold
barium
weight
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP61120790A
Other languages
English (en)
Japanese (ja)
Other versions
JPS62278241A (ja
Inventor
Eiichi Asada
Kazuo Yokoyama
Masahiro Yada
Kenichi Hirano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shoei Chemical Inc
Original Assignee
Shoei Chemical Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shoei Chemical Inc filed Critical Shoei Chemical Inc
Priority to JP61120790A priority Critical patent/JPS62278241A/ja
Priority to US07/074,421 priority patent/US4752442A/en
Priority to FR878710843A priority patent/FR2618945B1/fr
Publication of JPS62278241A publication Critical patent/JPS62278241A/ja
Publication of JPH0555579B2 publication Critical patent/JPH0555579B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C5/00—Alloys based on noble metals
    • C22C5/02—Alloys based on gold
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12431—Foil or filament smaller than 6 mils
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12528—Semiconductor component

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Wire Bonding (AREA)
  • Conductive Materials (AREA)
JP61120790A 1986-05-26 1986-05-26 ボンデイングワイヤ Granted JPS62278241A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP61120790A JPS62278241A (ja) 1986-05-26 1986-05-26 ボンデイングワイヤ
US07/074,421 US4752442A (en) 1986-05-26 1987-07-16 Bonding wire
FR878710843A FR2618945B1 (fr) 1986-05-26 1987-07-30 Fil de liaison destine a etre utilise dans un dispositif semi-conducteur

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61120790A JPS62278241A (ja) 1986-05-26 1986-05-26 ボンデイングワイヤ

Publications (2)

Publication Number Publication Date
JPS62278241A JPS62278241A (ja) 1987-12-03
JPH0555579B2 true JPH0555579B2 (enExample) 1993-08-17

Family

ID=14795062

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61120790A Granted JPS62278241A (ja) 1986-05-26 1986-05-26 ボンデイングワイヤ

Country Status (3)

Country Link
US (1) US4752442A (enExample)
JP (1) JPS62278241A (enExample)
FR (1) FR2618945B1 (enExample)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4993622A (en) * 1987-04-28 1991-02-19 Texas Instruments Incorporated Semiconductor integrated circuit chip interconnections and methods
KR920010119B1 (ko) * 1989-04-28 1992-11-16 다나카 덴시 고오교오 가부시기가이샤 반도체 소자의 본딩(bonding)용 금선
US5246707A (en) * 1990-04-26 1993-09-21 Haynes Duncan H Sustained release delivery of water-soluble bio-molecules and drugs using phospholipid-coated microcrystals, microdroplets and high-concentration liposomes
US5091188A (en) * 1990-04-26 1992-02-25 Haynes Duncan H Phospholipid-coated microcrystals: injectable formulations of water-insoluble drugs
US5364706A (en) * 1990-07-20 1994-11-15 Tanaka Denshi Kogyo Kabushiki Kaisha Clad bonding wire for semiconductor device
DE19544641B4 (de) * 1994-12-05 2005-08-25 Eads Deutschland Gmbh Solarzellen-Verbinder für Raumfahrt-Solargeneratoren
US7255877B2 (en) 1996-08-22 2007-08-14 Jagotec Ag Fenofibrate microparticles
JP3126926B2 (ja) * 1996-09-09 2001-01-22 新日本製鐵株式会社 半導体素子用金合金細線および半導体装置
ES2201673T3 (es) * 1998-02-11 2004-03-16 Rtp Pharma Corporation Combinacion de esteroides y acidos grasos poiinsaturados para el tratamiento de estados inflamatorios.
US5993735A (en) * 1998-05-29 1999-11-30 Kang; Do-Won Gold-based alloy for bonding wire of semiconductor device
US6610930B1 (en) * 1998-09-16 2003-08-26 Kulicke & Soffa Investments, Inc. Composite noble metal wire
US6933468B2 (en) 2000-10-10 2005-08-23 Hobart Brothers Company Aluminum metal-core weld wire and method for forming the same
JP4195495B1 (ja) * 2007-11-06 2008-12-10 田中電子工業株式会社 ボールボンディング用金合金線
US8387238B2 (en) * 2009-06-14 2013-03-05 Jayna Sheats Processes and structures for IC fabrication

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5282183A (en) * 1975-12-29 1977-07-09 Nec Corp Connecting wires for semiconductor devices
DE2733493C2 (de) * 1976-05-17 1986-11-13 Henkel KGaA, 4000 Düsseldorf Glättemittel für Textilfasermaterial
JPS53105968A (en) * 1977-02-26 1978-09-14 Tanaka Electronics Ind Gold wire for bonding semiconductor
JPS53112060A (en) * 1977-03-11 1978-09-30 Tanaka Electronics Ind Gold wire for bonding semiconductor
DE2803949A1 (de) * 1978-01-30 1979-08-02 Int Gold Corp Ltd Feinkoernige goldlegierungen
US4330329A (en) * 1979-11-28 1982-05-18 Tanaka Denshi Kogyo Kabushiki Kaisha Gold bonding wire for semiconductor elements and the semiconductor element
JPS56122140A (en) * 1980-02-29 1981-09-25 Tanaka Denshi Kogyo Kk Gold wire for bonding semiconductor element and semiconductor element
JPS5734659A (en) * 1980-08-07 1982-02-25 Hitachi Maxell Ltd Manufacture of granular positive mixture
JPS5826662A (ja) * 1981-08-11 1983-02-17 Toyota Motor Corp 車両用アンチスキツド装置の故障時制御方法
GB2116208B (en) * 1981-12-04 1985-12-04 Mitsubishi Metal Corp Fine gold alloy wire for bonding of a semiconductor device
JPS6222448A (ja) * 1985-07-22 1987-01-30 Nippon Kogaku Kk <Nikon> Ｉｃの形成されたウエ−ハ

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
CONSTITUTION OF BINARY ALLOYS HANSEN MCGRAW-HILL BOOK COMPANY INC=1958 *

Also Published As

Publication number Publication date
JPS62278241A (ja) 1987-12-03
US4752442A (en) 1988-06-21
FR2618945B1 (fr) 1989-12-15
FR2618945A1 (fr) 1989-02-03

Similar Documents

Publication Publication Date Title
JPH0555579B2 (enExample)
JPS6360105B2 (enExample)
JPH0379416B2 (enExample)
KR19990045637A (ko) 금합금으로된 미세와이어, 이것의 제조방법 및 이용
JPH0530891B2 (enExample)
JPH0713273B2 (ja) 半導体素子用ボンディング線およびその製造方法
JPS5826662B2 (ja) 半導体素子のボンデイング用金線
US4775512A (en) Gold line for bonding semiconductor element
JPS6030158A (ja) ボンデイングワイヤ−
JPS6222451B2 (enExample)
KR910009479B1 (ko) 본딩 와이어
JPH0131691B2 (enExample)
JPS6222448B2 (enExample)
JPH084099B2 (ja) 耐食性に優れた半導体素子用銅ボンディング線
JP2689773B2 (ja) ボンデイングワイヤー
JPS61110735A (ja) 耐熱性に優れた金合金
JP2005294681A (ja) 半導体素子用ボンディングワイヤおよびその製造方法
JP2661247B2 (ja) 半導体素子ボンディング用金合金細線
JPS6322062B2 (enExample)
JPS6160841A (ja) ボンデイングワイヤ−
JPH02250934A (ja) 半導体素子ボンディング用Ａｕ合金極細線
JPH08958B2 (ja) 半導体素子のボンディング用仕上熱処理銅線の製造方法
JP2706539B2 (ja) ボンディングワイヤー
JP2728216B2 (ja) 半導体素子のボンディング用金線
JPS62127436A (ja) 半導体素子用ボンディング線

Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees