JPH0555401A - プリント配線基板 - Google Patents
プリント配線基板Info
- Publication number
- JPH0555401A JPH0555401A JP3074134A JP7413491A JPH0555401A JP H0555401 A JPH0555401 A JP H0555401A JP 3074134 A JP3074134 A JP 3074134A JP 7413491 A JP7413491 A JP 7413491A JP H0555401 A JPH0555401 A JP H0555401A
- Authority
- JP
- Japan
- Prior art keywords
- recess
- plating layer
- hole
- printed wiring
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007747 plating Methods 0.000 claims abstract description 54
- 239000011347 resin Substances 0.000 claims abstract description 30
- 229920005989 resin Polymers 0.000 claims abstract description 30
- 239000000758 substrate Substances 0.000 claims abstract description 28
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims abstract description 19
- 229910052737 gold Inorganic materials 0.000 claims abstract description 19
- 239000010931 gold Substances 0.000 claims abstract description 19
- 238000000034 method Methods 0.000 abstract description 16
- 239000004020 conductor Substances 0.000 description 15
- 239000000835 fiber Substances 0.000 description 10
- 230000017525 heat dissipation Effects 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 239000006023 eutectic alloy Substances 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000003365 glass fiber Substances 0.000 description 2
- 230000008595 infiltration Effects 0.000 description 2
- 238000001764 infiltration Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 229910015363 Au—Sn Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- DZCLVBQEPZQZNN-UHFFFAOYSA-N copper;phenol Chemical compound [Cu].OC1=CC=CC=C1 DZCLVBQEPZQZNN-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- JVPLOXQKFGYFMN-UHFFFAOYSA-N gold tin Chemical compound [Sn].[Au] JVPLOXQKFGYFMN-UHFFFAOYSA-N 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
Landscapes
- Structure Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3074134A JPH0555401A (ja) | 1982-10-12 | 1991-03-13 | プリント配線基板 |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57178663A JPS5967686A (ja) | 1982-10-12 | 1982-10-12 | プリント配線基板とその製造方法 |
| JP3074134A JPH0555401A (ja) | 1982-10-12 | 1991-03-13 | プリント配線基板 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57178663A Division JPS5967686A (ja) | 1982-10-12 | 1982-10-12 | プリント配線基板とその製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0555401A true JPH0555401A (ja) | 1993-03-05 |
| JPH0563941B2 JPH0563941B2 (enrdf_load_stackoverflow) | 1993-09-13 |
Family
ID=26415269
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3074134A Granted JPH0555401A (ja) | 1982-10-12 | 1991-03-13 | プリント配線基板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0555401A (enrdf_load_stackoverflow) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7098571B2 (en) | 2000-02-03 | 2006-08-29 | Calient Networks, Inc. | Electrostatic actuator for microelectromechanical systems and methods of fabrication |
| JP2007096187A (ja) * | 2005-09-30 | 2007-04-12 | Sanyo Electric Co Ltd | 回路基板および回路基板の製造方法 |
| US7728339B1 (en) | 2002-05-03 | 2010-06-01 | Calient Networks, Inc. | Boundary isolation for microelectromechanical devices |
| US7737368B2 (en) | 2005-09-30 | 2010-06-15 | Sanyo Electric Co., Ltd. | Circuit board and method of manufacturing circuit board |
-
1991
- 1991-03-13 JP JP3074134A patent/JPH0555401A/ja active Granted
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7098571B2 (en) | 2000-02-03 | 2006-08-29 | Calient Networks, Inc. | Electrostatic actuator for microelectromechanical systems and methods of fabrication |
| US7261826B2 (en) | 2000-02-03 | 2007-08-28 | Calient Networks, Inc. | Electrostatic actuator for microelectromechanical systems and methods of fabrication |
| US7728339B1 (en) | 2002-05-03 | 2010-06-01 | Calient Networks, Inc. | Boundary isolation for microelectromechanical devices |
| JP2007096187A (ja) * | 2005-09-30 | 2007-04-12 | Sanyo Electric Co Ltd | 回路基板および回路基板の製造方法 |
| US7737368B2 (en) | 2005-09-30 | 2010-06-15 | Sanyo Electric Co., Ltd. | Circuit board and method of manufacturing circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0563941B2 (enrdf_load_stackoverflow) | 1993-09-13 |
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