JPH0553834B2 - - Google Patents
Info
- Publication number
- JPH0553834B2 JPH0553834B2 JP58070835A JP7083583A JPH0553834B2 JP H0553834 B2 JPH0553834 B2 JP H0553834B2 JP 58070835 A JP58070835 A JP 58070835A JP 7083583 A JP7083583 A JP 7083583A JP H0553834 B2 JPH0553834 B2 JP H0553834B2
- Authority
- JP
- Japan
- Prior art keywords
- formula
- group
- mol
- residue
- groups
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/303—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups H01B3/38 or H01B3/302
- H01B3/306—Polyimides or polyesterimides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/308—Wires with resins
Landscapes
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Non-Silver Salt Photosensitive Materials And Non-Silver Salt Photography (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CH2414/82-1 | 1982-04-21 | ||
| CH241482 | 1982-04-21 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58191747A JPS58191747A (ja) | 1983-11-09 |
| JPH0553834B2 true JPH0553834B2 (OSRAM) | 1993-08-11 |
Family
ID=4233241
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7083583A Granted JPS58191747A (ja) | 1982-04-21 | 1983-04-21 | 放射線感受性塗布剤 |
Country Status (4)
| Country | Link |
|---|---|
| EP (1) | EP0092524B1 (OSRAM) |
| JP (1) | JPS58191747A (OSRAM) |
| CA (1) | CA1244579A (OSRAM) |
| DE (1) | DE3372983D1 (OSRAM) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8389975B2 (en) | 2007-09-27 | 2013-03-05 | Showa Denko K.K. | Group III nitride semiconductor light-emitting device |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0162017B1 (de) * | 1984-05-17 | 1991-08-21 | Ciba-Geigy Ag | Homo- und Copolymere, Verfahren zu deren Vernetzung und derenVerwendung |
| JPS61275352A (ja) * | 1985-05-31 | 1986-12-05 | Japan Synthetic Rubber Co Ltd | 可溶性ポリイミド溶液 |
| US4786569A (en) * | 1985-09-04 | 1988-11-22 | Ciba-Geigy Corporation | Adhesively bonded photostructurable polyimide film |
| US4927736A (en) * | 1987-07-21 | 1990-05-22 | Hoechst Celanese Corporation | Hydroxy polyimides and high temperature positive photoresists therefrom |
| US5102959A (en) * | 1987-12-15 | 1992-04-07 | Ciba-Geigy Corporation | Auto-photocrosslinkable copolyimides and polyimide compositions |
| US4925912A (en) * | 1987-12-15 | 1990-05-15 | Ciba-Geigy Corporation | Auto-photocrosslinkable copolyimides and polyimide compositions |
| JP2575815B2 (ja) * | 1988-06-14 | 1997-01-29 | 東芝ケミカル株式会社 | プリント回路板の製造方法 |
| US7648815B2 (en) * | 2000-09-12 | 2010-01-19 | Pi R&D Co., Ltd. | Negative photosensitive polyimide composition and method for forming image the same |
| JP4603215B2 (ja) * | 2001-09-06 | 2010-12-22 | 三井化学株式会社 | ネガ型感光性樹脂組成物およびその用途 |
| US7955782B2 (en) | 2008-09-22 | 2011-06-07 | Honeywell International Inc. | Bottom antireflective coatings exhibiting enhanced wet strip rates, bottom antireflective coating compositions for forming bottom antireflective coatings, and methods for fabricating the same |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3856752A (en) * | 1973-10-01 | 1974-12-24 | Ciba Geigy Corp | Soluble polyimides derived from phenylindane diamines and dianhydrides |
| JPS5946380B2 (ja) * | 1977-04-13 | 1984-11-12 | 株式会社日立製作所 | 画像の形成方法 |
| AU534941B2 (en) * | 1979-05-11 | 1984-02-23 | Minnesota Mining And Manufacturing Company | Curing polyamic acid |
| JPS5624344A (en) * | 1979-08-06 | 1981-03-07 | Hitachi Ltd | Photosensitive heat-resistant polymer composition |
| JPS57168942A (en) * | 1981-04-13 | 1982-10-18 | Hitachi Ltd | Photosensitive polymer composition |
-
1983
- 1983-04-15 DE DE8383810156T patent/DE3372983D1/de not_active Expired
- 1983-04-15 EP EP19830810156 patent/EP0092524B1/de not_active Expired
- 1983-04-19 CA CA000426131A patent/CA1244579A/en not_active Expired
- 1983-04-21 JP JP7083583A patent/JPS58191747A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8389975B2 (en) | 2007-09-27 | 2013-03-05 | Showa Denko K.K. | Group III nitride semiconductor light-emitting device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58191747A (ja) | 1983-11-09 |
| EP0092524A2 (de) | 1983-10-26 |
| EP0092524B1 (de) | 1987-08-12 |
| EP0092524A3 (en) | 1985-05-29 |
| CA1244579A (en) | 1988-11-08 |
| DE3372983D1 (en) | 1987-09-17 |
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