JPH0553067B2 - - Google Patents
Info
- Publication number
- JPH0553067B2 JPH0553067B2 JP18090285A JP18090285A JPH0553067B2 JP H0553067 B2 JPH0553067 B2 JP H0553067B2 JP 18090285 A JP18090285 A JP 18090285A JP 18090285 A JP18090285 A JP 18090285A JP H0553067 B2 JPH0553067 B2 JP H0553067B2
- Authority
- JP
- Japan
- Prior art keywords
- pin
- wiring pattern
- substrate
- film substrate
- grid array
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000758 substrate Substances 0.000 claims description 56
- 229910052751 metal Inorganic materials 0.000 claims description 20
- 239000002184 metal Substances 0.000 claims description 20
- 239000002985 plastic film Substances 0.000 claims description 11
- 229920006255 plastic film Polymers 0.000 claims description 11
- 238000007789 sealing Methods 0.000 claims description 10
- 229920005989 resin Polymers 0.000 claims description 7
- 239000011347 resin Substances 0.000 claims description 7
- 238000003780 insertion Methods 0.000 claims description 6
- 230000037431 insertion Effects 0.000 claims description 6
- 230000000149 penetrating effect Effects 0.000 claims description 2
- 238000007747 plating Methods 0.000 description 12
- 238000000034 method Methods 0.000 description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 9
- 229910052802 copper Inorganic materials 0.000 description 6
- 239000010949 copper Substances 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 238000000465 moulding Methods 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 3
- 238000005538 encapsulation Methods 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 229920006015 heat resistant resin Polymers 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 238000003491 array Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000009719 polyimide resin Substances 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 229920000265 Polyparaphenylene Polymers 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- -1 polyphenylene Polymers 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18090285A JPS6240754A (ja) | 1985-08-16 | 1985-08-16 | ピングリッドアレイ |
| EP86108770A EP0218796B1 (de) | 1985-08-16 | 1986-06-27 | Halbleiteranordnung mit Packung vom Steckerstifttyp |
| DE8686108770T DE3675321D1 (de) | 1985-08-16 | 1986-06-27 | Halbleiteranordnung mit packung vom steckerstifttyp. |
| US06/880,832 US4823234A (en) | 1985-08-16 | 1986-07-01 | Semiconductor device and its manufacture |
| KR1019860006161A KR870002647A (ko) | 1985-08-16 | 1986-07-28 | 반도체장치 및 그 제조방법 |
| CN198686105249A CN86105249A (zh) | 1985-08-16 | 1986-08-16 | 半导体器件及其制造 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18090285A JPS6240754A (ja) | 1985-08-16 | 1985-08-16 | ピングリッドアレイ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6240754A JPS6240754A (ja) | 1987-02-21 |
| JPH0553067B2 true JPH0553067B2 (de) | 1993-08-09 |
Family
ID=16091304
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18090285A Granted JPS6240754A (ja) | 1985-08-16 | 1985-08-16 | ピングリッドアレイ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6240754A (de) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0787221B2 (ja) * | 1987-02-27 | 1995-09-20 | イビデン株式会社 | 半導体搭載用基板 |
| JPH05183019A (ja) * | 1991-12-27 | 1993-07-23 | Hitachi Ltd | 半導体装置およびその製造方法 |
| JP4860443B2 (ja) * | 2006-11-20 | 2012-01-25 | パナソニック株式会社 | 蛍光ランプ |
-
1985
- 1985-08-16 JP JP18090285A patent/JPS6240754A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6240754A (ja) | 1987-02-21 |
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