JPH0551662B2 - - Google Patents
Info
- Publication number
- JPH0551662B2 JPH0551662B2 JP61262045A JP26204586A JPH0551662B2 JP H0551662 B2 JPH0551662 B2 JP H0551662B2 JP 61262045 A JP61262045 A JP 61262045A JP 26204586 A JP26204586 A JP 26204586A JP H0551662 B2 JPH0551662 B2 JP H0551662B2
- Authority
- JP
- Japan
- Prior art keywords
- target
- magnetic
- sputtering
- phase
- ferromagnetic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP61262045A JPS63118067A (ja) | 1986-11-05 | 1986-11-05 | スパツタリングタ−ゲツト |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP61262045A JPS63118067A (ja) | 1986-11-05 | 1986-11-05 | スパツタリングタ−ゲツト |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS63118067A JPS63118067A (ja) | 1988-05-23 |
JPH0551662B2 true JPH0551662B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1993-08-03 |
Family
ID=17370263
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP61262045A Granted JPS63118067A (ja) | 1986-11-05 | 1986-11-05 | スパツタリングタ−ゲツト |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS63118067A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4941920A (en) * | 1987-11-25 | 1990-07-17 | Hitachi Metals, Ltd. | Sintered target member and method of producing same |
EP0888464B1 (de) * | 1996-03-19 | 2002-10-02 | Unaxis Balzers Aktiengesellschaft | Target, magnetronquelle mit einem solchen und verfahren zur herstellung eines solchen targets |
KR100600973B1 (ko) | 2001-12-19 | 2006-07-13 | 닛코킨조쿠 가부시키가이샤 | 자성체 타겟트와 배킹 플레이트와의 접합방법 및 자성체 타겟트와 배킹 플레이트와의 조립체 |
JP4708121B2 (ja) * | 2005-08-22 | 2011-06-22 | 昭和電工株式会社 | 磁性薄膜作成用ターゲット、磁気記録媒体およびその製造方法、磁気記録再生装置 |
JP2009221608A (ja) * | 2009-07-07 | 2009-10-01 | Mitsui Mining & Smelting Co Ltd | スパッタリングターゲット |
CN112941473B (zh) * | 2021-01-28 | 2022-06-17 | 宁波江丰电子材料股份有限公司 | 一种MoTiNi合金靶材及其制备方法 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4094761A (en) * | 1977-07-25 | 1978-06-13 | Motorola, Inc. | Magnetion sputtering of ferromagnetic material |
-
1986
- 1986-11-05 JP JP61262045A patent/JPS63118067A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS63118067A (ja) | 1988-05-23 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
LAPS | Cancellation because of no payment of annual fees |