JPH0551192B2 - - Google Patents

Info

Publication number
JPH0551192B2
JPH0551192B2 JP61220235A JP22023586A JPH0551192B2 JP H0551192 B2 JPH0551192 B2 JP H0551192B2 JP 61220235 A JP61220235 A JP 61220235A JP 22023586 A JP22023586 A JP 22023586A JP H0551192 B2 JPH0551192 B2 JP H0551192B2
Authority
JP
Japan
Prior art keywords
led
frame
laser diode
photodiode
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP61220235A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6373678A (ja
Inventor
Masahide Yamauchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP61220235A priority Critical patent/JPS6373678A/ja
Publication of JPS6373678A publication Critical patent/JPS6373678A/ja
Publication of JPH0551192B2 publication Critical patent/JPH0551192B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)
  • Led Device Packages (AREA)
  • Semiconductor Lasers (AREA)
JP61220235A 1986-09-17 1986-09-17 半導体装置 Granted JPS6373678A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61220235A JPS6373678A (ja) 1986-09-17 1986-09-17 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61220235A JPS6373678A (ja) 1986-09-17 1986-09-17 半導体装置

Publications (2)

Publication Number Publication Date
JPS6373678A JPS6373678A (ja) 1988-04-04
JPH0551192B2 true JPH0551192B2 (enrdf_load_stackoverflow) 1993-07-30

Family

ID=16748006

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61220235A Granted JPS6373678A (ja) 1986-09-17 1986-09-17 半導体装置

Country Status (1)

Country Link
JP (1) JPS6373678A (enrdf_load_stackoverflow)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0366472B1 (en) * 1988-10-28 1994-01-19 Matsushita Electric Industrial Co., Ltd. Semiconductor laser apparatus
JPH02125688A (ja) * 1988-11-04 1990-05-14 Sony Corp 半導体レーザ装置
JPH02125687A (ja) * 1988-11-04 1990-05-14 Sony Corp 半導体レーザ装置
JPH0523563U (ja) * 1991-07-17 1993-03-26 ソニー株式会社 半導体レーザ装置
DE60002367T2 (de) * 1999-01-13 2004-02-19 Sharp K.K. Fotokoppler

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5827952U (ja) * 1981-08-18 1983-02-23 株式会社東芝 光結合半導体装置
JPS59119774A (ja) * 1982-12-25 1984-07-11 Toshiba Corp 光結合半導体装置

Also Published As

Publication number Publication date
JPS6373678A (ja) 1988-04-04

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term