JPH0546978B2 - - Google Patents

Info

Publication number
JPH0546978B2
JPH0546978B2 JP61275912A JP27591286A JPH0546978B2 JP H0546978 B2 JPH0546978 B2 JP H0546978B2 JP 61275912 A JP61275912 A JP 61275912A JP 27591286 A JP27591286 A JP 27591286A JP H0546978 B2 JPH0546978 B2 JP H0546978B2
Authority
JP
Japan
Prior art keywords
semiconductor device
aluminum
manufacturing
steam
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP61275912A
Other languages
English (en)
Japanese (ja)
Other versions
JPS63128634A (ja
Inventor
Eiji Hagimoto
Seiichi Nishino
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP61275912A priority Critical patent/JPS63128634A/ja
Publication of JPS63128634A publication Critical patent/JPS63128634A/ja
Publication of JPH0546978B2 publication Critical patent/JPH0546978B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/90—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45147—Copper (Cu) as principal constituent
    • H10W72/015—
    • H10W72/01515—
    • H10W72/075—
    • H10W72/07532—
    • H10W72/07533—
    • H10W72/07551—
    • H10W72/50—
    • H10W72/5363—
    • H10W72/5522—
    • H10W72/5524—
    • H10W72/5525—
    • H10W72/59—
    • H10W72/952—
    • H10W72/983—

Landscapes

  • Wire Bonding (AREA)
JP61275912A 1986-11-18 1986-11-18 半導体装置の製造方法 Granted JPS63128634A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61275912A JPS63128634A (ja) 1986-11-18 1986-11-18 半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61275912A JPS63128634A (ja) 1986-11-18 1986-11-18 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPS63128634A JPS63128634A (ja) 1988-06-01
JPH0546978B2 true JPH0546978B2 (cg-RX-API-DMAC10.html) 1993-07-15

Family

ID=17562157

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61275912A Granted JPS63128634A (ja) 1986-11-18 1986-11-18 半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JPS63128634A (cg-RX-API-DMAC10.html)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW426980B (en) * 1999-01-23 2001-03-21 Lucent Technologies Inc Wire bonding to copper
JPWO2010147187A1 (ja) 2009-06-18 2012-12-06 ローム株式会社 半導体装置
US20120032354A1 (en) * 2010-08-06 2012-02-09 National Semiconductor Corporation Wirebonding method and device enabling high-speed reverse wedge bonding of wire bonds
JP6579653B2 (ja) * 2015-06-24 2019-09-25 ローム株式会社 半導体装置および半導体装置の製造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56116634A (en) * 1980-02-20 1981-09-12 Hitachi Ltd Semiconductor device
JPS56162844A (en) * 1980-05-19 1981-12-15 Hitachi Ltd Semiconductor device and manufacture thereof
JPS59150460A (ja) * 1983-01-31 1984-08-28 Toshiba Corp 半導体装置の製造方法

Also Published As

Publication number Publication date
JPS63128634A (ja) 1988-06-01

Similar Documents

Publication Publication Date Title
US3585461A (en) High reliability semiconductive devices and integrated circuits
CN87107402A (zh) 半导体器件
US7030496B2 (en) Semiconductor device having aluminum and metal electrodes and method for manufacturing the same
JPS62145758A (ja) パラジウムを用いる銅製ボンデイングパツドの酸化防止法
JPH0546978B2 (cg-RX-API-DMAC10.html)
JPS6050343B2 (ja) 半導体装置製造用リ−ドフレ−ム
JPS6156608B2 (cg-RX-API-DMAC10.html)
US4609936A (en) Semiconductor chip with direct-bonded external leadframe
JP3590603B2 (ja) 半導体装置およびその製造方法
JPS6035552A (ja) 半導体装置
JPS59139661A (ja) 半導体装置
JPS615562A (ja) 半導体装置
JPH0533823B2 (cg-RX-API-DMAC10.html)
JPH01318236A (ja) 半導体装置
JP2527630Y2 (ja) 半導体装置
JPS63272042A (ja) 半導体装置
JPH08288447A (ja) リードフレーム
JPS58192337A (ja) 半導体装置
JPH0478173B2 (cg-RX-API-DMAC10.html)
JPH05102346A (ja) 樹脂封止半導体装置
JPH07135203A (ja) 半導体装置
JPH04158557A (ja) 樹脂封止型半導体装置とその製造方法
JPS63107031A (ja) 半導体装置
JPS5833848A (ja) 半導体装置
JPS61144847A (ja) 半導体装置およびその製造法

Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees