JPH0543485Y2 - - Google Patents

Info

Publication number
JPH0543485Y2
JPH0543485Y2 JP1987059805U JP5980587U JPH0543485Y2 JP H0543485 Y2 JPH0543485 Y2 JP H0543485Y2 JP 1987059805 U JP1987059805 U JP 1987059805U JP 5980587 U JP5980587 U JP 5980587U JP H0543485 Y2 JPH0543485 Y2 JP H0543485Y2
Authority
JP
Japan
Prior art keywords
wiring board
flip chip
bumps
conductor
flip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1987059805U
Other languages
English (en)
Japanese (ja)
Other versions
JPS63165855U (enExample
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987059805U priority Critical patent/JPH0543485Y2/ja
Publication of JPS63165855U publication Critical patent/JPS63165855U/ja
Application granted granted Critical
Publication of JPH0543485Y2 publication Critical patent/JPH0543485Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/241—Dispositions, e.g. layouts
    • H10W72/247—Dispositions of multiple bumps
    • H10W72/248—Top-view layouts, e.g. mirror arrays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/701—Tape-automated bond [TAB] connectors

Landscapes

  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP1987059805U 1987-04-20 1987-04-20 Expired - Lifetime JPH0543485Y2 (enExample)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987059805U JPH0543485Y2 (enExample) 1987-04-20 1987-04-20

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987059805U JPH0543485Y2 (enExample) 1987-04-20 1987-04-20

Publications (2)

Publication Number Publication Date
JPS63165855U JPS63165855U (enExample) 1988-10-28
JPH0543485Y2 true JPH0543485Y2 (enExample) 1993-11-02

Family

ID=30891644

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987059805U Expired - Lifetime JPH0543485Y2 (enExample) 1987-04-20 1987-04-20

Country Status (1)

Country Link
JP (1) JPH0543485Y2 (enExample)

Also Published As

Publication number Publication date
JPS63165855U (enExample) 1988-10-28

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