JPH0543483Y2 - - Google Patents
Info
- Publication number
- JPH0543483Y2 JPH0543483Y2 JP1987155793U JP15579387U JPH0543483Y2 JP H0543483 Y2 JPH0543483 Y2 JP H0543483Y2 JP 1987155793 U JP1987155793 U JP 1987155793U JP 15579387 U JP15579387 U JP 15579387U JP H0543483 Y2 JPH0543483 Y2 JP H0543483Y2
- Authority
- JP
- Japan
- Prior art keywords
- heat
- tool
- heat dissipation
- attached
- generating component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 230000017525 heat dissipation Effects 0.000 claims description 21
- 239000000463 material Substances 0.000 claims description 6
- 230000037431 insertion Effects 0.000 claims description 4
- 238000003780 insertion Methods 0.000 claims description 4
- 230000020169 heat generation Effects 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 238000009434 installation Methods 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229920002379 silicone rubber Polymers 0.000 description 2
- 239000004945 silicone rubber Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987155793U JPH0543483Y2 (fr) | 1987-10-12 | 1987-10-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987155793U JPH0543483Y2 (fr) | 1987-10-12 | 1987-10-12 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0160545U JPH0160545U (fr) | 1989-04-17 |
| JPH0543483Y2 true JPH0543483Y2 (fr) | 1993-11-02 |
Family
ID=31433735
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987155793U Expired - Lifetime JPH0543483Y2 (fr) | 1987-10-12 | 1987-10-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0543483Y2 (fr) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10123460B2 (en) | 2015-11-13 | 2018-11-06 | Covidien LLP | System and method for thermal management of electronic devices |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6079757A (ja) * | 1983-10-06 | 1985-05-07 | Hitachi Cable Ltd | セラミツク基板パツケ−ジ |
| JPS60241239A (ja) * | 1984-05-16 | 1985-11-30 | Hitachi Ltd | 半導体装置 |
-
1987
- 1987-10-12 JP JP1987155793U patent/JPH0543483Y2/ja not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6079757A (ja) * | 1983-10-06 | 1985-05-07 | Hitachi Cable Ltd | セラミツク基板パツケ−ジ |
| JPS60241239A (ja) * | 1984-05-16 | 1985-11-30 | Hitachi Ltd | 半導体装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0160545U (fr) | 1989-04-17 |
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