JPH0543477Y2 - - Google Patents
Info
- Publication number
- JPH0543477Y2 JPH0543477Y2 JP1987131195U JP13119587U JPH0543477Y2 JP H0543477 Y2 JPH0543477 Y2 JP H0543477Y2 JP 1987131195 U JP1987131195 U JP 1987131195U JP 13119587 U JP13119587 U JP 13119587U JP H0543477 Y2 JPH0543477 Y2 JP H0543477Y2
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- lead
- semiconductor chip
- base portion
- lead frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Wire Bonding (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987131195U JPH0543477Y2 (enExample) | 1987-08-28 | 1987-08-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987131195U JPH0543477Y2 (enExample) | 1987-08-28 | 1987-08-28 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6435744U JPS6435744U (enExample) | 1989-03-03 |
| JPH0543477Y2 true JPH0543477Y2 (enExample) | 1993-11-02 |
Family
ID=31387034
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987131195U Expired - Lifetime JPH0543477Y2 (enExample) | 1987-08-28 | 1987-08-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0543477Y2 (enExample) |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5396969U (enExample) * | 1978-01-10 | 1978-08-07 |
-
1987
- 1987-08-28 JP JP1987131195U patent/JPH0543477Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6435744U (enExample) | 1989-03-03 |
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