JPH0438526Y2 - - Google Patents
Info
- Publication number
- JPH0438526Y2 JPH0438526Y2 JP1987092072U JP9207287U JPH0438526Y2 JP H0438526 Y2 JPH0438526 Y2 JP H0438526Y2 JP 1987092072 U JP1987092072 U JP 1987092072U JP 9207287 U JP9207287 U JP 9207287U JP H0438526 Y2 JPH0438526 Y2 JP H0438526Y2
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- lead
- leads
- tab
- width
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/01—Manufacture or treatment
- H10W72/0198—Manufacture or treatment batch processes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987092072U JPH0438526Y2 (enExample) | 1987-06-17 | 1987-06-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987092072U JPH0438526Y2 (enExample) | 1987-06-17 | 1987-06-17 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63201348U JPS63201348U (enExample) | 1988-12-26 |
| JPH0438526Y2 true JPH0438526Y2 (enExample) | 1992-09-09 |
Family
ID=30953439
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987092072U Expired JPH0438526Y2 (enExample) | 1987-06-17 | 1987-06-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0438526Y2 (enExample) |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6081850A (ja) * | 1983-10-11 | 1985-05-09 | Nec Kansai Ltd | 半導体装置の製造方法 |
-
1987
- 1987-06-17 JP JP1987092072U patent/JPH0438526Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63201348U (enExample) | 1988-12-26 |
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