JPH0537492Y2 - - Google Patents
Info
- Publication number
- JPH0537492Y2 JPH0537492Y2 JP18967885U JP18967885U JPH0537492Y2 JP H0537492 Y2 JPH0537492 Y2 JP H0537492Y2 JP 18967885 U JP18967885 U JP 18967885U JP 18967885 U JP18967885 U JP 18967885U JP H0537492 Y2 JPH0537492 Y2 JP H0537492Y2
- Authority
- JP
- Japan
- Prior art keywords
- conductive filler
- conductive
- layer
- powder
- insulating substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000011231 conductive filler Substances 0.000 claims description 22
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical group [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 17
- 239000004020 conductor Substances 0.000 claims description 16
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 15
- 239000000758 substrate Substances 0.000 claims description 12
- 229910052802 copper Inorganic materials 0.000 claims 1
- 239000010949 copper Substances 0.000 claims 1
- 239000000843 powder Substances 0.000 claims 1
- 239000010410 layer Substances 0.000 description 12
- 229910052709 silver Inorganic materials 0.000 description 5
- 239000004332 silver Substances 0.000 description 5
- 239000011230 binding agent Substances 0.000 description 4
- 230000005012 migration Effects 0.000 description 4
- 238000013508 migration Methods 0.000 description 4
- 238000009413 insulation Methods 0.000 description 3
- 239000002344 surface layer Substances 0.000 description 3
- 239000000654 additive Substances 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000002518 antifoaming agent Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000009499 grossing Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Non-Insulated Conductors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18967885U JPH0537492Y2 (enrdf_load_html_response) | 1985-12-11 | 1985-12-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18967885U JPH0537492Y2 (enrdf_load_html_response) | 1985-12-11 | 1985-12-11 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6298253U JPS6298253U (enrdf_load_html_response) | 1987-06-23 |
| JPH0537492Y2 true JPH0537492Y2 (enrdf_load_html_response) | 1993-09-22 |
Family
ID=31142198
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18967885U Expired - Lifetime JPH0537492Y2 (enrdf_load_html_response) | 1985-12-11 | 1985-12-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0537492Y2 (enrdf_load_html_response) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2756075B2 (ja) * | 1993-08-06 | 1998-05-25 | 三菱電機株式会社 | 金属ベース基板およびそれを用いた電子機器 |
-
1985
- 1985-12-11 JP JP18967885U patent/JPH0537492Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6298253U (enrdf_load_html_response) | 1987-06-23 |
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