JPH0537492Y2 - - Google Patents
Info
- Publication number
- JPH0537492Y2 JPH0537492Y2 JP18967885U JP18967885U JPH0537492Y2 JP H0537492 Y2 JPH0537492 Y2 JP H0537492Y2 JP 18967885 U JP18967885 U JP 18967885U JP 18967885 U JP18967885 U JP 18967885U JP H0537492 Y2 JPH0537492 Y2 JP H0537492Y2
- Authority
- JP
- Japan
- Prior art keywords
- conductive filler
- conductive
- layer
- powder
- insulating substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000011231 conductive filler Substances 0.000 claims description 22
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical group [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 17
- 239000004020 conductor Substances 0.000 claims description 16
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 15
- 239000000758 substrate Substances 0.000 claims description 12
- 229910052802 copper Inorganic materials 0.000 claims 1
- 239000010949 copper Substances 0.000 claims 1
- 239000000843 powder Substances 0.000 claims 1
- 239000010410 layer Substances 0.000 description 12
- 229910052709 silver Inorganic materials 0.000 description 5
- 239000004332 silver Substances 0.000 description 5
- 239000011230 binding agent Substances 0.000 description 4
- 230000005012 migration Effects 0.000 description 4
- 238000013508 migration Methods 0.000 description 4
- 238000009413 insulation Methods 0.000 description 3
- 239000002344 surface layer Substances 0.000 description 3
- 239000000654 additive Substances 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000002518 antifoaming agent Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000009499 grossing Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Non-Insulated Conductors (AREA)
Description
【考案の詳細な説明】
〔技術分野〕
本考案は、導電インクで回路導体を印刷した印
刷回路板に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to a printed circuit board having circuit conductors printed with conductive ink.
従来、絶縁基板上に導電インクで回路導体を印
刷してなる印刷回路板は公知である。これに使用
される導電インクは、導電フイラー、バインダ
ー、添加剤および溶剤などを混合したもので、印
刷時は液状またはペースト状であるが、印刷後は
固化して回路導体となる。導電フイラーとして
は、銀粉、銅粉、金粉あるいはアルミ粉などが知
られているが、通常は導電性が良好なことから銀
粉が用いられている。バインダーは導電フイラー
を連結するポリマーで、熱硬化性樹脂または熱可
塑性樹脂が用いられる。添加剤としては回路導体
の品質を維持する上で必要おなる消泡剤、平滑
剤、フイラー分散剤などが使用される。溶剤はバ
インダーを溶かすもので、導電インクの粘性を調
整するのに使用される。
2. Description of the Related Art Printed circuit boards are conventionally known in which circuit conductors are printed on an insulating substrate using conductive ink. The conductive ink used for this is a mixture of conductive fillers, binders, additives, and solvents, and is in liquid or paste form during printing, but solidifies after printing to become a circuit conductor. Silver powder, copper powder, gold powder, aluminum powder, and the like are known as conductive fillers, but silver powder is usually used because of its good conductivity. The binder is a polymer that connects the conductive filler, and a thermosetting resin or thermoplastic resin is used as the binder. As additives, antifoaming agents, smoothing agents, filler dispersants, etc., which are necessary to maintain the quality of circuit conductors, are used. The solvent dissolves the binder and is used to adjust the viscosity of the conductive ink.
ところで、銀粉を含み導電インクで回路導体を
印刷した印刷回路板には次のような問題がある。
まず電子部品の実装が出来ないことである。その
理由は、印刷された回路導体に電子部品を半田付
けすると、回路導体中の銀が半田中に拡散するい
わゆる“銀食われ”が起きて、半田付け不良が生
じるからである。このため、この種の印刷回路板
は通常、電子部品を実装しないものにだけ使用さ
れているのが実情である。次はマイグレーシヨン
の問題である。これは、導電インク中の銀が絶縁
基板の樹脂中に移行し、絶縁性が低下して、耐圧
不良、絶縁抵抗不良が発生するということであ
る。 However, printed circuit boards on which circuit conductors are printed using conductive ink containing silver powder have the following problems.
First, it is not possible to mount electronic components. The reason for this is that when electronic components are soldered to the printed circuit conductors, the silver in the circuit conductors diffuses into the solder, a phenomenon known as "silver eating," causing soldering defects. For this reason, in reality, this type of printed circuit board is usually only used for those that do not mount electronic components. Next is the issue of migration. This means that the silver in the conductive ink migrates into the resin of the insulating substrate, reducing the insulation properties and causing poor voltage resistance and insulation resistance.
本考案は、上記のような従来技術の問題点を解
決するため、絶縁基板上に導電フイラーを含む導
電インクで回路導体を印刷してなる印刷回路板に
おいて、上記回路導体を三層構造とし、絶縁基板
側の層と表面側の層は導電フイラーを銀粉とし、
その間の中間は導電フイラーを銀粉としたことを
特徴とするものである。
In order to solve the problems of the prior art as described above, the present invention provides a printed circuit board in which a circuit conductor is printed on an insulating substrate with a conductive ink containing a conductive filler, in which the circuit conductor has a three-layer structure, The layer on the insulating substrate side and the layer on the surface side use conductive filler as silver powder.
The one in between is characterized by using silver powder as the conductive filler.
銅粉を導電フイラーとする導電インクは導電性
が低いという難点があるが、銀食われやマイグレ
ーシヨンの問題はない。そこで導電インクによる
回路導体は三層構造とし、絶縁基板側の層は導電
フイラーを銅粉として絶縁基板へのマイグレーシ
ヨンをなくし、その上の中間層は導電フイラーを
銀粉として導電性を確保し、表面層は導電フイラ
ーを銅粉として半田による銀食われを防止したも
のである。 Conductive ink that uses copper powder as a conductive filler has the disadvantage of low conductivity, but there are no problems with silver corrosion or migration. Therefore, the circuit conductor made of conductive ink has a three-layer structure, and the layer on the insulating substrate side uses conductive filler as copper powder to prevent migration to the insulating substrate, and the intermediate layer above it uses conductive filler as silver powder to ensure conductivity. The surface layer is made of copper powder as a conductive filler to prevent silver corrosion by solder.
第１図は本考案の一実施例に係る印刷回路板の
断面を示している。この印刷回路板は、絶縁基板
１上に、銅粉を導電フイラーとする導電インク２
と、銀粉を導電フイラーとする導電インク３と、
銅粉を導電フイラーとする導電インク２とを重ね
刷りして、三層構造の回路導体４を形成したもの
である。
FIG. 1 shows a cross section of a printed circuit board according to an embodiment of the present invention. This printed circuit board has a conductive ink 2 containing copper powder as a conductive filler on an insulating substrate 1.
and a conductive ink 3 using silver powder as a conductive filler.
A circuit conductor 4 having a three-layer structure is formed by overprinting a conductive ink 2 using copper powder as a conductive filler.
このほか、導電フイラーとして銀粉および銅粉
を含む導電インクを適当な離型性の素材（紙な
ど）に印刷し、比重差で銅粉を表層に銀粉を下層
に集めた後、これを絶縁基板に転写し、さらにそ
の上に銅粉を熱転写することによつても、三層構
造の回路導体を形成することができる。 In addition, conductive ink containing silver powder and copper powder as a conductive filler is printed on a material with suitable release properties (such as paper), and the difference in specific gravity collects the copper powder on the surface layer and the silver powder on the bottom layer. A circuit conductor having a three-layer structure can also be formed by transferring the copper powder to a copper powder and then thermally transferring copper powder thereon.
以上説明したように本考案によれば、導電イン
クにより形成された回路導体が三層構造となつて
おり、絶縁基板側の層は導電フイラーが銅粉であ
るため、絶縁基板へのマイグレーシヨンの問題が
なく、絶縁性を良好に保つことができ、またその
上の中間層は導電フイラーが銀粉であるため、良
好な導電性を得ることができ、さらに表面側の層
は導電フイラーが銅粉であるため、半田付けが可
能であり、従つて電子部品を実装することができ
るという利点がある。
As explained above, according to the present invention, the circuit conductor formed with conductive ink has a three-layer structure, and the conductive filler in the layer on the insulating substrate side is copper powder, so migration to the insulating substrate is prevented. There are no problems and good insulation can be maintained, and since the conductive filler in the middle layer is made of silver powder, good conductivity can be obtained, and the conductive filler in the surface layer is made of copper powder. Therefore, there is an advantage that soldering is possible and therefore electronic components can be mounted.
第１図は本考案の一実施例に係る印刷回路板の
要部の断面図である。
１……絶縁基板、２……銅粉を導電フイラーと
する導電インク、３……銀粉を導電フイラーとす
る導電インク、４……回路導体。
FIG. 1 is a sectional view of essential parts of a printed circuit board according to an embodiment of the present invention. 1... Insulating substrate, 2... Conductive ink using copper powder as a conductive filler, 3... Conductive ink using silver powder as conductive filler, 4... Circuit conductor.
Claims (1)
回路導体を印刷してなる印刷回路板において、上
記回路導体は三層構造となつており、絶縁基板側
の層と表面側の層は導電フイラーが銅粉であり、
その間の中間層は導電フイラーが銀粉であること
を特徴とする印刷回路板。 In a printed circuit board in which a circuit conductor is printed on an insulating substrate using conductive ink containing a conductive filler, the circuit conductor has a three-layer structure, and the conductive filler is copper in the layer on the insulating substrate side and the layer on the surface side. It is a powder,
The intermediate layer therebetween is a printed circuit board characterized in that the conductive filler is silver powder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18967885U JPH0537492Y2 (en) | 1985-12-11 | 1985-12-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18967885U JPH0537492Y2 (en) | 1985-12-11 | 1985-12-11 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6298253U JPS6298253U (en) | 1987-06-23 |
| JPH0537492Y2 true JPH0537492Y2 (en) | 1993-09-22 |
Family
ID=31142198
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18967885U Expired - Lifetime JPH0537492Y2 (en) | 1985-12-11 | 1985-12-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0537492Y2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2756075B2 (en) * | 1993-08-06 | 1998-05-25 | 三菱電機株式会社 | Metal base substrate and electronic device using the same |
-
1985
- 1985-12-11 JP JP18967885U patent/JPH0537492Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6298253U (en) | 1987-06-23 |
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