JPS5939962U - double-sided printed wiring board - Google Patents
double-sided printed wiring boardInfo
- Publication number
- JPS5939962U JPS5939962U JP13644282U JP13644282U JPS5939962U JP S5939962 U JPS5939962 U JP S5939962U JP 13644282 U JP13644282 U JP 13644282U JP 13644282 U JP13644282 U JP 13644282U JP S5939962 U JPS5939962 U JP S5939962U
- Authority
- JP
- Japan
- Prior art keywords
- double
- wiring board
- printed wiring
- sided printed
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図は従来例に係わり、イは両面印刷配線基板の構成
例を示す斜視図、口、ハ、二は半田付実施状態を説明す
るための断面図、第2図イは本考案の第1の実施例を示
す斜視図、第2図用ま第1の実施例の半田付は状態を説
明するための断面図、第3図イは本考案第2の実施例を
示す斜視図、第3図口は第2の実施例の半田付は状態を
説明するための断面図、第4図は本考案の他の実施例を
説明するための断面図である。
1.11・・・・・・絶縁基板、2. 3. 12.
13・・・・・・導電層、4・・・・・・導電体、5・
・・・・・半田、6・・・・・・溶融半田、7・・・・
・・半田レジ−スト膜、8・・・・・・気泡、9・・・
・・・半田槽、14・・・・・・塗料、21.22・・
・・・・抵抗体電極、23・・・・・・抵抗体。Fig. 1 relates to a conventional example, A is a perspective view showing an example of the structure of a double-sided printed wiring board, C, C and 2 are cross-sectional views for explaining the soldering implementation state, and Fig. 2 A is a diagram showing the configuration of a double-sided printed circuit board. 2 is a sectional view for explaining the soldering state of the first embodiment, and FIG. 3A is a perspective view showing the second embodiment of the present invention. 3 is a cross-sectional view for explaining the soldering state of the second embodiment, and FIG. 4 is a cross-sectional view for explaining another embodiment of the present invention. 1.11...Insulating substrate, 2. 3. 12.
13... Conductive layer, 4... Conductor, 5.
...Solder, 6...Melted solder, 7...
...Solder resist film, 8...Bubble, 9...
...Solder tank, 14...Paint, 21.22...
...Resistor electrode, 23...Resistor.
Claims (1)
記穴をとりまくようにそれぞれ導体層を設け、少なくと
も一方の導体層に、穴の縁に接してかつ半田の付着しな
い領域を設けたことを特徴とする両面印刷配線基板。゛ A conductor layer is provided on both sides of an insulating substrate having a through hole so as to surround the hole, and at least one of the conductor layers is provided with an area in contact with the edge of the hole and to which no solder adheres. Double-sided printed wiring board.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13644282U JPS5939962U (en) | 1982-09-08 | 1982-09-08 | double-sided printed wiring board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13644282U JPS5939962U (en) | 1982-09-08 | 1982-09-08 | double-sided printed wiring board |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5939962U true JPS5939962U (en) | 1984-03-14 |
Family
ID=30306790
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13644282U Pending JPS5939962U (en) | 1982-09-08 | 1982-09-08 | double-sided printed wiring board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5939962U (en) |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5324450B2 (en) * | 1976-09-20 | 1978-07-20 |
-
1982
- 1982-09-08 JP JP13644282U patent/JPS5939962U/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5324450B2 (en) * | 1976-09-20 | 1978-07-20 |
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