JPH053740B2 - - Google Patents
Info
- Publication number
- JPH053740B2 JPH053740B2 JP10980786A JP10980786A JPH053740B2 JP H053740 B2 JPH053740 B2 JP H053740B2 JP 10980786 A JP10980786 A JP 10980786A JP 10980786 A JP10980786 A JP 10980786A JP H053740 B2 JPH053740 B2 JP H053740B2
- Authority
- JP
- Japan
- Prior art keywords
- lead
- power supply
- aging
- lead frame
- thin film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000010408 film Substances 0.000 claims description 9
- 239000002184 metal Substances 0.000 claims description 9
- 229910052751 metal Inorganic materials 0.000 claims description 9
- 239000010409 thin film Substances 0.000 claims description 9
- 238000000034 method Methods 0.000 claims description 8
- 239000004065 semiconductor Substances 0.000 description 19
- 230000032683 aging Effects 0.000 description 18
- 238000005259 measurement Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000002955 isolation Methods 0.000 description 2
- 230000007257 malfunction Effects 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 238000012216 screening Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Wire Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10980786A JPS62265731A (ja) | 1986-05-13 | 1986-05-13 | リ−ドフレ−ム |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10980786A JPS62265731A (ja) | 1986-05-13 | 1986-05-13 | リ−ドフレ−ム |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62265731A JPS62265731A (ja) | 1987-11-18 |
| JPH053740B2 true JPH053740B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1993-01-18 |
Family
ID=14519702
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10980786A Granted JPS62265731A (ja) | 1986-05-13 | 1986-05-13 | リ−ドフレ−ム |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62265731A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02135793A (ja) * | 1988-11-16 | 1990-05-24 | Ibiden Co Ltd | 厚膜素子を有するフィルムキャリアの製造方法 |
| US5239191A (en) * | 1990-01-19 | 1993-08-24 | Kabushiki Kaisha Toshiba | Semiconductor wafer |
-
1986
- 1986-05-13 JP JP10980786A patent/JPS62265731A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62265731A (ja) | 1987-11-18 |