JPH0536841U - Electronic parts storage package - Google Patents

Abstract

(57) [Summary] [PROBLEMS] To provide a package for storing electronic parts, which has good noise shielding and can operate normally and stably the electronic parts inside. [Structure] A semiconductor element housing package 1 comprises a base 2 having a recess 2b for housing a semiconductor element 4, and a lid 3 for closing the recess 2b of the base 2. The lid 3 is covered with a metallization layer 11 on the entire main surface 3b on the side facing the base 2, and the metallization metal layer 11 is further provided.
An insulating layer 12 is applied to the central part of the substrate and a solder layer 13 is applied to the outer peripheral part thereof.

Description

[Detailed description of the device]

[0001]

[Industrial application]

 The present invention relates to an electronic component storage package that stores electronic components.

[0002]

[Prior art and its problems]

 A conventional electronic component storage package includes a base made of an electrically insulating material such as alumina ceramics in which a recess for storing electronic components is formed and an electrically insulating material such as alumina ceramics. And a lid for closing. The electrodes of the electronic component housed in the concave portion of the base body are connected to, for example, the metallized wiring layer provided on the base body via bonding wires. The electrodes of the electronic component are connected to the external wiring by connecting the metallized wiring layer of the substrate to the external wiring.

As an electronic component stored in the electronic component storage package, noise from the outside may be a problem, or noise may be generated from the electronic component and adversely affect other devices. In such a case, the lid that hermetically seals the package is also required to have a shielding function against noise. However, the conventional lid body made of alumina ceramics used conventionally has a low noise shielding effect. For this reason, a plate made of Kovar alloy or 42 alloy plated with nickel or gold may be used as the main body of the lid.

However, although these metal lids have a good noise shielding effect, the bonding wires connecting the electronic components housed inside the package and the metallized wiring layer provided on the base body come into contact with each other, and There is a drawback that the electrodes of the parts are short-circuited and the electronic parts cannot operate normally. In particular, in recent years, the package for storing electronic components has rapidly become thinner, and the distance between the lid and the bonding wire has become shorter and shorter, and the risk of short circuit is extremely high.

An object of the present invention is to provide a lid for an electronic component storage package that can shield noise well and can prevent a short circuit with an electronic component in the package.

[0006]

[Means for Solving the Problems]

 The package for storing electronic components according to the present invention comprises a base body having a recess for storing electronic components, and a lid for closing the recess of the base body. A metal layer is applied to the entire main surface of the lid facing the base, and the metal layer is applied with an insulating layer in the center and a solder layer on the outer periphery. .

[0007]

[Action]

 In the electronic component storing package according to the present invention, the lid is fixed to the base by the solder layer so as to close the concave portion of the base. In the lid fixed to the base body, the metal layer formed on the entire main surface of the lid body shields noise. The insulating layer formed at the center of the metal layer prevents short circuit with the electronic component.

[0008]

【Example】

 FIG. 1 shows a semiconductor device housing package 1 to which an embodiment of the present invention is applied. The semiconductor element housing package 1 mainly includes a base body 2 and a lid body 3. The base body 2 is a substantially rectangular plate-shaped member, and is made of alumina ceramic, which is an electrically insulating material. A recess 2b is formed in the center of the upper surface 2a of the base 2. The semiconductor element 4 is fixed in the recess 2b by an adhesive layer 5. A plurality of upper surface metallization layers 6a and side surface metallization layers 6b made of tungsten, molybdenum or the like are formed on the upper surface 2a and the side surfaces 2c of the base 2. Inside the base body 2, an inner metallized wiring layer 7a and an exposed metallized wiring layer 7b made of tungsten, molyden or the like are formed. The exposed metallized wiring layer 7b is electrically connected to the side surface metallized layer 6b on the outer peripheral side of the base 2, and is exposed in the recess 2b on the central side of the base 2. An electrode of the semiconductor element 4 is electrically connected to the exposed metallized wiring layer 7b via a bonding wire 8. A plurality of lead terminals 10 are fixed to the plurality of side surface metallized layers 6b via silver brazing layers 9, respectively.

The lid 3 placed on the base body 2 is composed of a lid body 3 a, a metallization layer 11, an insulating layer 12, and a solder layer 13. The lid body 3a is a substantially rectangular flat plate-like member, and, like the base body 2, is made of an alumina ceramic which is an electrically insulating material. A metallized layer 11 made of tungsten is formed over the entire main surface 3b (lower surface in FIG. 1) of the lid body 3a. The surface of the metallized layer 11 is nickel-plated (not shown). An insulating layer 12 made of polyimide is formed in the central portion of the surface of the metallized layer 11. A solder layer 13 is formed on the outer peripheral portion of the surface of the metallized layer 11 (that is, a portion where the insulating layer 12 is not formed). By joining the solder layer 13 to the upper surface metallization layer 6a formed on the upper surface 2a of the base 2, the lid 3 is fixed to the base 2 and hermetically seals the inside of the package.

In this semiconductor element storage package 1, since the metallized layer 11 is formed on the entire main surface 3b of the lid body 3a, the noise shielding effect of the semiconductor element storage package 1 is improved. There is. Furthermore, since the insulating layer 12 formed in the central portion of the metallized layer 11 covers the metallized layer 11 so as not to be exposed in the package, the lid 3 and the bonding wire 8 are formed as the package becomes thinner. Even if and come into close contact with each other, a short circuit between the lid 3 and the bonding wire 8 does not occur.

Next, the manufacturing process will be described. The manufacturing method of the base body 2 is the same as the conventional one, and is therefore omitted here. When manufacturing the lid body 3, as shown in FIG. 2, a ceramic molded body 3c for the lid body 3a is formed by press molding from a powdered material of alumina ceramic. As shown in FIG. 3, a metal paste 11a for the metallized layer 11 made of tungsten is applied to the entire main surface 3b of the ceramic green body 3c. Then, the ceramic green body 3c is fired. Further, the baked lid body 3a is immersed in a nickel plating bath, and a nickel plating layer (not shown) is formed on the entire surface of the metallized layer 11 by electrolytic plating.

Next, a polyimide solution is applied to the central portion of the metallized layer 11 and heated to form the insulating layer 12 (FIG. 4). Further, the solder 13a for the solder layer 13 is arranged on the outer peripheral portion of the metallized layer 11 where the insulating layer 12 is not formed, and the lid 3 is completed as shown in FIG. When fixing the lid body 3 to the base body 2, as shown in FIG. 6, the main surface 3b on the side where the metallized layer 11 is formed is placed downward, and the solder 13a is placed on the upper surface 2a of the base body 2. To do so. When the solder 13a is melted in this state, the lid body 3 is fixed to the base body 2 and the inside of the package is hermetically sealed. When the solder 13a is melted, the insulating layer 12 is formed in the central portion of the metallized layer 11, so that the solder 13a is melted but does not protrude to the central portion side.

The semiconductor element housing package 1 described above can be manufactured at low cost because the lid body 3a is made of inexpensive aluminum ceramic. [Other Examples] (a) Although polyimide is used for the insulating layer 12 in the above examples, glass or other heat-resistant resin may be used, for example. Alternatively, alumina ceramics may be used. In this case, an alumina paste is applied to the central portion of the metallized layer 11 and then fired together with the ceramic green sheet 3c that will be the lid body. (B) In the above-described embodiment, the metallized layer 11 has a structure in which tungsten is plated with nickel, but a molybdenum-manganese alloy may be plated with nickel. In this case, first, the ceramic green body 3c is fired to form the lid body 3a, and then the lid body 3a is coated with a metal paste made of molybdenum-manganese alloy powder and baked at a high temperature for metallization. The layer 11 is applied and finally the entire surface of the metallization layer 11 is nickel plated. (C) Although tungsten is used as the metallized layer 11 in the above-mentioned embodiment, it may be formed using a silver-palladium alloy, copper, or the like. In this case, first, the ceramic green body 3c is fired to form the lid body 3a, and then the lid body 3a is coated with a metal paste made of silver-palladium powder or the like. By baking this at a high temperature, the metallized layer 11 is attached to the lid body 3a. (D) In the above embodiment, the semiconductor element storage package is used. However, the present invention may be applied to a package that internally stores another type of electronic component such as a crystal oscillator or a SAW filter.

[0014]

[Effect of the device]

 An electronic component storage package according to the present invention comprises a base having a recess for storing electronic components and a lid for closing the recess of the base, and a metal is formed on the entire main surface of the side facing the lid and the base. A layer is deposited, an insulating layer is further deposited on the central portion of the metal layer, and a solder layer is deposited on the outer peripheral portion. Therefore, the noise shielding effect of the electronic component storage package is greatly improved by the metal layer applied to the lid. In addition, it is effective that the insulating layer attached to the central part of the metal layer is effective in that, for example, the bonding wire connected to the electronic component housed inside the package comes into contact with the metal layer attached to the lid to cause a short circuit. Have been blocked. As a result, it becomes possible to normally operate the electronic components housed inside.

[Brief description of drawings]

FIG. 1 is a vertical cross-sectional view of a semiconductor device housing package according to an embodiment of the present invention.

FIG. 2 is a vertical cross-sectional view showing a step in the manufacturing process of the lid body.

FIG. 3 is a vertical cross-sectional view showing one process thereof.

FIG. 4 is a vertical cross-sectional view showing one process thereof.

FIG. 5 is a vertical sectional view showing the process.

FIG. 6 is a vertical cross-sectional view showing a step in the manufacturing process of the semiconductor element storage package.

[Explanation of symbols]

 1 Package for Semiconductor Element Storage 2 Base 2b Recess 3 Lid 3a Lid Main Body 3b Main Surface 11 Metallization Layer 12 Insulation Layer 13 Solder Layer

Claims (1)

[Scope of utility model registration request] 1. An electronic component storage package comprising a base body having a recess for accommodating an electronic component and a lid for closing the recess of the base, wherein the lid is a main body facing the base. A package for storing electronic components, characterized in that a metal layer is deposited on the entire surface, an insulating layer is deposited on the central portion of the metal layer, and a solder layer is deposited on the outer peripheral portion.