JPH05291730A - プリント回路板製造法 - Google Patents

プリント回路板製造法

Info

Publication number
JPH05291730A
JPH05291730A JP4051915A JP5191592A JPH05291730A JP H05291730 A JPH05291730 A JP H05291730A JP 4051915 A JP4051915 A JP 4051915A JP 5191592 A JP5191592 A JP 5191592A JP H05291730 A JPH05291730 A JP H05291730A
Authority
JP
Japan
Prior art keywords
printed circuit
circuit board
thickness
manufacturing
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4051915A
Other languages
English (en)
Japanese (ja)
Inventor
Kickelhain Joerg
イェルク・キケルハイン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
LPKF Laser and Electronics AG
Original Assignee
LPKF CAD CAM Systeme GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by LPKF CAD CAM Systeme GmbH filed Critical LPKF CAD CAM Systeme GmbH
Priority to JP4051915A priority Critical patent/JPH05291730A/ja
Publication of JPH05291730A publication Critical patent/JPH05291730A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/027—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed by irradiation, e.g. by photons, alpha or beta particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0369—Etching selective parts of a metal substrate through part of its thickness, e.g. using etch resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
JP4051915A 1991-02-08 1992-03-10 プリント回路板製造法 Pending JPH05291730A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4051915A JPH05291730A (ja) 1991-02-08 1992-03-10 プリント回路板製造法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19914103834 DE4103834A1 (de) 1991-02-08 1991-02-08 Verfahren zur herstellung von leiterplatten
JP4051915A JPH05291730A (ja) 1991-02-08 1992-03-10 プリント回路板製造法

Publications (1)

Publication Number Publication Date
JPH05291730A true JPH05291730A (ja) 1993-11-05

Family

ID=6424646

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4051915A Pending JPH05291730A (ja) 1991-02-08 1992-03-10 プリント回路板製造法

Country Status (2)

Country Link
JP (1) JPH05291730A (de)
DE (1) DE4103834A1 (de)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003023230A (ja) * 2001-07-05 2003-01-24 Ricoh Microelectronics Co Ltd 基板製造方法
US6822332B2 (en) 2002-09-23 2004-11-23 International Business Machines Corporation Fine line circuitization
JP2008016507A (ja) * 2006-07-03 2008-01-24 Toshiba Tec Corp 電気配線の製造方法
CN103353709A (zh) * 2013-08-01 2013-10-16 北京弘浩千瑞科技有限公司 一种用于印刷线路板生产的掩膜光刻机
JP2020136638A (ja) * 2019-02-26 2020-08-31 三菱マテリアル株式会社 絶縁回路基板の製造方法

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE69431647D1 (de) * 1993-04-14 2002-12-12 Hitachi Construction Machinery Metallfolienverarbeitungsverfahren und leiterrahmenverarbeitungsverfahren und halbleiteranordnungherstellungsverfahren
DE4417245A1 (de) * 1994-04-23 1995-10-26 Lpkf Cad Cam Systeme Gmbh Verfahren zur strukturierten Metallisierung der Oberfläche von Substraten
EP0727925A1 (de) * 1995-02-14 1996-08-21 Lpkf Cad/Cam Systeme Gmbh Verfahren zur strukturierten Metallisierung der Oberfläche von Substraten
KR100353311B1 (ko) * 1996-09-30 2002-09-18 지멘스 에스. 아. 전기적으로 절연된 지지물 상에 적어도 2개의 배선레벨을 형성하는 방법
DE19913367C1 (de) * 1999-03-24 2000-12-14 Siemens Ag Verfahren zur Herstellung einer elektrischen Schaltung
DE102006010942B4 (de) * 2006-03-09 2017-02-09 Leonhard Kurz Gmbh & Co. Kg Verfahren zur Herstellung mindestens einer elektrisch leitenden Struktur sowie elektrisch leitende Struktur
WO2012148332A1 (en) * 2011-04-29 2012-11-01 Telefonaktiebolaget L M Ericsson (Publ) Manufacturing method for printed circuit boards
CN102974937B (zh) * 2012-11-12 2015-04-15 中国科学院半导体研究所 基于超声定位的激光加工装置及加工方法
CN103203541B (zh) * 2013-02-04 2015-05-13 张立国 一种激光加工装置
DE102016103047A1 (de) * 2016-02-22 2017-08-24 Itz Innovations- Und Technologiezentrum Gmbh Herstellungsverfahren für eine Leuchtenkomponente und mit dem Verfahren hergestellte Leuchtenkomponente

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3113855A1 (de) * 1981-04-06 1982-10-21 Fritz Wittig Herstellung gedruckter Schaltungen, 8000 München Verfahren zur herstellung von leiterplatten
NO894656L (no) * 1989-02-07 1990-08-08 Autodisplay As Fremgangsmaate for fremstilling av et elektrodemoenster paa et substrat.
US4909895A (en) * 1989-04-11 1990-03-20 Pacific Bell System and method for providing a conductive circuit pattern utilizing thermal oxidation

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003023230A (ja) * 2001-07-05 2003-01-24 Ricoh Microelectronics Co Ltd 基板製造方法
JP4759172B2 (ja) * 2001-07-05 2011-08-31 リコーマイクロエレクトロニクス株式会社 基板製造方法
US6822332B2 (en) 2002-09-23 2004-11-23 International Business Machines Corporation Fine line circuitization
US7185428B2 (en) 2002-09-23 2007-03-06 International Business Machines Corporation Method of making a circuitized substrate
US7325299B2 (en) 2002-09-23 2008-02-05 International Business Machines Corporation Method of making a circuitized substrate
US7596862B2 (en) 2002-09-23 2009-10-06 International Business Machines Corporation Method of making a circuitized substrate
JP2008016507A (ja) * 2006-07-03 2008-01-24 Toshiba Tec Corp 電気配線の製造方法
CN103353709A (zh) * 2013-08-01 2013-10-16 北京弘浩千瑞科技有限公司 一种用于印刷线路板生产的掩膜光刻机
JP2020136638A (ja) * 2019-02-26 2020-08-31 三菱マテリアル株式会社 絶縁回路基板の製造方法

Also Published As

Publication number Publication date
DE4103834C2 (de) 1992-11-12
DE4103834A1 (de) 1992-08-13

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