JPH0528786Y2 - - Google Patents
Info
- Publication number
- JPH0528786Y2 JPH0528786Y2 JP1987143469U JP14346987U JPH0528786Y2 JP H0528786 Y2 JPH0528786 Y2 JP H0528786Y2 JP 1987143469 U JP1987143469 U JP 1987143469U JP 14346987 U JP14346987 U JP 14346987U JP H0528786 Y2 JPH0528786 Y2 JP H0528786Y2
- Authority
- JP
- Japan
- Prior art keywords
- solder land
- flexible
- resin
- circuit
- conductive composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987143469U JPH0528786Y2 (enEXAMPLES) | 1987-09-19 | 1987-09-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987143469U JPH0528786Y2 (enEXAMPLES) | 1987-09-19 | 1987-09-19 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6448066U JPS6448066U (enEXAMPLES) | 1989-03-24 |
| JPH0528786Y2 true JPH0528786Y2 (enEXAMPLES) | 1993-07-23 |
Family
ID=31410323
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987143469U Expired - Lifetime JPH0528786Y2 (enEXAMPLES) | 1987-09-19 | 1987-09-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0528786Y2 (enEXAMPLES) |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58132995A (ja) * | 1982-02-03 | 1983-08-08 | 千住金属工業株式会社 | 導電ペ−ストのはんだ付け方法 |
| JPH0316294Y2 (enEXAMPLES) * | 1985-03-07 | 1991-04-08 |
-
1987
- 1987-09-19 JP JP1987143469U patent/JPH0528786Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6448066U (enEXAMPLES) | 1989-03-24 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR960036869A (ko) | 회로 기판 | |
| JPS594873B2 (ja) | 印刷配線板 | |
| US5972246A (en) | Electro-conductive composition and electronic equipment using same | |
| US5100695A (en) | Method of manufacturing a printed circuit board | |
| US7448016B2 (en) | Pad layouts of a printed circuit board | |
| JPH0528786Y2 (enEXAMPLES) | ||
| KR920003823A (ko) | 직접 회로를 회로보오드에 접속하는 방법 및 회로 보오드 어셈블리 | |
| JP2551123Y2 (ja) | フレキシブル回路板 | |
| JPH057072A (ja) | プリント配線板 | |
| US5219607A (en) | Method of manufacturing printed circuit board | |
| DE4012061A1 (de) | Loesungsmittelfreie isotrope leit- und klebepaste mit eingelagerten elektrisch leitfaehigen partikeln | |
| CN216960325U (zh) | 一种pcb板连接结构 | |
| US4762732A (en) | Process for forming silver conductors on a substrate | |
| JPH044386Y2 (enEXAMPLES) | ||
| JPH0316294Y2 (enEXAMPLES) | ||
| JP2591447B2 (ja) | 多層基板とその製造方法 | |
| JPS6141272Y2 (enEXAMPLES) | ||
| JPS5849659Y2 (ja) | プリント配線基板 | |
| JPS60180186A (ja) | プリント基板 | |
| JPS60245195A (ja) | 多層配線基板 | |
| JPS59119891A (ja) | 回路素子の固定方法 | |
| JPH0383393A (ja) | プリント配線板 | |
| JPH06310826A (ja) | フレキシブルプリント配線板における電子部品の実装構造 | |
| JPS59127266U (ja) | 印刷配線板 | |
| JPH069167U (ja) | 可撓性回路基板 |