JPH0528764Y2 - - Google Patents

Info

Publication number
JPH0528764Y2
JPH0528764Y2 JP1987144174U JP14417487U JPH0528764Y2 JP H0528764 Y2 JPH0528764 Y2 JP H0528764Y2 JP 1987144174 U JP1987144174 U JP 1987144174U JP 14417487 U JP14417487 U JP 14417487U JP H0528764 Y2 JPH0528764 Y2 JP H0528764Y2
Authority
JP
Japan
Prior art keywords
capillary
bonding
bonding position
coordinates
center
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1987144174U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6448030U (enExample
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987144174U priority Critical patent/JPH0528764Y2/ja
Publication of JPS6448030U publication Critical patent/JPS6448030U/ja
Application granted granted Critical
Publication of JPH0528764Y2 publication Critical patent/JPH0528764Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers

Landscapes

  • Wire Bonding (AREA)
JP1987144174U 1987-09-21 1987-09-21 Expired - Lifetime JPH0528764Y2 (enExample)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987144174U JPH0528764Y2 (enExample) 1987-09-21 1987-09-21

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987144174U JPH0528764Y2 (enExample) 1987-09-21 1987-09-21

Publications (2)

Publication Number Publication Date
JPS6448030U JPS6448030U (enExample) 1989-03-24
JPH0528764Y2 true JPH0528764Y2 (enExample) 1993-07-23

Family

ID=31411643

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987144174U Expired - Lifetime JPH0528764Y2 (enExample) 1987-09-21 1987-09-21

Country Status (1)

Country Link
JP (1) JPH0528764Y2 (enExample)

Also Published As

Publication number Publication date
JPS6448030U (enExample) 1989-03-24

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