JPH0528752Y2 - - Google Patents
Info
- Publication number
- JPH0528752Y2 JPH0528752Y2 JP12274587U JP12274587U JPH0528752Y2 JP H0528752 Y2 JPH0528752 Y2 JP H0528752Y2 JP 12274587 U JP12274587 U JP 12274587U JP 12274587 U JP12274587 U JP 12274587U JP H0528752 Y2 JPH0528752 Y2 JP H0528752Y2
- Authority
- JP
- Japan
- Prior art keywords
- solder
- thickness
- electronic component
- terminal
- plating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229910052751 metal Inorganic materials 0.000 claims description 11
- 239000002184 metal Substances 0.000 claims description 11
- 238000002844 melting Methods 0.000 claims description 8
- 230000008018 melting Effects 0.000 claims description 8
- 239000012212 insulator Substances 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 description 43
- 238000007747 plating Methods 0.000 description 23
- 239000011347 resin Substances 0.000 description 18
- 229920005989 resin Polymers 0.000 description 18
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 7
- 229910052709 silver Inorganic materials 0.000 description 7
- 239000004332 silver Substances 0.000 description 7
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 239000003990 capacitor Substances 0.000 description 5
- 238000005476 soldering Methods 0.000 description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 229910052718 tin Inorganic materials 0.000 description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- 230000003628 erosive effect Effects 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000002159 abnormal effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12274587U JPH0528752Y2 (de) | 1987-08-10 | 1987-08-10 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12274587U JPH0528752Y2 (de) | 1987-08-10 | 1987-08-10 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6426826U JPS6426826U (de) | 1989-02-15 |
| JPH0528752Y2 true JPH0528752Y2 (de) | 1993-07-23 |
Family
ID=31370961
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12274587U Expired - Lifetime JPH0528752Y2 (de) | 1987-08-10 | 1987-08-10 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0528752Y2 (de) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2927196B2 (ja) * | 1994-11-25 | 1999-07-28 | 日本電気株式会社 | チップ型電子部品及びその製造方法 |
| WO2004093353A1 (ja) | 2003-04-15 | 2004-10-28 | Fujitsu Limited | 光分岐装置 |
| WO2024203239A1 (ja) * | 2023-03-30 | 2024-10-03 | パナソニックＩｐマネジメント株式会社 | 電子部品及びこれを搭載した電子機器 |
-
1987
- 1987-08-10 JP JP12274587U patent/JPH0528752Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6426826U (de) | 1989-02-15 |
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