JPH0527977B2 - - Google Patents

Info

Publication number
JPH0527977B2
JPH0527977B2 JP59176583A JP17658384A JPH0527977B2 JP H0527977 B2 JPH0527977 B2 JP H0527977B2 JP 59176583 A JP59176583 A JP 59176583A JP 17658384 A JP17658384 A JP 17658384A JP H0527977 B2 JPH0527977 B2 JP H0527977B2
Authority
JP
Japan
Prior art keywords
wire
bonding
clamper
capillary
gas
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59176583A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6154638A (ja
Inventor
Koichiro Atsumi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Priority to JP59176583A priority Critical patent/JPS6154638A/ja
Publication of JPS6154638A publication Critical patent/JPS6154638A/ja
Publication of JPH0527977B2 publication Critical patent/JPH0527977B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/0711—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45147—Copper (Cu) as principal constituent
    • H10W72/01551—
    • H10W72/07141—
    • H10W72/075—
    • H10W72/07502—
    • H10W72/07511—
    • H10W72/07532—
    • H10W72/07533—
    • H10W72/07541—
    • H10W72/50—

Landscapes

  • Wire Bonding (AREA)
JP59176583A 1984-08-27 1984-08-27 ワイヤボンデイング装置 Granted JPS6154638A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59176583A JPS6154638A (ja) 1984-08-27 1984-08-27 ワイヤボンデイング装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59176583A JPS6154638A (ja) 1984-08-27 1984-08-27 ワイヤボンデイング装置

Publications (2)

Publication Number Publication Date
JPS6154638A JPS6154638A (ja) 1986-03-18
JPH0527977B2 true JPH0527977B2 (cg-RX-API-DMAC10.html) 1993-04-22

Family

ID=16016097

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59176583A Granted JPS6154638A (ja) 1984-08-27 1984-08-27 ワイヤボンデイング装置

Country Status (1)

Country Link
JP (1) JPS6154638A (cg-RX-API-DMAC10.html)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5152450A (en) * 1987-01-26 1992-10-06 Hitachi, Ltd. Wire-bonding method, wire-bonding apparatus,and semiconductor device produced by the wire-bonding method

Also Published As

Publication number Publication date
JPS6154638A (ja) 1986-03-18

Similar Documents

Publication Publication Date Title
US10022821B2 (en) Bonding method and bonding device
JP2889399B2 (ja) テープ自動化ボンディング法
JPH0527977B2 (cg-RX-API-DMAC10.html)
JPH0587976B2 (cg-RX-API-DMAC10.html)
JPS6158246A (ja) ワイヤボンデイング方法
KR930006129B1 (ko) 반도체 장치의 제조방법 및 그 장치
JPH0564459B2 (cg-RX-API-DMAC10.html)
JPH0325020B2 (cg-RX-API-DMAC10.html)
JPH01251628A (ja) ボンディング装置
JPS57126143A (en) Bonding method
JPS63266846A (ja) 電子装置の製造方法および装置
JPS61172343A (ja) ワイヤボンデイング方法及び装置
JP2645014B2 (ja) ワイヤボンディング装置
JPH0354855B2 (cg-RX-API-DMAC10.html)
JP2707909B2 (ja) 集積回路チップのボンディング方法
JPS63232438A (ja) ワイヤボンデイング方法
JPH07153783A (ja) 半導体製造装置
JPS62234336A (ja) 半導体ペレツトのハンダ付け方法
JPS63266845A (ja) ワイヤボンデイング装置
JPH0367339B2 (cg-RX-API-DMAC10.html)
JPS62104126A (ja) ワイヤボンデイング方法
JP2776100B2 (ja) ワイヤボンディング装置
JPH05259218A (ja) ボンディング装置
JP2000332050A (ja) ワイヤボンディング装置
JPH08153723A (ja) 半田ボール形成方法および装置