JPH0367339B2 - - Google Patents

Info

Publication number
JPH0367339B2
JPH0367339B2 JP59219902A JP21990284A JPH0367339B2 JP H0367339 B2 JPH0367339 B2 JP H0367339B2 JP 59219902 A JP59219902 A JP 59219902A JP 21990284 A JP21990284 A JP 21990284A JP H0367339 B2 JPH0367339 B2 JP H0367339B2
Authority
JP
Japan
Prior art keywords
bonding
lead frame
wire
bonding wire
section
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59219902A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6197937A (ja
Inventor
Mitsuo Kobayashi
Osamu Usuda
Yoshihiko Sano
Koichiro Atsumi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Priority to JP59219902A priority Critical patent/JPS6197937A/ja
Priority to US06/759,273 priority patent/US4732313A/en
Priority to EP85109406A priority patent/EP0169574B1/en
Priority to DE8585109406T priority patent/DE3577371D1/de
Priority to KR1019850005537A priority patent/KR900000205B1/ko
Priority to CN85106110A priority patent/CN85106110B/zh
Publication of JPS6197937A publication Critical patent/JPS6197937A/ja
Publication of JPH0367339B2 publication Critical patent/JPH0367339B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/0711—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45147—Copper (Cu) as principal constituent
    • H10W72/01551—
    • H10W72/07141—
    • H10W72/07173—
    • H10W72/073—
    • H10W72/075—
    • H10W72/07511—
    • H10W72/07521—
    • H10W72/07532—
    • H10W72/07541—
    • H10W72/50—
    • H10W72/536—
    • H10W72/5363—
    • H10W72/5449—
    • H10W72/884—
    • H10W90/756—

Landscapes

  • Wire Bonding (AREA)
JP59219902A 1984-07-27 1984-10-19 半導体素子の組立方法及びその装置 Granted JPS6197937A (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP59219902A JPS6197937A (ja) 1984-10-19 1984-10-19 半導体素子の組立方法及びその装置
US06/759,273 US4732313A (en) 1984-07-27 1985-07-26 Apparatus and method for manufacturing semiconductor device
EP85109406A EP0169574B1 (en) 1984-07-27 1985-07-26 Apparatus for manufacturing semiconductor device
DE8585109406T DE3577371D1 (de) 1984-07-27 1985-07-26 Apparat zum herstellen einer halbleiteranordnung.
KR1019850005537A KR900000205B1 (ko) 1984-10-19 1985-07-31 결속상태가 개선된 반도체 장치의 제조장치
CN85106110A CN85106110B (zh) 1984-10-19 1985-08-13 制造半导体器件的装置及其使用方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59219902A JPS6197937A (ja) 1984-10-19 1984-10-19 半導体素子の組立方法及びその装置

Publications (2)

Publication Number Publication Date
JPS6197937A JPS6197937A (ja) 1986-05-16
JPH0367339B2 true JPH0367339B2 (cg-RX-API-DMAC10.html) 1991-10-22

Family

ID=16742820

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59219902A Granted JPS6197937A (ja) 1984-07-27 1984-10-19 半導体素子の組立方法及びその装置

Country Status (1)

Country Link
JP (1) JPS6197937A (cg-RX-API-DMAC10.html)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63314837A (ja) * 1987-06-18 1988-12-22 Mitsubishi Electric Corp 半導体製造装置
JP2016028417A (ja) * 2014-07-11 2016-02-25 ローム株式会社 電子装置
JP6810222B2 (ja) * 2014-07-11 2021-01-06 ローム株式会社 電子装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52142485A (en) * 1976-05-21 1977-11-28 Mitsubishi Electric Corp Wire bonding device
JPS58223339A (ja) * 1982-06-22 1983-12-24 Toshiba Corp 半導体ペレツトのワイヤボンデイング方法

Also Published As

Publication number Publication date
JPS6197937A (ja) 1986-05-16

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term