JPH0354855B2 - - Google Patents

Info

Publication number
JPH0354855B2
JPH0354855B2 JP60095204A JP9520485A JPH0354855B2 JP H0354855 B2 JPH0354855 B2 JP H0354855B2 JP 60095204 A JP60095204 A JP 60095204A JP 9520485 A JP9520485 A JP 9520485A JP H0354855 B2 JPH0354855 B2 JP H0354855B2
Authority
JP
Japan
Prior art keywords
bonding
wire
bonding wire
semiconductor
ball
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60095204A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61253825A (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP60095204A priority Critical patent/JPS61253825A/ja
Publication of JPS61253825A publication Critical patent/JPS61253825A/ja
Publication of JPH0354855B2 publication Critical patent/JPH0354855B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/0711—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45147—Copper (Cu) as principal constituent
    • H10W72/01551—
    • H10W72/07141—
    • H10W72/07173—
    • H10W72/075—
    • H10W72/07511—
    • H10W72/07532—
    • H10W72/07541—
    • H10W72/07551—
    • H10W72/50—
    • H10W72/536—
    • H10W72/5363—
    • H10W90/756—

Landscapes

  • Wire Bonding (AREA)
JP60095204A 1985-05-02 1985-05-02 半導体素子の組立方法 Granted JPS61253825A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60095204A JPS61253825A (ja) 1985-05-02 1985-05-02 半導体素子の組立方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60095204A JPS61253825A (ja) 1985-05-02 1985-05-02 半導体素子の組立方法

Publications (2)

Publication Number Publication Date
JPS61253825A JPS61253825A (ja) 1986-11-11
JPH0354855B2 true JPH0354855B2 (cg-RX-API-DMAC10.html) 1991-08-21

Family

ID=14131217

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60095204A Granted JPS61253825A (ja) 1985-05-02 1985-05-02 半導体素子の組立方法

Country Status (1)

Country Link
JP (1) JPS61253825A (cg-RX-API-DMAC10.html)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5411529B2 (ja) * 2009-02-27 2014-02-12 セミコンダクター・コンポーネンツ・インダストリーズ・リミテッド・ライアビリティ・カンパニー 半導体装置の製造方法
JP5411553B2 (ja) * 2009-03-31 2014-02-12 セミコンダクター・コンポーネンツ・インダストリーズ・リミテッド・ライアビリティ・カンパニー 半導体装置の製造方法
JP2010258286A (ja) * 2009-04-27 2010-11-11 Sanyo Electric Co Ltd 半導体装置及びその製造方法

Also Published As

Publication number Publication date
JPS61253825A (ja) 1986-11-11

Similar Documents

Publication Publication Date Title
US4732313A (en) Apparatus and method for manufacturing semiconductor device
JPH0354855B2 (cg-RX-API-DMAC10.html)
JPS60154537A (ja) 半導体デバイスの製作方法
US5087590A (en) Method of manufacturing semiconductor devices
JPH0462456B2 (cg-RX-API-DMAC10.html)
JPH0367339B2 (cg-RX-API-DMAC10.html)
JPH0367340B2 (cg-RX-API-DMAC10.html)
CN85106110A (zh) 用于制造半导体器件的装置
JPS6158246A (ja) ワイヤボンデイング方法
JPS6250976B2 (cg-RX-API-DMAC10.html)
JPS62152143A (ja) バンプ形成方法
JPH0587976B2 (cg-RX-API-DMAC10.html)
JPH0325020B2 (cg-RX-API-DMAC10.html)
JPH0325019B2 (cg-RX-API-DMAC10.html)
JPS60193352A (ja) ワイヤボンデイング装置
JPH0527977B2 (cg-RX-API-DMAC10.html)
JPS61119053A (ja) ワイヤボンデイング方法
JPS6447063A (en) Structure of lead frame
CN210014392U (zh) 用于集成电路封装工艺的打火装置
JP3582398B2 (ja) 半導体圧力センサーの製造方法及びその装置
JPH0345539B2 (cg-RX-API-DMAC10.html)
JPS60177639A (ja) 半導体装置の製造方法
JPH06275673A (ja) ワイヤーボンディング装置及びワイヤーボンディング方法
JPS6063942A (ja) ワイヤボンディング装置
JPS6154637A (ja) ワイヤボンデイング方法

Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term