JPS6154638A - ワイヤボンデイング装置 - Google Patents

ワイヤボンデイング装置

Info

Publication number
JPS6154638A
JPS6154638A JP59176583A JP17658384A JPS6154638A JP S6154638 A JPS6154638 A JP S6154638A JP 59176583 A JP59176583 A JP 59176583A JP 17658384 A JP17658384 A JP 17658384A JP S6154638 A JPS6154638 A JP S6154638A
Authority
JP
Japan
Prior art keywords
wire
clamper
bonding
shielding plate
capillary
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59176583A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0527977B2 (cg-RX-API-DMAC10.html
Inventor
Koichiro Atsumi
幸一郎 渥美
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP59176583A priority Critical patent/JPS6154638A/ja
Publication of JPS6154638A publication Critical patent/JPS6154638A/ja
Publication of JPH0527977B2 publication Critical patent/JPH0527977B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/0711—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45147—Copper (Cu) as principal constituent
    • H10W72/01551—
    • H10W72/07141—
    • H10W72/075—
    • H10W72/07502—
    • H10W72/07511—
    • H10W72/07532—
    • H10W72/07533—
    • H10W72/07541—
    • H10W72/50—

Landscapes

  • Wire Bonding (AREA)
JP59176583A 1984-08-27 1984-08-27 ワイヤボンデイング装置 Granted JPS6154638A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59176583A JPS6154638A (ja) 1984-08-27 1984-08-27 ワイヤボンデイング装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59176583A JPS6154638A (ja) 1984-08-27 1984-08-27 ワイヤボンデイング装置

Publications (2)

Publication Number Publication Date
JPS6154638A true JPS6154638A (ja) 1986-03-18
JPH0527977B2 JPH0527977B2 (cg-RX-API-DMAC10.html) 1993-04-22

Family

ID=16016097

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59176583A Granted JPS6154638A (ja) 1984-08-27 1984-08-27 ワイヤボンデイング装置

Country Status (1)

Country Link
JP (1) JPS6154638A (cg-RX-API-DMAC10.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5152450A (en) * 1987-01-26 1992-10-06 Hitachi, Ltd. Wire-bonding method, wire-bonding apparatus,and semiconductor device produced by the wire-bonding method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5152450A (en) * 1987-01-26 1992-10-06 Hitachi, Ltd. Wire-bonding method, wire-bonding apparatus,and semiconductor device produced by the wire-bonding method

Also Published As

Publication number Publication date
JPH0527977B2 (cg-RX-API-DMAC10.html) 1993-04-22

Similar Documents

Publication Publication Date Title
KR100874328B1 (ko) 와이어 본딩용의 감소된 산화 시스템
US7614538B2 (en) Device clamp for reducing oxidation in wire bonding
JPS6154638A (ja) ワイヤボンデイング装置
JPS6158246A (ja) ワイヤボンデイング方法
JPH0587976B2 (cg-RX-API-DMAC10.html)
JPH0564459B2 (cg-RX-API-DMAC10.html)
CN101882562A (zh) 半导体封装用导线接合装置及其方法
CN101075572B (zh) 器件夹具、焊线机及将流体提供到焊线机的焊点区的方法
JPH0325020B2 (cg-RX-API-DMAC10.html)
CN101872729B (zh) 打线设备及其保护气体自动切换系统与方法
JPS61172343A (ja) ワイヤボンデイング方法及び装置
JPS63266846A (ja) 電子装置の製造方法および装置
JPS57126143A (en) Bonding method
JPH01251628A (ja) ボンディング装置
JPH0530060B2 (cg-RX-API-DMAC10.html)
JP2645014B2 (ja) ワイヤボンディング装置
JPS61119052A (ja) 非貴金属ワイヤボンデイング方法
JPS61253825A (ja) 半導体素子の組立方法
JPS6070736A (ja) 半導体装置の組立方法およびその組立装置
JPS63300522A (ja) 半導体装置
JPS5940540A (ja) ワイヤボンダ
JPS60177639A (ja) 半導体装置の製造方法
JPS60211953A (ja) 半導体装置の製造方法
JPS61253824A (ja) 半導体素子の組立方法
JPS61237441A (ja) ワイヤボンデイング方法