JPS57126143A - Bonding method - Google Patents

Bonding method

Info

Publication number
JPS57126143A
JPS57126143A JP56010809A JP1080981A JPS57126143A JP S57126143 A JPS57126143 A JP S57126143A JP 56010809 A JP56010809 A JP 56010809A JP 1080981 A JP1080981 A JP 1080981A JP S57126143 A JPS57126143 A JP S57126143A
Authority
JP
Japan
Prior art keywords
tool
heating
cooling
pressure
exfoliation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP56010809A
Other languages
Japanese (ja)
Inventor
Seiichi Chiba
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Ltd
Shinkawa Seisakusho Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd, Shinkawa Seisakusho Co Ltd filed Critical Shinkawa Ltd
Priority to JP56010809A priority Critical patent/JPS57126143A/en
Publication of JPS57126143A publication Critical patent/JPS57126143A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/79—Apparatus for Tape Automated Bonding [TAB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/86—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using tape automated bonding [TAB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

PURPOSE:To prevent the exfoliation of a bonding section due to thermocompression bonding, and to improve operation efficiency by heating a material to be bonded by pressure-welding a pulse heating tool, interrupting heating under a pressure welding condition and cooling the tool by blowing a cooling air flow. CONSTITUTION:The pulse heating tool 1 into which an insulating material 2 is attached is conducted and heated by electrodes 3. A lead 6 on a carrier tape 5 forwarded by means of a guide 4 is positioned at a bump 8 of a chip 7 fixed to a substrate 9 on a moving base 10, and pressure-welded by means of the tool 1 while being bonded through the conduction and heating of the tool. Currents are interrupted and heating is stopped under this condition, and air or a N2 gas is blown by means of a pipe 11. A eutectic alloy formed through thermocompression bonding and melted solder are cooled and solidified, and the tool is separated from the bonding section. Accordingly, the cooling of the tool is promoted, and efficiency is improved while the generation of defects such as exfoliation can be prevented.
JP56010809A 1981-01-29 1981-01-29 Bonding method Pending JPS57126143A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56010809A JPS57126143A (en) 1981-01-29 1981-01-29 Bonding method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56010809A JPS57126143A (en) 1981-01-29 1981-01-29 Bonding method

Publications (1)

Publication Number Publication Date
JPS57126143A true JPS57126143A (en) 1982-08-05

Family

ID=11760668

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56010809A Pending JPS57126143A (en) 1981-01-29 1981-01-29 Bonding method

Country Status (1)

Country Link
JP (1) JPS57126143A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03190198A (en) * 1989-12-19 1991-08-20 Matsushita Electric Ind Co Ltd Bonding head of outer lead and method of bonding
KR20030021896A (en) * 2001-09-10 2003-03-15 삼성전자주식회사 Die adhesion tool and method to prevent leadframe strain and improve adhesive power
US20150287693A1 (en) * 2013-07-02 2015-10-08 Kulicke And Soffa Industries, Inc. Bond heads for thermocompression bonders, thermocompression bonders, and methods of operating the same
US9761474B2 (en) 2013-12-19 2017-09-12 Micron Technology, Inc. Methods for processing semiconductor devices

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5758327A (en) * 1980-09-25 1982-04-08 Nec Corp Device for fabricating semiconductor device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5758327A (en) * 1980-09-25 1982-04-08 Nec Corp Device for fabricating semiconductor device

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03190198A (en) * 1989-12-19 1991-08-20 Matsushita Electric Ind Co Ltd Bonding head of outer lead and method of bonding
KR20030021896A (en) * 2001-09-10 2003-03-15 삼성전자주식회사 Die adhesion tool and method to prevent leadframe strain and improve adhesive power
US20150287693A1 (en) * 2013-07-02 2015-10-08 Kulicke And Soffa Industries, Inc. Bond heads for thermocompression bonders, thermocompression bonders, and methods of operating the same
US9425162B2 (en) * 2013-07-02 2016-08-23 Kulicke And Soffa Industries, Inc. Bond heads for thermocompression bonders, thermocompression bonders, and methods of operating the same
US9847314B2 (en) 2013-07-02 2017-12-19 Kulicke And Soffa Industries, Inc. Bond heads for thermocompression bonders, thermocompression bonders, and methods of operating the same
US9761474B2 (en) 2013-12-19 2017-09-12 Micron Technology, Inc. Methods for processing semiconductor devices
US10615069B2 (en) 2013-12-19 2020-04-07 Micron Technology, Inc. Semiconductor structures comprising polymeric materials

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