JPS5516441A - Soldering method of semiconductor pellet - Google Patents

Soldering method of semiconductor pellet

Info

Publication number
JPS5516441A
JPS5516441A JP8943878A JP8943878A JPS5516441A JP S5516441 A JPS5516441 A JP S5516441A JP 8943878 A JP8943878 A JP 8943878A JP 8943878 A JP8943878 A JP 8943878A JP S5516441 A JPS5516441 A JP S5516441A
Authority
JP
Japan
Prior art keywords
solder
header
soldering
pellet
semiconductor pellet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8943878A
Other languages
Japanese (ja)
Inventor
Susumu Okikawa
Hiromichi Suzuki
Masayoshi Yoshimura
Tsutomu Mimata
Tomio Yamada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP8943878A priority Critical patent/JPS5516441A/en
Publication of JPS5516441A publication Critical patent/JPS5516441A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/743—Apparatus for manufacturing layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L2224/743—Apparatus for manufacturing layer connectors

Abstract

PURPOSE: To perform highly reliable pellet soldering with less void by employing processes of solder feeding→preparatory soldering→soldering→rapid cooling (→wire bonding).
CONSTITUTION: Disc solder 12 is fed to a header 10, and the solder 12 is temporarily attached to the header 10. Next, after it is sent into a solder furnace for preparatory soldering, semiconductor pellet 18 is located against the header 10 for melting the solder 12 to be fixed while given vibration and loading. Next, the header 10 which has completed the location of the pellet 18 is led to a cooling block, where it is rapidly cooled by the blowing of coolant gas.
COPYRIGHT: (C)1980,JPO&Japio
JP8943878A 1978-07-24 1978-07-24 Soldering method of semiconductor pellet Pending JPS5516441A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8943878A JPS5516441A (en) 1978-07-24 1978-07-24 Soldering method of semiconductor pellet

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8943878A JPS5516441A (en) 1978-07-24 1978-07-24 Soldering method of semiconductor pellet

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP61219592A Division JPS62234336A (en) 1986-09-19 1986-09-19 Soldering method for semiconductor pellet

Publications (1)

Publication Number Publication Date
JPS5516441A true JPS5516441A (en) 1980-02-05

Family

ID=13970673

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8943878A Pending JPS5516441A (en) 1978-07-24 1978-07-24 Soldering method of semiconductor pellet

Country Status (1)

Country Link
JP (1) JPS5516441A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57106137A (en) * 1980-12-24 1982-07-01 Hitachi Ltd Attaching method for pellet with solder
JPS60100440A (en) * 1984-10-04 1985-06-04 Fuji Electric Co Ltd Soldering method for semiconductor film
ITTO20090581A1 (en) * 2009-07-29 2011-01-30 Osai A S S R L METHOD AND CONDITIONING DEVICE IN TEMPERATURE OF AN ELEMENT

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS501651A (en) * 1973-05-07 1975-01-09

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS501651A (en) * 1973-05-07 1975-01-09

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57106137A (en) * 1980-12-24 1982-07-01 Hitachi Ltd Attaching method for pellet with solder
JPH028460B2 (en) * 1980-12-24 1990-02-23 Hitachi Ltd
JPS60100440A (en) * 1984-10-04 1985-06-04 Fuji Electric Co Ltd Soldering method for semiconductor film
ITTO20090581A1 (en) * 2009-07-29 2011-01-30 Osai A S S R L METHOD AND CONDITIONING DEVICE IN TEMPERATURE OF AN ELEMENT
WO2011012976A1 (en) * 2009-07-29 2011-02-03 Osai A.S. S.R.L. Method and device for temperature conditioning of an element

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