WO2011012976A1 - Method and device for temperature conditioning of an element - Google Patents

Method and device for temperature conditioning of an element Download PDF

Info

Publication number
WO2011012976A1
WO2011012976A1 PCT/IB2010/001850 IB2010001850W WO2011012976A1 WO 2011012976 A1 WO2011012976 A1 WO 2011012976A1 IB 2010001850 W IB2010001850 W IB 2010001850W WO 2011012976 A1 WO2011012976 A1 WO 2011012976A1
Authority
WO
WIPO (PCT)
Prior art keywords
temperature
aeriform
seat
conveying
presser
Prior art date
Application number
PCT/IB2010/001850
Other languages
French (fr)
Other versions
WO2011012976A8 (en
Inventor
Marco Guolo
Original Assignee
Osai A.S. S.R.L.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osai A.S. S.R.L. filed Critical Osai A.S. S.R.L.
Publication of WO2011012976A1 publication Critical patent/WO2011012976A1/en
Publication of WO2011012976A8 publication Critical patent/WO2011012976A8/en

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D19/00—Arrangement or mounting of refrigeration units with respect to devices or objects to be refrigerated, e.g. infrared detectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D3/00—Devices using other cold materials; Devices using cold-storage bodies
    • F25D3/10—Devices using other cold materials; Devices using cold-storage bodies using liquefied gases, e.g. liquid air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to a device and to a method for temperature conditioning of an element having a mass of less than 100 g at at least one temperature comprised between -40 0 C and 17O 0 C.
  • the element could be a microelectromechanical system (MEMS) .
  • MEMS microelectromechanical system
  • Known methods for conditioning proper operation of electronic microsystems envisage electrical connection of the microsystem and temperature conditioning thereof through a convective system that entails circulation of air conditioned at the desired temperature. The time taken by the device to reach the same temperature as that of the conditioning convective element is then measured experimentally. In particular, the air circulates in a closed environment, within which the air itself is progressively heated and cooled.
  • the aim of the present invention is to provide a method for temperature conditioning of an element having a mass of less than 100 g that will be able to satisfy the aforesaid need in a simple and inexpensive way.
  • the aforesaid aim is achieved by the present invention in so far as it relates to a method for temperature conditioning of an element having a mass of less than 100 g at at least one temperature comprised between -4O 0 C and 170 0 C, as defined in Claim 1.
  • the present invention likewise regards a device for temperature conditioning of a body having a mass of less than 100 g at at least one temperature comprised between -40 0 C and 170 0 C, as defined in Claim 9.
  • FIGS. 1 to 3 are cross sections of a device for conditioning an element having a mass of less than 100 g at at least one temperature comprised between -40 0 C and 170 0 C provided according to the invention.
  • FIG. 4 is a view at a markedly enlarged scale of some details of Figure 3.
  • designated by 1 is a device for temperature conditioning of an element 3 having a mass of less than 100 g at at least one temperature comprised between -4O 0 C and 170 0 C.
  • the element 3 is a mxcroelectromechanical system (MEMS) .
  • MEMS mxcroelectromechanical system
  • the device 1 comprises ( Figures 1 to 3) :
  • a conveying duct 11 that can be traversed by a jet of an aeriform at a predetermined temperature and has an opening 12 that can be set facing the seat 10 so that the element 3 can be heated by convection;
  • a supply circuit 71 (illustrated only m Figure 3) for supplying the duct 11 with the aeriform, which can be controlled on the basis of the temperature of the element 3.
  • the device 1 is connected to an electrical testing circuit 9 illustrated m Figure 3.
  • the electrical circuit 9 comprises, in the case illustrated, a pair of terminals 14 connected to a testing device 60 (illustrated only schematically in Figure 3) .
  • the terminals 14 are elastically supported.
  • the element 3 is parallelepipedal and comprises ( Figure 4) substantially four lateral walls 31a lying in use in respective vertical planes, a top wall 31b orthogonal to the wall 31a, and a bottom wall 31c orthogonal to the walls 31a and parallel to the wall 31b.
  • Walls 31a opposite to one another lie m planes parallel to one another and walls 31a adjacent to one another lie in planes orthogonal to one another .
  • the wall 31b comprises a central portion 29 against which the presser 20 is designed to co-operate, and a pair of portions 30 that can be set facing the opening 12 and are set on sides opposite to one another of the portion 30.
  • the seat 10 is parallelepipedal and comprises four side walls 32 co-operating with the walls 31a of the element 3.
  • Provided on each side wall 32 is an elongated undercut 33 parallel to the walls 31a.
  • the device 1 further comprises a duct 80, which is fluidically connected to an external environment and to the undercuts 33 and can be traversed by the aeriform during the step of conditioning of the element 3.
  • the duct 80 and the undercuts 33 define a microchamber 50 which surrounds the element 3 and can be traversed by the aeriform during the step of conditioning of the element 3.
  • the surface surrounding the microchamber 50 is made of thermally insulating refractory material.
  • the aeriform may be an inert gas or else filtered and dehumidified air.
  • the inert gas is helium, nitrogen, or argon.
  • the device 1 further comprises a temperature sensor 13 designed to measure the temperature of the element 3 when the duct 11 conveys the jet of aeriform on the element 3.
  • the sensor 13 is of the contact type.
  • the sensor 13 could be of the infrared or electrical conductivity type, i.e., capable of detecting the temperature respectively via the variation of emission of radiation in the infrared or the variation of electrical conductivity.
  • the device 1 further comprises a first body 15 defining the duct 11, and a second body 16 defining the cylindrical seat 10 and seats 51, 53 and 52 ( Figure 4) respectively for the terminals 14 and for the sensor 13.
  • the seats 51, 53, 52 extend completely on the opposite side of the seat 10 with respect to the opening 12.
  • the body 15 basically comprises a casing 18 and the duct 11.
  • the body 15 further comprises the presser 20.
  • the presser 20 engages the duct 11, is surrounded by the opening 12, and is made of thermally conductive material.
  • the body 15 can be displaced away from and towards the body 16 in a vertical direction between an operative position, in which the opening 12 is in fluidic connection with the microchamber 50 and the presser 20 presses the element 3 within the seat 10 against the terminals 14, and a resting position, m which the presser 20 is set away from the microchamber 50, and, hence, from the element 3. In the resting position, removal or insertion of the element 3 is enabled.
  • the aeriform traverses the duct 11 and comes into contact, via the opening 12, with the microchamber 50 and, hence, with the element 3.
  • the element 3 is temperature conditioned m part by convection by the aeriform present m the microchamber 50.
  • the aeriform present in the duct 11 laps the presser 20, which, in turn, heats by direct contact the portion 29 of the face 31b of the element 3. In other words, the element 3 is heated in part by conduction by the presser 20.
  • the presser 20 is moreover lapped by the aeriform present in the duct 11.
  • the presser 20 co-operates with the portion 29 of the face 31b of the element 3, whereas the portions 30 of the face 31b of the element 3 are directly in fluidic connection, via the opening 12, with the duct 11.
  • the presser 20 is dampened and made of thermally conductive material.
  • the terminals 14 and the sensor 13 have respective ends 41, 42, 43 m contact with the wall 31c of the element 3.
  • the circuit 71 is set between the source 70 and the duct 11. Interposed on the circuit 71 are a variable electrical resistance 72 and a valve 73 for regulation the flow rate of aeriform to be sent to the duct 11. In particular, the electrical resistance 72 heats the aeriform by the Joule effect.
  • the electrical resistance 72 and the valve 73 are governed, in closed-loop fashion, on the basis of the measurement of the sensor 13 so as to adjust the flow rate, the pressure, and the temperature of the aeriform to be delivered in the duct 11. Operation of the device 1 is described starting from a condition m which the body 15 is m the respective resting position ( Figure 1) and the element 3 is housed in the seat 10.
  • the aeriform is conveyed continuously in the duct 11 at a first temperature, for example - 40 0 C, corresponding to a lower limit of the operating temperature of the element 3.
  • the jet of aeriform at the first temperature reaches continuously the microchamber 50 and thus laps the element 3.
  • the aeriform traversing the duct 11 laps the presser 20 and brings it to the first temperature.
  • the presser 20, in turn, conditions the element 3 at the second temperature .
  • the element 3 is conditioned in temperature both by conduction by the presser 20 and by convection by the aeriform present in the microchamber 50.
  • the sensor 13 detects that the element 3 is at the first temperature and the circuit 9, via the terminals 14, verifies proper operation of the element 3.
  • valve 73 and the electrical resistance 72 are governed m closed- loop fashion on the basis of the temperature measurement performed by the sensor 13 so as to deliver in the duct 11 a flow rate of aeriform at a given temperature and pressure such as to ensure that the element 3 is at the first temperature .
  • the aeriform is conveyed in the duct 11 at a second temperature, for example 17O 0 C, corresponding to an upper limit of the operating temperature of the element 3.
  • the jet of aeriform at the second temperature reaches the seat 10 and, hence, lap the element 3.
  • the aeriform traversing the duct 11 laps the presser 20 and brings it to the second temperature.
  • the element 3 is conditioned in temperature both as a result of contact with the presser 20 and by conduction with the aeriform present in the microchamber 50.
  • the sensor 13 detects that the element 3 is at the second temperature, and the circuit 9, via the terminals 14, verifies proper operation of the element 3.
  • valve 73 and the electrical resistance 72 are governed in closed- loop fashion on the basis of the temperature measurement performed by the sensor 13 so as to deliver in the duct 11 a flow rate of aeriform at a given temperature such as to ensure that the element 3 is at the second temperature.
  • the element 3 is heated (or cooled) by convention by the aeriform present in the microchamber 50 and by conduction by the presser 20.
  • the duct 11 that delivers the aeriform is, in turn, controlled in closed chain by the temperature sensor 13. Consequently, the method and the device 1 according to the invention enable conditioning of the element 3 at the aforesaid first and second temperatures with a high precision, rapidity, and accuracy. Said high precision, rapidity, and accuracy are achieved thanks to the fact that the element 3 is surrounded by a microchamber 50 continuously traversed by a flow of aeriform towards an external environment.

Abstract

Described herein is a method for temperature conditioning of an element (3) having a mass of less than 100 g at at least one temperature comprised between -40°C and 170°C, including the steps of : housing the element (3) in a seat (10); temperature conditioning a presser (20) made of thermally conductive material; pressing the element (3) within the seat (10) via said presser (20) so as to transfer the heat by conduction; conveying a jet of an aeriform at said temperature on said element (3) so as to transfer the heat by convection during the pressing step; and controlling at least one from among the flow rate, the pressure, and the temperature of said jet of aeriform on the basis of the temperature of said element (3).

Description

"METHOD AND DEVICE FOR TEMPERATURE CONDITIONING OF AN ELEMENT"
TECHNICAL FIELD
The present invention relates to a device and to a method for temperature conditioning of an element having a mass of less than 100 g at at least one temperature comprised between -400C and 17O0C.
In particular, the element could be a microelectromechanical system (MEMS) .
BACKGROUND ART
Known methods for conditioning proper operation of electronic microsystems envisage electrical connection of the microsystem and temperature conditioning thereof through a convective system that entails circulation of air conditioned at the desired temperature. The time taken by the device to reach the same temperature as that of the conditioning convective element is then measured experimentally. In particular, the air circulates in a closed environment, within which the air itself is progressively heated and cooled.
Once this time has elapsed, measurements are made on the microsystem, making an assumption regarding the temperature thereof but without knowing said temperature with certainty. The time for reaching the temperature itself and stabilization thereof is likewise frequently incompatible with the requirements of production.
There is felt in the sector the need to characterize the response of the microsystem concerned at different temperatures, in the stage of development and sampling thereof, or to verify proper operation thereof in the production stage. DISCLOSURE OF INVENTION
The aim of the present invention is to provide a method for temperature conditioning of an element having a mass of less than 100 g that will be able to satisfy the aforesaid need in a simple and inexpensive way.
The aforesaid aim is achieved by the present invention in so far as it relates to a method for temperature conditioning of an element having a mass of less than 100 g at at least one temperature comprised between -4O0C and 1700C, as defined in Claim 1.
The present invention likewise regards a device for temperature conditioning of a body having a mass of less than 100 g at at least one temperature comprised between -400C and 1700C, as defined in Claim 9.
BRIEF DESCRIPTION OF THE DRAWINGS
For a better understanding of the present invention, a preferred embodiment is described in what follows, purely by way of non- limiting example and with reference to the drawings attached, wherein:
- Figures 1 to 3 are cross sections of a device for conditioning an element having a mass of less than 100 g at at least one temperature comprised between -400C and 1700C provided according to the invention; and
- Figure 4 is a view at a markedly enlarged scale of some details of Figure 3. BEST MODE FOR CARRYING OUT THE INVENTION
With reference to Figure 1, designated by 1 is a device for temperature conditioning of an element 3 having a mass of less than 100 g at at least one temperature comprised between -4O0C and 1700C.
In the case m point, illustrated in a non-limiting way, the element 3 is a mxcroelectromechanical system (MEMS) .
More precisely, proper operation is detected at a minimum operating temperature and maximum operating temperature of the element 3, which correspond to the extremes of the aforementioned range. In the case illustrated, the minimum and maximum temperatures coincide respectively with the temperatures of -400C and 1700C. In the ensuing description reference will be made, for simplicity, to a single device 1.
Advantageously, the device 1 comprises (Figures 1 to 3) :
- a seat 10 for receiving the element 3;
- a conveying duct 11 that can be traversed by a jet of an aeriform at a predetermined temperature and has an opening 12 that can be set facing the seat 10 so that the element 3 can be heated by convection;
- a presser 20 made of thermally conductive material, which can be displaced into a position in which it keeps the element
3 in the seat 10 and is in conductive heat exchange with the element 3 itself; and
- a supply circuit 71 (illustrated only m Figure 3) for supplying the duct 11 with the aeriform, which can be controlled on the basis of the temperature of the element 3.
In particular, the device 1 is connected to an electrical testing circuit 9 illustrated m Figure 3. The electrical circuit 9 comprises, in the case illustrated, a pair of terminals 14 connected to a testing device 60 (illustrated only schematically in Figure 3) .
In particular, the terminals 14 are elastically supported. In the case illustrated, the element 3 is parallelepipedal and comprises (Figure 4) substantially four lateral walls 31a lying in use in respective vertical planes, a top wall 31b orthogonal to the wall 31a, and a bottom wall 31c orthogonal to the walls 31a and parallel to the wall 31b. Walls 31a opposite to one another lie m planes parallel to one another and walls 31a adjacent to one another lie in planes orthogonal to one another .
The wall 31b comprises a central portion 29 against which the presser 20 is designed to co-operate, and a pair of portions 30 that can be set facing the opening 12 and are set on sides opposite to one another of the portion 30.
The seat 10 is parallelepipedal and comprises four side walls 32 co-operating with the walls 31a of the element 3. Provided on each side wall 32 is an elongated undercut 33 parallel to the walls 31a.
The device 1 further comprises a duct 80, which is fluidically connected to an external environment and to the undercuts 33 and can be traversed by the aeriform during the step of conditioning of the element 3.
In this way, the duct 80 and the undercuts 33 define a microchamber 50 which surrounds the element 3 and can be traversed by the aeriform during the step of conditioning of the element 3.
The surface surrounding the microchamber 50 is made of thermally insulating refractory material.
In particular, the aeriform may be an inert gas or else filtered and dehumidified air. Preferably, the inert gas is helium, nitrogen, or argon. The device 1 further comprises a temperature sensor 13 designed to measure the temperature of the element 3 when the duct 11 conveys the jet of aeriform on the element 3. In the case illustrated, the sensor 13 is of the contact type. Alternatively, the sensor 13 could be of the infrared or electrical conductivity type, i.e., capable of detecting the temperature respectively via the variation of emission of radiation in the infrared or the variation of electrical conductivity.
The device 1 further comprises a first body 15 defining the duct 11, and a second body 16 defining the cylindrical seat 10 and seats 51, 53 and 52 (Figure 4) respectively for the terminals 14 and for the sensor 13. The seats 51, 53, 52 extend completely on the opposite side of the seat 10 with respect to the opening 12.
The body 15 basically comprises a casing 18 and the duct 11.
The body 15 further comprises the presser 20. The presser 20 engages the duct 11, is surrounded by the opening 12, and is made of thermally conductive material. The body 15 can be displaced away from and towards the body 16 in a vertical direction between an operative position, in which the opening 12 is in fluidic connection with the microchamber 50 and the presser 20 presses the element 3 within the seat 10 against the terminals 14, and a resting position, m which the presser 20 is set away from the microchamber 50, and, hence, from the element 3. In the resting position, removal or insertion of the element 3 is enabled. More precisely, when the body 15 is in the operative position, the aeriform traverses the duct 11 and comes into contact, via the opening 12, with the microchamber 50 and, hence, with the element 3. In other words, the element 3 is temperature conditioned m part by convection by the aeriform present m the microchamber 50.
In addition, when the body 15 is in the first operative position, the aeriform present in the duct 11 laps the presser 20, which, in turn, heats by direct contact the portion 29 of the face 31b of the element 3. In other words, the element 3 is heated in part by conduction by the presser 20.
The presser 20 is moreover lapped by the aeriform present in the duct 11. The presser 20 co-operates with the portion 29 of the face 31b of the element 3, whereas the portions 30 of the face 31b of the element 3 are directly in fluidic connection, via the opening 12, with the duct 11.
More precisely, the presser 20 is dampened and made of thermally conductive material.
The terminals 14 and the sensor 13 have respective ends 41, 42, 43 m contact with the wall 31c of the element 3. The circuit 71 is set between the source 70 and the duct 11. Interposed on the circuit 71 are a variable electrical resistance 72 and a valve 73 for regulation the flow rate of aeriform to be sent to the duct 11. In particular, the electrical resistance 72 heats the aeriform by the Joule effect.
The electrical resistance 72 and the valve 73 are governed, in closed-loop fashion, on the basis of the measurement of the sensor 13 so as to adjust the flow rate, the pressure, and the temperature of the aeriform to be delivered in the duct 11. Operation of the device 1 is described starting from a condition m which the body 15 is m the respective resting position (Figure 1) and the element 3 is housed in the seat 10.
At this point, the body 15 is lowered into the operative position (Figure 3) , the presser 20 keeps the element 3 in the seat 10, and the aeriform is conveyed in the duct 11.
More in particular, the aeriform is conveyed continuously in the duct 11 at a first temperature, for example - 400C, corresponding to a lower limit of the operating temperature of the element 3.
Via the opening 12, the jet of aeriform at the first temperature reaches continuously the microchamber 50 and thus laps the element 3. Simultaneously, the aeriform traversing the duct 11 laps the presser 20 and brings it to the first temperature. The presser 20, in turn, conditions the element 3 at the second temperature . In other words, the element 3 is conditioned in temperature both by conduction by the presser 20 and by convection by the aeriform present in the microchamber 50.
The sensor 13 detects that the element 3 is at the first temperature and the circuit 9, via the terminals 14, verifies proper operation of the element 3.
The valve 73 and the electrical resistance 72 are governed m closed- loop fashion on the basis of the temperature measurement performed by the sensor 13 so as to deliver in the duct 11 a flow rate of aeriform at a given temperature and pressure such as to ensure that the element 3 is at the first temperature .
Next, the aeriform is conveyed in the duct 11 at a second temperature, for example 17O0C, corresponding to an upper limit of the operating temperature of the element 3.
Via the opening 12, the jet of aeriform at the second temperature reaches the seat 10 and, hence, lap the element 3.
Simultaneously, the aeriform traversing the duct 11 laps the presser 20 and brings it to the second temperature. The presser 20, in turn, heats the elements element 3. In other words, the element 3 is conditioned in temperature both as a result of contact with the presser 20 and by conduction with the aeriform present in the microchamber 50.
The sensor 13 detects that the element 3 is at the second temperature, and the circuit 9, via the terminals 14, verifies proper operation of the element 3.
The valve 73 and the electrical resistance 72 are governed in closed- loop fashion on the basis of the temperature measurement performed by the sensor 13 so as to deliver in the duct 11 a flow rate of aeriform at a given temperature such as to ensure that the element 3 is at the second temperature.
At this point, the body 15 is brought into the resting position, the element 3 is disengaged from the seat 10, and a new element 3 is loaded into the seat 10.
After the aeriform has conditioned the element 3, it comes out of the device 1 via the duct 80.
From an examination of the characteristics of the method and of the conditioning device 1 provided according to the present invention the advantages that the latter affords are evident.
In particular, the element 3 is heated (or cooled) by convention by the aeriform present in the microchamber 50 and by conduction by the presser 20. The duct 11 that delivers the aeriform is, in turn, controlled in closed chain by the temperature sensor 13. Consequently, the method and the device 1 according to the invention enable conditioning of the element 3 at the aforesaid first and second temperatures with a high precision, rapidity, and accuracy. Said high precision, rapidity, and accuracy are achieved thanks to the fact that the element 3 is surrounded by a microchamber 50 continuously traversed by a flow of aeriform towards an external environment. Finally, it is clear that modifications and variations may be made to the method and to the conditioning device 1 described and illustrated herein, without thereby departing from the sphere of protection defined by the claims. In particular, the sensors 13 could be m another position.

Claims

1.- A method for temperature conditioning an element (3) having a mass of less than 100 g at at least one temperature comprised between -400C and 1700C, characterized in that it comprises the steps of:
- housing said element (3) in a seat (10) ;
- temperature conditioning a presser (20) made of thermally conductive material;
- pressing said element (3) inside said seat (10) via said presser (20) so as to transfer the heat by conduction;
- conveying a }et of an aeriform at said temperature on said element (3) so as to transfer the heat by convection during said pressing step; and
- controlling at least one from among the flow rate, the pressure, and the temperature of said jet of aeriform on the basis of the temperature of said element (3) .
2.- The method according to Claim 1, characterized in that said conveying step comprises the step of conveying continuously said ^et into a microchamber (50), which surrounds said element (3) and is open towards an external environment .
3.- The method according to Claim 1 or Claim 2, characterized m that said step of temperature conditioning said presser (20) comprises the step of lapping said presser (20) with said jet of aeriform.
4.- The method according to any one of the preceding claims, characterized in that it comprises the steps of:
- measuring the temperature of said element (3) during said conveying steps; and
- using the temperature measurement for closed- loop control of said at least one from among the temperature, the pressure, and the flow rate of said aeriform traversing said duct (11) .
5.- The method according to any one of the preceding claims, characterized in that said step of conveying said aeriform comprises the step of conveying at least one between an inert gas and dehumidified air.
6.- The method according to Claim 5, characterized in that said step of conveying said aeriform comprises the step of conveying an inert gas chosen in the group consisting of nitrogen, helium, and argon.
7.- The method according to any one of the preceding claims, characterized in that said step of conveying said jet comprises the step of conveying said jet in a range of temperatures comprising said predetermined temperature.
8. - The method according to Claim 7 , characterized in that said jet is conveyed at a first temperature and at a second temperature different from one another.
9.- A device (1) for temperature conditioning an element (3) having a mass of less than 100 g at at least one temperature comprised between -4O0C and 1700C, characterized in that it comprises :
- a seat (10) for receiving said element (3) ;
- a conveying duct (11) that can be traversed by a jet of an aeriform at said predetermined temperature and has an opening
(12) that can be set facing said seat (10) so as to temperature condition said element (3) by convection,- - a presser (20) made of thermally conductive material, which can be displaced into a position in which it keeps said element (3) inside said seat (10) and is in conductive heat exchange with said element (3); and
- a circuit (71) for supplying said duct (11) with said aeriform, which can be controlled on the basis of the temperature of said element (3) .
10.- The device according to Claim 9, characterized in that it comprises means (13) for measuring the temperature that can be connected to said seat (10) for detecting the temperature of said element (3) .
11.- The device according to Claim 10, characterized in that, when said presser (20) is m said position, it co-operates with a portion of said element (3) set on one first side of said seat (10), and in that said measuring means (13) comprise a sensor (13) connected to said element (3) on a second side, opposite to said first side, of said seat (10) .
12.- The device according to any one of Claims 9 to 11, characterized m that it comprises a first body (15) and a second body (16) defining said duct (11) and said seat (10) , respectively; said first body (15) being displaceablε away from and towards said second body (16) between a first position, in which said opening (12) is fluidically connected to said seat (10) , and a second position, m which said opening (12) and said seat (10) are set at a distance apart.
13.- The device according to any one of Claims 9 to 12, characterized in that said circuit (71) comprises a regulating valve (73) and a device (72) for heating said aeriform, and in that at least one between said valve (73) and said device (72) can be governed in closed- loop fashion on the basis of the temperature of said element (3) to vary the pressure and/or the flow rate of said }et.
14.- The device according to any one of Claims 9 to 13, characterized m that it comprises a microchamber (50) surrounding said seat (10), which can be fluidically connected to said duct (11) and to an environment external to said device (1) so that it can be traversed continuously by a ^et of said aeriform advancing between said duct (11) and said external environment .
PCT/IB2010/001850 2009-07-29 2010-07-28 Method and device for temperature conditioning of an element WO2011012976A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
ITTO2009A000581A IT1395263B1 (en) 2009-07-29 2009-07-29 METHOD AND CONDITIONING DEVICE IN TEMPERATURE OF AN ELEMENT
ITTO2009A000581 2009-07-29

Publications (2)

Publication Number Publication Date
WO2011012976A1 true WO2011012976A1 (en) 2011-02-03
WO2011012976A8 WO2011012976A8 (en) 2011-05-05

Family

ID=42313853

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/IB2010/001850 WO2011012976A1 (en) 2009-07-29 2010-07-28 Method and device for temperature conditioning of an element

Country Status (2)

Country Link
IT (1) IT1395263B1 (en)
WO (1) WO2011012976A1 (en)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5516441A (en) * 1978-07-24 1980-02-05 Hitachi Ltd Soldering method of semiconductor pellet
JPS5519823A (en) * 1978-07-27 1980-02-12 Nec Corp Semoconductor element mounting device
JPH0286132U (en) * 1988-12-22 1990-07-09
JPH0750310A (en) * 1993-08-06 1995-02-21 Hitachi Ltd Pellet bonding machine
FR2862425A1 (en) * 2003-11-17 2005-05-20 Giesecke & Devrient Gmbh Chip module fixing method, involves passing coolant to chip module in continuous flow form, and decreasing temperature of coolant using cooling punch during passage of coolant
JP2009076606A (en) * 2007-09-19 2009-04-09 Shibaura Mechatronics Corp Mounting device and mounting method for electronic component
JP2009158718A (en) * 2007-12-26 2009-07-16 Canon Machinery Inc Mounting device for semiconductor chip, and mounting method therefor

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5516441A (en) * 1978-07-24 1980-02-05 Hitachi Ltd Soldering method of semiconductor pellet
JPS5519823A (en) * 1978-07-27 1980-02-12 Nec Corp Semoconductor element mounting device
JPH0286132U (en) * 1988-12-22 1990-07-09
JPH0750310A (en) * 1993-08-06 1995-02-21 Hitachi Ltd Pellet bonding machine
FR2862425A1 (en) * 2003-11-17 2005-05-20 Giesecke & Devrient Gmbh Chip module fixing method, involves passing coolant to chip module in continuous flow form, and decreasing temperature of coolant using cooling punch during passage of coolant
JP2009076606A (en) * 2007-09-19 2009-04-09 Shibaura Mechatronics Corp Mounting device and mounting method for electronic component
JP2009158718A (en) * 2007-12-26 2009-07-16 Canon Machinery Inc Mounting device for semiconductor chip, and mounting method therefor

Also Published As

Publication number Publication date
ITTO20090581A1 (en) 2011-01-30
IT1395263B1 (en) 2012-09-05
WO2011012976A8 (en) 2011-05-05

Similar Documents

Publication Publication Date Title
JP3839401B2 (en) Device heating and cooling device for semiconductor device test handler
US8366315B2 (en) Open-loop vertical drywell gradient correction system and method
KR20070114310A (en) Temperature sensing and prediction in ic sockets
KR101163070B1 (en) A measuring device for thermal conductivity and thermal expansion coefficient at cryogenic temperature and method for simultaneous measurment of thermal conductivity and thermal expansion coefficient
CN105339764A (en) Method for operating a sensor assembly
CN106482752B (en) Sensor device and method for calibrating a sensor device
WO2009045447A3 (en) Gas measuring device and method of operating the same
EP2572252B1 (en) Heating in material testing apparatus
EP3803876A1 (en) Systems and methods for mitigating condensation in a sensor module
WO2011012976A1 (en) Method and device for temperature conditioning of an element
US20110094292A1 (en) Apparatus for air property measurement
EP2771668B1 (en) Environmental test system and method with in-situ temperature sensing of device under test (dut)
JP2008286720A (en) Method for measuring thermal physical properties, and instrument
JP2023178335A (en) Method and system for thermal control of devices in electronics tester
JP5266452B2 (en) Temperature characteristic measuring device
CN102829975B (en) High temperature resistant detection device
WO2020122995A1 (en) High dew point humidity sensor
CN220208154U (en) Gas immersion type high-low temperature test temperature control system
CN216116602U (en) Environment adjusting device and air tightness test system of air tightness test
WO2020049790A1 (en) Gas chromatograph
US6078030A (en) Component heater for use in semiconductor manufacturing equipment
CN105185481B (en) Production of Enamel Wires monitors thermostat with line temperature
JP2008157668A (en) Mounting substrate inspection device, and inspection method therein
CN105911203A (en) Gas chromatograph apparatus and column assembly
JP2013077643A (en) Thermal treatment apparatus

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 10759973

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 10759973

Country of ref document: EP

Kind code of ref document: A1