JPS501651A - - Google Patents
Info
- Publication number
- JPS501651A JPS501651A JP4971573A JP4971573A JPS501651A JP S501651 A JPS501651 A JP S501651A JP 4971573 A JP4971573 A JP 4971573A JP 4971573 A JP4971573 A JP 4971573A JP S501651 A JPS501651 A JP S501651A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/7525—Means for applying energy, e.g. heating means
- H01L2224/753—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/75301—Bonding head
- H01L2224/75302—Shape
- H01L2224/75303—Shape of the pressing surface
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Feeding Of Workpieces (AREA)
- Manipulator (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4971573A JPS501651A (en) | 1973-05-07 | 1973-05-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4971573A JPS501651A (en) | 1973-05-07 | 1973-05-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS501651A true JPS501651A (en) | 1975-01-09 |
Family
ID=12838870
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4971573A Pending JPS501651A (en) | 1973-05-07 | 1973-05-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS501651A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53108371A (en) * | 1977-03-04 | 1978-09-21 | Hitachi Ltd | Pellet attacher |
| JPS5516441A (en) * | 1978-07-24 | 1980-02-05 | Hitachi Ltd | Soldering method of semiconductor pellet |
| JPS6121882U (en) * | 1984-07-12 | 1986-02-08 | 三菱重工業株式会社 | water wheel |
| JPS62234336A (en) * | 1986-09-19 | 1987-10-14 | Hitachi Ltd | Soldering method for semiconductor pellet |
-
1973
- 1973-05-07 JP JP4971573A patent/JPS501651A/ja active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53108371A (en) * | 1977-03-04 | 1978-09-21 | Hitachi Ltd | Pellet attacher |
| JPS5516441A (en) * | 1978-07-24 | 1980-02-05 | Hitachi Ltd | Soldering method of semiconductor pellet |
| JPS6121882U (en) * | 1984-07-12 | 1986-02-08 | 三菱重工業株式会社 | water wheel |
| JPS62234336A (en) * | 1986-09-19 | 1987-10-14 | Hitachi Ltd | Soldering method for semiconductor pellet |