JPS53108371A - Pellet attacher - Google Patents

Pellet attacher

Info

Publication number
JPS53108371A
JPS53108371A JP2272677A JP2272677A JPS53108371A JP S53108371 A JPS53108371 A JP S53108371A JP 2272677 A JP2272677 A JP 2272677A JP 2272677 A JP2272677 A JP 2272677A JP S53108371 A JPS53108371 A JP S53108371A
Authority
JP
Japan
Prior art keywords
pellet
attacher
providing
vacuum
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2272677A
Other languages
Japanese (ja)
Inventor
Takao Nakane
Akira Matsuoka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP2272677A priority Critical patent/JPS53108371A/en
Publication of JPS53108371A publication Critical patent/JPS53108371A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector

Abstract

PURPOSE: To prevent the fluid pellet bonding material from being attached on the semiconductor pellet, by providing the air blow unit in parallel with the vacuum means, in the pellet attacher providing the pellet vacuum absorbing means mounting the semiconductor pellet on the support substrate.
COPYRIGHT: (C)1978,JPO&Japio
JP2272677A 1977-03-04 1977-03-04 Pellet attacher Pending JPS53108371A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2272677A JPS53108371A (en) 1977-03-04 1977-03-04 Pellet attacher

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2272677A JPS53108371A (en) 1977-03-04 1977-03-04 Pellet attacher

Publications (1)

Publication Number Publication Date
JPS53108371A true JPS53108371A (en) 1978-09-21

Family

ID=12090756

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2272677A Pending JPS53108371A (en) 1977-03-04 1977-03-04 Pellet attacher

Country Status (1)

Country Link
JP (1) JPS53108371A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63228728A (en) * 1987-03-18 1988-09-22 Sumitomo Electric Ind Ltd Die bonding equipment for semiconductor chip

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS501651A (en) * 1973-05-07 1975-01-09

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS501651A (en) * 1973-05-07 1975-01-09

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63228728A (en) * 1987-03-18 1988-09-22 Sumitomo Electric Ind Ltd Die bonding equipment for semiconductor chip

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