JPH0564459B2 - - Google Patents

Info

Publication number
JPH0564459B2
JPH0564459B2 JP59176582A JP17658284A JPH0564459B2 JP H0564459 B2 JPH0564459 B2 JP H0564459B2 JP 59176582 A JP59176582 A JP 59176582A JP 17658284 A JP17658284 A JP 17658284A JP H0564459 B2 JPH0564459 B2 JP H0564459B2
Authority
JP
Japan
Prior art keywords
wire
gas
bonding
copper wire
capillary
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59176582A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6154637A (ja
Inventor
Koichiro Atsumi
Tetsuo Ando
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Priority to JP59176582A priority Critical patent/JPS6154637A/ja
Publication of JPS6154637A publication Critical patent/JPS6154637A/ja
Publication of JPH0564459B2 publication Critical patent/JPH0564459B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/0711—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45147—Copper (Cu) as principal constituent
    • H10W72/01551—
    • H10W72/07141—
    • H10W72/075—
    • H10W72/07502—
    • H10W72/07511—
    • H10W72/07532—
    • H10W72/07533—
    • H10W72/50—
    • H10W72/5524—

Landscapes

  • Wire Bonding (AREA)
JP59176582A 1984-08-27 1984-08-27 ワイヤボンデイング方法 Granted JPS6154637A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59176582A JPS6154637A (ja) 1984-08-27 1984-08-27 ワイヤボンデイング方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59176582A JPS6154637A (ja) 1984-08-27 1984-08-27 ワイヤボンデイング方法

Publications (2)

Publication Number Publication Date
JPS6154637A JPS6154637A (ja) 1986-03-18
JPH0564459B2 true JPH0564459B2 (cg-RX-API-DMAC10.html) 1993-09-14

Family

ID=16016079

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59176582A Granted JPS6154637A (ja) 1984-08-27 1984-08-27 ワイヤボンデイング方法

Country Status (1)

Country Link
JP (1) JPS6154637A (cg-RX-API-DMAC10.html)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4845701B2 (ja) * 2006-12-14 2011-12-28 シチズン電子株式会社 シートスイッチモジュール

Also Published As

Publication number Publication date
JPS6154637A (ja) 1986-03-18

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term