JPS6154637A - ワイヤボンデイング方法 - Google Patents

ワイヤボンデイング方法

Info

Publication number
JPS6154637A
JPS6154637A JP59176582A JP17658284A JPS6154637A JP S6154637 A JPS6154637 A JP S6154637A JP 59176582 A JP59176582 A JP 59176582A JP 17658284 A JP17658284 A JP 17658284A JP S6154637 A JPS6154637 A JP S6154637A
Authority
JP
Japan
Prior art keywords
wire
gas
bonding
copper wire
copper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59176582A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0564459B2 (cg-RX-API-DMAC10.html
Inventor
Koichiro Atsumi
幸一郎 渥美
Tetsuo Ando
安藤　鉄男
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP59176582A priority Critical patent/JPS6154637A/ja
Publication of JPS6154637A publication Critical patent/JPS6154637A/ja
Publication of JPH0564459B2 publication Critical patent/JPH0564459B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/0711—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45147—Copper (Cu) as principal constituent
    • H10W72/01551—
    • H10W72/07141—
    • H10W72/075—
    • H10W72/07502—
    • H10W72/07511—
    • H10W72/07532—
    • H10W72/07533—
    • H10W72/50—
    • H10W72/5524—

Landscapes

  • Wire Bonding (AREA)
JP59176582A 1984-08-27 1984-08-27 ワイヤボンデイング方法 Granted JPS6154637A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59176582A JPS6154637A (ja) 1984-08-27 1984-08-27 ワイヤボンデイング方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59176582A JPS6154637A (ja) 1984-08-27 1984-08-27 ワイヤボンデイング方法

Publications (2)

Publication Number Publication Date
JPS6154637A true JPS6154637A (ja) 1986-03-18
JPH0564459B2 JPH0564459B2 (cg-RX-API-DMAC10.html) 1993-09-14

Family

ID=16016079

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59176582A Granted JPS6154637A (ja) 1984-08-27 1984-08-27 ワイヤボンデイング方法

Country Status (1)

Country Link
JP (1) JPS6154637A (cg-RX-API-DMAC10.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008152951A (ja) * 2006-12-14 2008-07-03 Citizen Electronics Co Ltd シートスイッチモジュール

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008152951A (ja) * 2006-12-14 2008-07-03 Citizen Electronics Co Ltd シートスイッチモジュール

Also Published As

Publication number Publication date
JPH0564459B2 (cg-RX-API-DMAC10.html) 1993-09-14

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term