JPH052739B2 - - Google Patents
Info
- Publication number
- JPH052739B2 JPH052739B2 JP58217136A JP21713683A JPH052739B2 JP H052739 B2 JPH052739 B2 JP H052739B2 JP 58217136 A JP58217136 A JP 58217136A JP 21713683 A JP21713683 A JP 21713683A JP H052739 B2 JPH052739 B2 JP H052739B2
- Authority
- JP
- Japan
- Prior art keywords
- target
- support plate
- cooling water
- cooling
- brazed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
- Electrodes Of Semiconductors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21713683A JPS60110873A (ja) | 1983-11-17 | 1983-11-17 | タ−ゲットの冷却方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21713683A JPS60110873A (ja) | 1983-11-17 | 1983-11-17 | タ−ゲットの冷却方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60110873A JPS60110873A (ja) | 1985-06-17 |
| JPH052739B2 true JPH052739B2 (enrdf_load_stackoverflow) | 1993-01-13 |
Family
ID=16699414
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21713683A Granted JPS60110873A (ja) | 1983-11-17 | 1983-11-17 | タ−ゲットの冷却方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60110873A (enrdf_load_stackoverflow) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6279870U (enrdf_load_stackoverflow) * | 1985-11-05 | 1987-05-21 | ||
| US5180478A (en) * | 1990-12-19 | 1993-01-19 | Intevac, Inc. | Sputter coating source |
| TWI361842B (en) * | 2002-10-24 | 2012-04-11 | Honeywell Int Inc | Target designs and related methods for nehanced cooling and reduced deflection and deformation |
| EP1903123B1 (de) | 2004-11-19 | 2012-02-22 | Applied Materials GmbH & Co. KG | Trägerplatte mit einer darauf aufgesetzten gekühlten Rückenplatte |
| US7799190B2 (en) * | 2005-04-14 | 2010-09-21 | Tango Systems, Inc. | Target backing plate for sputtering system |
| JP6636796B2 (ja) * | 2015-12-24 | 2020-01-29 | 株式会社アルバック | スパッタリング装置及びスパッタリング方法 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5677380A (en) * | 1979-11-28 | 1981-06-25 | Hitachi Ltd | Sputtering apparatus |
| JPS5949308B2 (ja) * | 1980-02-07 | 1984-12-01 | 日電アネルバ株式会社 | スパッタ装置 |
-
1983
- 1983-11-17 JP JP21713683A patent/JPS60110873A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60110873A (ja) | 1985-06-17 |
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