JPH0526763Y2 - - Google Patents

Info

Publication number
JPH0526763Y2
JPH0526763Y2 JP8432387U JP8432387U JPH0526763Y2 JP H0526763 Y2 JPH0526763 Y2 JP H0526763Y2 JP 8432387 U JP8432387 U JP 8432387U JP 8432387 U JP8432387 U JP 8432387U JP H0526763 Y2 JPH0526763 Y2 JP H0526763Y2
Authority
JP
Japan
Prior art keywords
mold
molded
die
lead frame
die pad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP8432387U
Other languages
English (en)
Japanese (ja)
Other versions
JPS63193853U (US08080257-20111220-C00005.png
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP8432387U priority Critical patent/JPH0526763Y2/ja
Publication of JPS63193853U publication Critical patent/JPS63193853U/ja
Application granted granted Critical
Publication of JPH0526763Y2 publication Critical patent/JPH0526763Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP8432387U 1987-05-29 1987-05-29 Expired - Lifetime JPH0526763Y2 (US08080257-20111220-C00005.png)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8432387U JPH0526763Y2 (US08080257-20111220-C00005.png) 1987-05-29 1987-05-29

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8432387U JPH0526763Y2 (US08080257-20111220-C00005.png) 1987-05-29 1987-05-29

Publications (2)

Publication Number Publication Date
JPS63193853U JPS63193853U (US08080257-20111220-C00005.png) 1988-12-14
JPH0526763Y2 true JPH0526763Y2 (US08080257-20111220-C00005.png) 1993-07-07

Family

ID=30938721

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8432387U Expired - Lifetime JPH0526763Y2 (US08080257-20111220-C00005.png) 1987-05-29 1987-05-29

Country Status (1)

Country Link
JP (1) JPH0526763Y2 (US08080257-20111220-C00005.png)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6717361B2 (ja) * 2018-11-27 2020-07-01 日亜化学工業株式会社 発光装置及びその製造方法

Also Published As

Publication number Publication date
JPS63193853U (US08080257-20111220-C00005.png) 1988-12-14

Similar Documents

Publication Publication Date Title
EP0063811B1 (en) A method for manufacturing a plastic encapsulated semiconductor device
US4861251A (en) Apparatus for encapsulating selected portions of a printed circuit board
JP5146711B2 (ja) 樹脂封止品製造方法及びケース
JPH0526763Y2 (US08080257-20111220-C00005.png)
JPH02184040A (ja) 半導体装置の製造方法
JP2936679B2 (ja) 樹脂封止型半導体装置の製造方法及び封止用金型
JP2001338940A (ja) 半導体icの樹脂モールド装置および樹脂モールド方法
JPH06163615A (ja) 半導体装置の製造方法
JP2604054B2 (ja) 半導体装置の製造方法
JP2514818B2 (ja) 集積回路基板の樹脂封止方法
JP2001298032A (ja) 半導体パッケージとその製造方法
JP2624536B2 (ja) 複数の接続導電リードを有する電気部品の製造方法およびその製造方法に用いる製造型
JP2572841Y2 (ja) 半導体装置の製造に用いる樹脂封止用金型
JP2589184B2 (ja) 半導体装置の製造方法
JPS639962Y2 (US08080257-20111220-C00005.png)
JP3335792B2 (ja) 電子部品の樹脂モールド方法およびその樹脂モールド装置
JP2568479Y2 (ja) 静電記録ヘッド
JP2560194B2 (ja) パッケージ型半導体装置の製造方法
JP2000174171A (ja) パッケージ部設置用回路基板
JPH0812877B2 (ja) 樹脂封止型半導体装置の製造方法
JPH0521887Y2 (US08080257-20111220-C00005.png)
JP2714002B2 (ja) 樹脂封止型半導体装置の製造方法
JPH03152964A (ja) 樹脂封止型半導体装置用リードフレーム
JP2532421Y2 (ja) 樹脂モールド装置
JPS63237422A (ja) レジンモ−ルド半導体の製造方法