JPH0524216B2 - - Google Patents
Info
- Publication number
- JPH0524216B2 JPH0524216B2 JP62150009A JP15000987A JPH0524216B2 JP H0524216 B2 JPH0524216 B2 JP H0524216B2 JP 62150009 A JP62150009 A JP 62150009A JP 15000987 A JP15000987 A JP 15000987A JP H0524216 B2 JPH0524216 B2 JP H0524216B2
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- lead
- conductivity
- semiconductor
- properties
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000463 material Substances 0.000 claims description 24
- 239000004065 semiconductor Substances 0.000 claims description 15
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 7
- 229910052802 copper Inorganic materials 0.000 claims description 7
- 229910052760 oxygen Inorganic materials 0.000 claims description 7
- 239000001301 oxygen Substances 0.000 claims description 7
- 238000007747 plating Methods 0.000 claims description 6
- 229910052726 zirconium Inorganic materials 0.000 claims description 5
- 238000010438 heat treatment Methods 0.000 claims description 3
- 238000001556 precipitation Methods 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims 1
- 229910052737 gold Inorganic materials 0.000 claims 1
- 239000012535 impurity Substances 0.000 claims 1
- 239000010949 copper Substances 0.000 description 14
- 230000007423 decrease Effects 0.000 description 8
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 230000003647 oxidation Effects 0.000 description 6
- 238000007254 oxidation reaction Methods 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 239000000654 additive Substances 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 229910052718 tin Inorganic materials 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 238000005097 cold rolling Methods 0.000 description 1
- 238000009749 continuous casting Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000005098 hot rolling Methods 0.000 description 1
- 230000005764 inhibitory process Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 239000010970 precious metal Substances 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15000987A JPS63312934A (ja) | 1987-06-16 | 1987-06-16 | 半導体用リ−ドフレ−ム材 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15000987A JPS63312934A (ja) | 1987-06-16 | 1987-06-16 | 半導体用リ−ドフレ−ム材 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP27836792A Division JPH05255777A (ja) | 1992-10-16 | 1992-10-16 | 半導体用リードフレーム材 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63312934A JPS63312934A (ja) | 1988-12-21 |
| JPH0524216B2 true JPH0524216B2 (zh) | 1993-04-07 |
Family
ID=15487481
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15000987A Granted JPS63312934A (ja) | 1987-06-16 | 1987-06-16 | 半導体用リ−ドフレ−ム材 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63312934A (zh) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10350303B1 (en) | 2011-06-08 | 2019-07-16 | Translate Bio, Inc. | Lipid nanoparticle compositions and methods for mRNA delivery |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2714561B2 (ja) * | 1988-12-24 | 1998-02-16 | 日鉱金属株式会社 | ダイレクトボンディング性の良好な銅合金 |
| JP2780322B2 (ja) * | 1989-04-04 | 1998-07-30 | 日立電線株式会社 | メタルガスケット |
| JPH04165055A (ja) * | 1990-10-29 | 1992-06-10 | Hitachi Cable Ltd | 半導体装置用リードフレーム材 |
| JPH083664A (ja) * | 1994-06-20 | 1996-01-09 | Mitsubishi Materials Corp | 真空装置用部材および真空装置 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54104597A (en) * | 1978-02-03 | 1979-08-16 | Nippon Mining Co | Copper alloy for lead frame |
| JPS54114078A (en) * | 1978-02-24 | 1979-09-05 | Hitachi Cable Ltd | Lead material for semiconductor apparatus |
| JPS58141544A (ja) * | 1982-02-17 | 1983-08-22 | Toshiba Corp | 電子部品 |
| JPS59193233A (ja) * | 1983-04-15 | 1984-11-01 | Toshiba Corp | 銅合金 |
-
1987
- 1987-06-16 JP JP15000987A patent/JPS63312934A/ja active Granted
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54104597A (en) * | 1978-02-03 | 1979-08-16 | Nippon Mining Co | Copper alloy for lead frame |
| JPS54114078A (en) * | 1978-02-24 | 1979-09-05 | Hitachi Cable Ltd | Lead material for semiconductor apparatus |
| JPS58141544A (ja) * | 1982-02-17 | 1983-08-22 | Toshiba Corp | 電子部品 |
| JPS59193233A (ja) * | 1983-04-15 | 1984-11-01 | Toshiba Corp | 銅合金 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10350303B1 (en) | 2011-06-08 | 2019-07-16 | Translate Bio, Inc. | Lipid nanoparticle compositions and methods for mRNA delivery |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63312934A (ja) | 1988-12-21 |
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