JPH0521902Y2 - - Google Patents
Info
- Publication number
- JPH0521902Y2 JPH0521902Y2 JP1987191429U JP19142987U JPH0521902Y2 JP H0521902 Y2 JPH0521902 Y2 JP H0521902Y2 JP 1987191429 U JP1987191429 U JP 1987191429U JP 19142987 U JP19142987 U JP 19142987U JP H0521902 Y2 JPH0521902 Y2 JP H0521902Y2
- Authority
- JP
- Japan
- Prior art keywords
- flat pack
- pack component
- frame
- circuit board
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 230000003014 reinforcing effect Effects 0.000 claims description 14
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 11
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 230000000694 effects Effects 0.000 description 3
- 238000005476 soldering Methods 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987191429U JPH0521902Y2 (ko) | 1987-12-18 | 1987-12-18 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987191429U JPH0521902Y2 (ko) | 1987-12-18 | 1987-12-18 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0195778U JPH0195778U (ko) | 1989-06-26 |
JPH0521902Y2 true JPH0521902Y2 (ko) | 1993-06-04 |
Family
ID=31482341
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1987191429U Expired - Lifetime JPH0521902Y2 (ko) | 1987-12-18 | 1987-12-18 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0521902Y2 (ko) |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63181396A (ja) * | 1987-01-23 | 1988-07-26 | 株式会社東芝 | 半導体の実装方法 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5889943U (ja) * | 1981-12-14 | 1983-06-17 | 株式会社精工舎 | Icなどの取付構造 |
JPS59180434U (ja) * | 1983-05-20 | 1984-12-01 | パイオニア株式会社 | フラツトパツケ−ジic用ソケツト |
JPS6420693A (en) * | 1987-07-15 | 1989-01-24 | Fujitsu General Ltd | Ic mounting device |
-
1987
- 1987-12-18 JP JP1987191429U patent/JPH0521902Y2/ja not_active Expired - Lifetime
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63181396A (ja) * | 1987-01-23 | 1988-07-26 | 株式会社東芝 | 半導体の実装方法 |
Also Published As
Publication number | Publication date |
---|---|
JPH0195778U (ko) | 1989-06-26 |
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