JPH0451484Y2 - - Google Patents
Info
- Publication number
- JPH0451484Y2 JPH0451484Y2 JP536086U JP536086U JPH0451484Y2 JP H0451484 Y2 JPH0451484 Y2 JP H0451484Y2 JP 536086 U JP536086 U JP 536086U JP 536086 U JP536086 U JP 536086U JP H0451484 Y2 JPH0451484 Y2 JP H0451484Y2
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor element
- mounting
- conductor circuit
- cap
- fixed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 claims description 49
- 239000004020 conductor Substances 0.000 claims description 48
- 239000000758 substrate Substances 0.000 claims description 22
- 239000000463 material Substances 0.000 claims description 13
- 229920005989 resin Polymers 0.000 description 8
- 239000011347 resin Substances 0.000 description 8
- 238000000034 method Methods 0.000 description 6
- 229910000679 solder Inorganic materials 0.000 description 6
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 238000007747 plating Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 230000035939 shock Effects 0.000 description 2
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000004382 potting Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP536086U JPH0451484Y2 (ko) | 1986-01-18 | 1986-01-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP536086U JPH0451484Y2 (ko) | 1986-01-18 | 1986-01-18 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62192664U JPS62192664U (ko) | 1987-12-08 |
| JPH0451484Y2 true JPH0451484Y2 (ko) | 1992-12-03 |
Family
ID=30786871
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP536086U Expired JPH0451484Y2 (ko) | 1986-01-18 | 1986-01-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0451484Y2 (ko) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0278253A (ja) * | 1988-09-14 | 1990-03-19 | Matsushita Electric Works Ltd | 多層プラスチックチップキャリア |
-
1986
- 1986-01-18 JP JP536086U patent/JPH0451484Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62192664U (ko) | 1987-12-08 |
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