JPH0451484Y2 - - Google Patents

Description

[Detailed Description of the Invention] (Industrial Application Field) The present invention relates to a semiconductor element mounting substrate used in a semiconductor device.

(Prior art) This type of substrate for mounting semiconductor elements mounts and fixes the semiconductor element on the mounting part, and also connects the semiconductor element and the conductor circuit formed on the substrate electrically using bonding wire or the like. It can be connected and used as a semiconductor device. by the way,
The semiconductor elements, conductor circuits, and bonding wires mounted on this board are highly susceptible to external shocks and moisture in the air, so they must be protected using various methods. There must be.

Such protection of semiconductor elements and the like is normally performed in the following manner. That is, either a sealing resin is dropped onto the area that requires protection (usually in the vicinity of the semiconductor element), or the entire area that requires protection is covered with a metal cap or the like. In particular, when sealing resin is dripped to protect the area, it is necessary to install weir members, such as the one shown in Figure 1, around the necessary areas to prevent the dripped resin from leaking to other areas. The above-mentioned resin is dripped into the area surrounded by this weir member. In any case, in order to protect the semiconductor element, etc., a cap or a weir member is often fixed near the semiconductor element, but this fixing is performed further above each conductor circuit formed on the substrate. This is because the cap and weir members cannot be fixed until after the conductor circuit is formed.

By the way, it goes without saying that these caps and weir members must be securely fixed. Since the resin in these caps and weir members is originally intended to protect semiconductor elements from external shocks and moisture, gaps may be created between these caps and weir members and the substrate side after they are fixed. must not. For this purpose, it is preferable that the portions where the cap or weir member is fixed have small irregularities. Therefore, securely fixing these caps and weir members means reducing the unevenness of the fixed parts of these caps and weir members so that there are no gaps between the caps and weir members and the board after they are fixed. That's true.

However, these conventional caps and weir members 30
As shown in FIGS. 9 to 11, it is fixed by pasting it on the upper side of each conductor circuit 31 via an adhesive previously formed on the lower surface and a solder resist on the conductor circuit. That's what I was doing. To explain this conventional pasting state in detail, FIG. 9 is a plan view showing the state before the cap and weir member 30 are fixed, and the fixed portion 3 shown in broken lines in FIG.
2 corresponds to the bonded portion of the cap or weir member 30. The end of each conductor circuit 31 is disposed toward the center of the fixed portion 32 (where a mounting portion 33 for a semiconductor element is formed) indicated by the broken line. If the ends of the conductor circuits 31 are arranged so as to be concentrated at one point, the spacing between the conductor circuits 31 will naturally vary. That is, if we look at the spacing between the conductor circuits 31 in the fixed portion 32, there are wide portions and narrow portions as shown in FIG. 10. When a cap or weir member 30 is fixed to such a state as shown in FIG. 11, each conductor circuit 31
The gap 34 due to variations in the spacing between
will occur. Such a gap 3
If 4 occurs, as described above, there is no point in fixing the cap or dam member 30 to the substrate for the purpose of protecting the semiconductor elements or the like.

Incidentally, in order to avoid the occurrence of the gap 34 as described above, it is conceivable to increase the thickness of the adhesive sheet fixed to the lower surface of the cap or weir member 30.
However, if the thickness of the adhesive sheet is increased in this way, when the cap or weir member 30 is fixed, the excess portion of the adhesive sheet will protrude from the cap or weir member 30, and this protruding portion may be applied to the bonding pad connected to the semiconductor element, making the electrical connection impossible. Furthermore, if the sealing resin is filled in such a state, bubbles may be generated that have an adverse effect on the protection of semiconductor elements and the like.

(Problems to be solved by the invention) This invention was made in view of the above-mentioned actual situation, and the problem to be solved is that it is difficult to fix caps and weir members on a board on which a conductive circuit is formed. This is the gap that occurs when

The purpose of the present invention is to make the spacing between each conductor circuit approximately equal by forming appropriate support protrusions between each conductor circuit, thereby ensuring the fixation of the cap and weir member to the board. An object of the present invention is to provide a substrate for mounting a semiconductor element, which can reliably protect semiconductor elements and the like.

(Means for Solving the Problems) In order to solve the above problems, the means taken by the present invention will be explained with reference to FIGS. 1 to 8 corresponding to the embodiments. The semiconductor element 13 A substrate for mounting a semiconductor element, which has a mounting part 12 for mounting the semiconductor element, and has a plurality of conductor circuits 14 raised to a predetermined height in order to be connected to the semiconductor element 13 near the mounting part 12. Each conductor circuit 14 in the vicinity of the portion 12
The substrate 10 for mounting a semiconductor element is characterized in that a support protrusion 20 having the same height as each conductor circuit 14 is formed in between so as not to interfere with each conductor circuit 14.

In short, in this method, if no treatment is performed between the conductor circuits 14, variations will occur in the spacing between the conductor circuits 14, but this variation can be corrected by forming the support protrusions 20 between the conductor circuits 14. It was resolved by this.

(Function of the invention) By adopting the above-described measures, the semiconductor element mounting substrate 10 according to the present invention has the following effects. That is, as shown in FIGS. 3 to 5, a support protrusion 20 having the same height as each conductor circuit 14 is provided between each conductor circuit 14 in the vicinity of the mounting portion 12. By forming it so that it does not interfere with the circuit 14, there is no interference between the conductor circuits 14, especially in the fixing portion 18 for fixing the cap 16 or the weir member 17, as shown in FIGS. 4 and 5. The intervals that occur in the above are equalized. Since it is in such a state, when the cap 16 or weir member 17 is fixed on top of it, the lower surface of each cap 16 or weir member 17 will be attached to the solder located below, as shown in FIG. It adapts very well to the resist 15a and the like. That is, a cap 16 or a weir member 17 is placed above each conductor circuit 14.
This prevents the formation of gaps that allow moisture to pass through, which was a problem in the past, even when the material is fixed.

(Example) Next, the present invention will be explained in more detail based on a specific example shown in the drawings.

1 and 2 both show a semiconductor element mounting board 10 according to the present invention, and in the case of the semiconductor element mounting board 10 shown in FIG. This is the second
The semiconductor element mounting substrate 10 shown in the figure has a cap 16 fixed to a fixed portion 18. In any case, each of these semiconductor element mounting substrates 1
0, the semiconductor element 1 is located approximately at the center of the base material 11.
A mounting portion 12 is formed for mounting 3.
The ends of each conductor circuit 14 are concentrated near this mounting portion 12. In addition, each conductor circuit 14
Since it is formed on the surface of the base material 11 by pasting or etching, it is raised to a predetermined height.

Between each conductor circuit 14, there is a support protrusion 20 having the same height as each conductor circuit 14, which is raised to a predetermined height, as shown in black in each figure. are formed so as not to interfere with each other. Various methods can be considered for forming each of these support protrusions 20, but in this example, they are formed from the same material as each conductor circuit 14. Moreover, each support protrusion 20 formed of the same material as the conductor circuit 14 in this way
It is formed simultaneously during the pasting or etching process of step 4. Note that each support protrusion 20 corresponds to each conductor circuit 1.
It is possible to separately form and configure it from a material different from 4.

Further, each support protrusion 20 is for preventing a gap from being formed below the cap 16 or the weir member 17 when the cap 16 or the weir member 17 is fixed to the fixed portion 18, for example. Fixed portion 18 shown in broken lines as shown in FIG.
Although it may be a part protruding from the fixing part 18, it is formed only in at least a part corresponding to the fixed part 18.

Furthermore, each support protrusion 20 may be formed linearly as shown in FIG. It may be formed and implemented. In the example shown in FIG. 6, the tip of each support protrusion 20 is in contact with each conductor circuit 14. In this case, the other end of each support protrusion 20 is connected to the conductor circuit 14.
It can be used for electrical connections as well. In the case of the example shown in FIG. 7, the tip portion of each support protrusion 20 is formed along the inner line of the fixed portion 18, and when formed in this way, the spacing between each conductor circuit 14 is substantially reduced. can be brought close to zero. In the case of the example shown in FIG. 8, each support protrusion 2
0 is formed only in the portion corresponding to the fixed portion 18. In this case, the material for each support protrusion 20 can be kept to the necessary minimum.

Base material 1 with each support protrusion 20 formed as described above
1, a solder resist 15a was printed as shown in FIG. This solder resist 15
As shown in FIG.
Cap 16 or weir member 1 to which 5b is temporarily attached
7 were joined and integrated by a method such as pressing.

Next, an example will be described in which the materials of each member are specifically formed.

Example 1 A conductor circuit 14 for connecting to a semiconductor element 13 and a support protrusion 20 were simultaneously formed using the same material on a copper-clad laminate made of glass epoxy resin by a conventional method. After that, solder resist 1 is applied except for the mounting portion 12 and the tip of each conductor circuit 14.
5a was printed. Then, conventional electrolytic nickel plating and gold plating were applied.

The weir member 17 to which the adhesive sheet 15b was temporarily bonded was integrally bonded to this semiconductor element mounting substrate 10 by pressing.

Example 2 On a copper-clad laminate made of glass triazine resin, a conductive circuit 14 for connection to a semiconductor element 13 and a support protrusion 20 were simultaneously formed of the same material by a conventional method. Thereafter, a solder resist 15a was printed except for the mounting portion 12 and the tip portions of each conductive circuit 14. Then, conventional electrolytic nickel plating and gold plating were applied.

After the semiconductor element 13 was fixed to the mounting portion 12 of the semiconductor element mounting substrate 10 with silver paste, wire bonding was performed. After the top of the semiconductor element 13 was sealed with a potting resin, the whole was further sealed with a cap 16 made of aluminum.

(Effects of the Invention) As described above, the semiconductor element mounting board 10 according to the present invention has the mounting part 12 for mounting the semiconductor element 13, and the semiconductor element 13 in the vicinity of the mounting part 12. In a substrate for mounting a semiconductor element on which a plurality of conductor circuits 14 are formed that are raised to a predetermined height in order to be connected to the conductor circuits 14 in the vicinity of the mounting portion 12,
The feature is that a support protrusion 20 having the same height as each conductor circuit 14 is formed between the conductor circuits 14 so as not to interfere with each conductor circuit 14, thereby reducing the spacing between each conductor circuit. This makes it possible to provide a substrate for mounting a semiconductor element, which can securely fix the cap or weir member to the substrate and reliably protect the semiconductor element, etc.

[Brief explanation of the drawing]

FIG. 1 is a perspective view of a substrate for mounting a semiconductor element according to the present invention, FIG. 2 is a perspective view showing another example, FIG. 3 is an enlarged partial plan view of the main part of FIG. Figure 5 is an enlarged vertical cross-sectional view of the portion indicated by the - line in the figure, Figure 5 is a vertical cross-sectional view showing the state in which the cap or weir member is fixed to the one shown in Figure 4, and Figures 6 to 8 are each of the support protrusions. The third example shows a different method of forming
FIG. 3 is a partial plan view corresponding to the figure. Figures 9 to 11
The figure shows a conventional example, and FIG. 9 shows the third
10 is a longitudinal sectional view corresponding to FIG. 4, and FIG. 11 is a longitudinal sectional view corresponding to FIG. 5. Explanation of symbols, 10...Semiconductor element mounting substrate,
DESCRIPTION OF SYMBOLS 11... Base material, 12... Mounting part, 13... Semiconductor element, 14... Conductor circuit, 16... Cap, 1
7...Weir member, 18... Fixed portion, 20... Support protrusion.

Claims (1)

[Claims for Utility Model Registration] 1) Having a mounting part for mounting a semiconductor element, and forming a plurality of conductor circuits raised to a predetermined height in the vicinity of this mounting part to be connected to the semiconductor element. In the substrate for mounting a semiconductor element, support protrusions having the same height as each of the conductor circuits are provided in the vicinity of the mounting portion and between the conductor circuits so as not to interfere with each of the conductor circuits. A substrate for mounting a semiconductor element, characterized in that: 2) The substrate for mounting a semiconductor element according to claim 1, wherein the support protrusion is formed of the same material as each of the conductor circuits.