JPH0521706B2 - - Google Patents
Info
- Publication number
- JPH0521706B2 JPH0521706B2 JP59099052A JP9905284A JPH0521706B2 JP H0521706 B2 JPH0521706 B2 JP H0521706B2 JP 59099052 A JP59099052 A JP 59099052A JP 9905284 A JP9905284 A JP 9905284A JP H0521706 B2 JPH0521706 B2 JP H0521706B2
- Authority
- JP
- Japan
- Prior art keywords
- workpiece
- polishing
- holder
- rotating
- chamfering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000005498 polishing Methods 0.000 claims description 81
- 238000005520 cutting process Methods 0.000 claims description 7
- 238000000034 method Methods 0.000 description 29
- 238000003754 machining Methods 0.000 description 14
- 238000007517 polishing process Methods 0.000 description 11
- 230000010355 oscillation Effects 0.000 description 5
- 238000004140 cleaning Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 230000007246 mechanism Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000004804 winding Methods 0.000 description 3
- 230000005489 elastic deformation Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000004506 ultrasonic cleaning Methods 0.000 description 2
- 239000006061 abrasive grain Substances 0.000 description 1
- 238000010923 batch production Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
Landscapes
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9905284A JPS60242951A (ja) | 1984-05-17 | 1984-05-17 | 面取り加工システム |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9905284A JPS60242951A (ja) | 1984-05-17 | 1984-05-17 | 面取り加工システム |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60242951A JPS60242951A (ja) | 1985-12-02 |
| JPH0521706B2 true JPH0521706B2 (pl) | 1993-03-25 |
Family
ID=14236818
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9905284A Granted JPS60242951A (ja) | 1984-05-17 | 1984-05-17 | 面取り加工システム |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60242951A (pl) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7943439B2 (en) | 2008-05-22 | 2011-05-17 | Fuji Electric Systems Co., Ltd. | Method for manufacturing semiconductor apparatus |
| JP2019130642A (ja) * | 2018-02-01 | 2019-08-08 | 株式会社松田製作所 | 円筒研磨装置 |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5094037A (en) * | 1989-10-03 | 1992-03-10 | Speedfam Company, Ltd. | Edge polisher |
| CN105773358B (zh) * | 2016-03-28 | 2018-06-26 | 福建好饰家竹业有限公司 | 一种板材倒角抛光的装置 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5834751A (ja) * | 1981-08-21 | 1983-03-01 | Hitachi Seiko Ltd | ウエハ研削盤 |
| JPS58169323A (ja) * | 1982-03-30 | 1983-10-05 | Sanshin Shoko:Kk | フレキシブルディスクヘッドの自動ｒ面取研摩方法及びその装置 |
-
1984
- 1984-05-17 JP JP9905284A patent/JPS60242951A/ja active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5834751A (ja) * | 1981-08-21 | 1983-03-01 | Hitachi Seiko Ltd | ウエハ研削盤 |
| JPS58169323A (ja) * | 1982-03-30 | 1983-10-05 | Sanshin Shoko:Kk | フレキシブルディスクヘッドの自動ｒ面取研摩方法及びその装置 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7943439B2 (en) | 2008-05-22 | 2011-05-17 | Fuji Electric Systems Co., Ltd. | Method for manufacturing semiconductor apparatus |
| JP2019130642A (ja) * | 2018-02-01 | 2019-08-08 | 株式会社松田製作所 | 円筒研磨装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60242951A (ja) | 1985-12-02 |
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