JPH05206331A - Resin composition for sealing semiconductor - Google Patents
Resin composition for sealing semiconductorInfo
- Publication number
- JPH05206331A JPH05206331A JP1482292A JP1482292A JPH05206331A JP H05206331 A JPH05206331 A JP H05206331A JP 1482292 A JP1482292 A JP 1482292A JP 1482292 A JP1482292 A JP 1482292A JP H05206331 A JPH05206331 A JP H05206331A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- epoxy resin
- formula
- curing agent
- represented
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明は、半導体デバイスの表面
実装化における耐半田ストレス性に優れた半導体封止用
エポキシ樹脂組成物に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an epoxy resin composition for semiconductor encapsulation which is excellent in resistance to solder stress in surface mounting semiconductor devices.
【0002】[0002]
【従来の技術】従来、ダイオード、トランジスター、集
積回路などの電子部品は熱硬化性樹脂で封止されている
が、特に集積回路では耐熱性、耐湿性に優れたオルソク
レゾールノボラックエポキシ樹脂をノボラック型フェノ
ール樹脂で硬化させるエポキシ樹脂が用いられている。
しかし、近年、集積回路の高集積化に伴いチップの大型
化、パッケージの軽薄短小化が進み、実装法の表面実装
化が進んできた。2. Description of the Related Art Conventionally, electronic parts such as diodes, transistors and integrated circuits have been encapsulated with thermosetting resin. Especially in integrated circuits, orthocresol novolac epoxy resin, which has excellent heat resistance and moisture resistance, is used as a novolac type resin. An epoxy resin that is cured with a phenol resin is used.
However, in recent years, with the high integration of integrated circuits, the size of chips has become larger, and the package has become lighter, thinner, shorter, and smaller, and the surface mounting method has been advanced.
【0003】即ち大型チップを小型で薄いパッケージに
封入することになり、応力によるクラック発生、それに
伴う耐湿性の低下などの問題が大きくクローズアップさ
れてきている。特に半田付け工程において急激に200
℃以上の高温にさらされることによりパッケージの割れ
や樹脂とチップの剥離により耐湿性が劣化してしまうと
いった問題がでてきている。そのため、耐半田ストレス
性、耐湿性に優れた封止用樹脂組成物の開発が望まれて
いる。これらの問題を解決するために半田付け時の熱衝
撃を緩和する目的で、熱可塑性オリゴマーの添加(特開
昭62−115849号公報)や各種シリコーン化合物
の添加(特開昭62−115850号公報、62−11
6654号公報、62−128162号公報)、更には
シリコーン変性(特開昭62−136860号公報)な
どの手法で対処しているがいずれも半田付け時にパッケ
ージにクラックが生じてしまい信頼性の優れた半導体樹
脂組成物を得るまでには至らなかった。That is, a large chip is to be enclosed in a small and thin package, and problems such as cracking due to stress and accompanying deterioration of moisture resistance have been greatly highlighted. Especially in the soldering process
There is a problem that the moisture resistance is deteriorated due to cracking of the package and peeling of the chip from the resin when exposed to a high temperature of ℃ or more. Therefore, development of a sealing resin composition having excellent solder stress resistance and moisture resistance is desired. In order to solve these problems, for the purpose of mitigating thermal shock at the time of soldering, addition of a thermoplastic oligomer (JP-A-62-15849) and addition of various silicone compounds (JP-A-62-115850). , 62-11
6654, 62-128162) and further silicone modification (Japanese Patent Laid-Open No. 62-136860). However, in both cases, the package is cracked during soldering and the reliability is excellent. It was not possible to obtain a semiconductor resin composition.
【0004】一方、耐半田ストレス性に優れた耐熱性エ
ポキシ樹脂組成物を得るために、樹脂系としては多官能
エポキシ樹脂の使用(特開昭62−168620号公
報)等により耐熱性の向上が検討されてきたが、特に2
00〜300℃のような高温にさらされた場合において
は耐半田ストレス性が不十分であった。On the other hand, in order to obtain a heat-resistant epoxy resin composition having excellent solder stress resistance, heat resistance is improved by using a polyfunctional epoxy resin as a resin system (Japanese Patent Laid-Open No. 168620/1987). It has been examined, but especially 2
When exposed to a high temperature such as 00 to 300 ° C, the solder stress resistance was insufficient.
【0005】[0005]
【発明が解決しようとする課題】本発明は、このような
問題に対して耐半田ストレス性及び耐湿性に優れた半導
体封止用樹脂組成物を提供するものである。SUMMARY OF THE INVENTION The present invention provides a resin composition for semiconductor encapsulation which is excellent in solder stress resistance and moisture resistance against such problems.
【0006】[0006]
【課題を解決するための手段】本発明者らは、これらの
問題を解決するために鋭意研究を進め、次の組成を持つ
樹脂組成物を見いだした。即ち、本発明は、(A)式
(1)で示される3、3’、5、5’−テトラメチル−
4、4’−ジヒドロキシビフェニルグリシジルエーテル
と式(2)で示される4、4’−ジヒドロキシビフェニ
ルグリシジルエーテルの重量比が式(1)/式(2)=
1/3〜3/1であるエポキシ樹脂を総エポキシ樹脂量
に対して50〜100重量%含むエポキシ樹脂、[Means for Solving the Problems] The inventors of the present invention have conducted extensive studies to solve these problems and found a resin composition having the following composition. That is, the present invention provides 3,3 ′, 5,5′-tetramethyl- (A) represented by the formula (1).
The weight ratio of 4,4′-dihydroxybiphenyl glycidyl ether to 4,4′-dihydroxybiphenyl glycidyl ether represented by the formula (2) is represented by the formula (1) / the formula (2) =
An epoxy resin containing 50 to 100% by weight of an epoxy resin of 1/3 to 3/1 with respect to the total amount of epoxy resin,
【0007】[0007]
【化5】 [Chemical 5]
【0008】[0008]
【化6】 [Chemical 6]
【0009】(B)フェノール樹脂硬化剤として、式
(3)で示されるαナフトール樹脂硬化剤または/およ
び式(4)で示されるβナフトール樹脂硬化剤を総フェ
ノール樹脂硬化剤量に対して30〜100重量%含むフ
ェノール樹脂硬化剤、As the (B) phenolic resin curing agent, an α-naphthol resin curing agent represented by the formula (3) or / and a β-naphthol resin curing agent represented by the formula (4) is used in an amount of 30 relative to the total amount of the phenolic resin curing agent. ~ 100 wt% phenolic resin curing agent,
【0010】[0010]
【化7】 (n=1〜6)[Chemical 7] (N = 1 to 6)
【0011】[0011]
【化8】 (n=1〜6)[Chemical 8] (N = 1 to 6)
【0012】(C)無機充填材及び (D)硬化促進剤 を必須成分とする半導体封止用エポキシ樹脂組成物であ
る。An epoxy resin composition for semiconductor encapsulation, which comprises (C) an inorganic filler and (D) a curing accelerator as essential components.
【0013】本発明において用いられる式(1)、
(2)で示される構造のビフェニル型エポキシ化合物は
従来のエポキシ樹脂に比べて非常に低い粘度を有する。
そのため、充填材の含有量を大幅に増加させることが可
能であり、樹脂組成物の衝撃強度を向上させ、耐半田性
に優れた特性を示している。式(2)の化合物は式
(1)の化合物に比べフェノール性水酸基との反応性に
優れているが、吸水率が高くなる欠点があり、式(1)
/(2)の重量比を1/3〜3/1、望ましくは1/
1.2〜1.2/1にすることにより、両化合物の特徴
を最大限に発揮できる。この範囲から外れると両者の特
徴が生かせずバランスが崩れる。 式(1)、(2)の
エポキシ樹脂の使用量は、これを調整することにより耐
半田ストレスを最大限に引き出すことができる。耐半田
ストレス性の効果を引き出すためには式(1)、(2)
で示されるエポキシ樹脂を総エポキシ樹脂量に対して5
0重量%以上、更に好ましくは70重量%以上の使用が
望ましい。使用が50重量%未満だと耐半田ストレス性
の効果を充分に引き出すことができない。式(1)の化
合物と式(2)の化合物は、溶融等により予め混合して
用いてもよいし、樹脂組成物の製造時に別々に添加して
用いてもよい。併用するエポキシ樹脂にはエポキシ基を
有するポリマー全般を用いることができる。例えばクレ
ゾールノボラックエポキシ樹脂、フェノールノボラック
エポキシ樹脂、ナフタレンエポキシ樹脂、3官能エポキ
シ樹脂等が挙げられる。これらは単独又は2種以上を混
合して用いてもよい。Formula (1) used in the present invention,
The biphenyl type epoxy compound having the structure represented by (2) has a very low viscosity as compared with the conventional epoxy resin.
Therefore, it is possible to significantly increase the content of the filler, improve the impact strength of the resin composition, and exhibit excellent solder resistance. The compound of the formula (2) is superior to the compound of the formula (1) in reacting with the phenolic hydroxyl group, but has a drawback that the water absorption is high, and therefore the compound of the formula (1)
The weight ratio of / (2) is 1/3 to 3/1, preferably 1 /
By setting 1.2 to 1.2 / 1, the characteristics of both compounds can be maximized. If it deviates from this range, the characteristics of both will not be utilized and the balance will be lost. By adjusting the amount of the epoxy resin of the formulas (1) and (2) used, the soldering stress resistance can be maximized. In order to bring out the effect of solder stress resistance, formulas (1) and (2)
The epoxy resin represented by 5 is used with respect to the total amount of epoxy resin.
It is desirable to use 0% by weight or more, more preferably 70% by weight or more. If the amount used is less than 50% by weight, the effect of resistance to solder stress cannot be sufficiently obtained. The compound of formula (1) and the compound of formula (2) may be mixed in advance by melting or the like, or may be added separately at the time of producing the resin composition. As the epoxy resin used in combination, all polymers having an epoxy group can be used. Examples thereof include cresol novolac epoxy resin, phenol novolac epoxy resin, naphthalene epoxy resin, and trifunctional epoxy resin. You may use these individually or in mixture of 2 or more types.
【0014】式(3)の分子構造で示される硬化剤はα
−ナフトール、式(4)の分子構造で示される硬化剤は
β−ナフトールを用い、アラルキルエーテル(α、α’
−ジメトキシパラキシレン)と、フリーデルクラフツ反
応により縮合させ得たものである。この使用は従来のフ
ェノールノボラック樹脂硬化剤の使用と比べると半田処
理温度周辺での弾性率の低下とリードフレーム及びチッ
プとの密着力を向上させ、また分子内にナフタレン構造
が導入されていることから、低熱膨張化及び低吸水化を
得ることができる。従って半田付け時の熱衝撃に対し
て、発生応力の低下とそれに伴うチップとの密着不良の
防止に有効である。The curing agent represented by the molecular structure of formula (3) is α
-Naphthol, β-naphthol is used as the curing agent represented by the molecular structure of the formula (4), and aralkyl ether (α, α '
-Dimethoxyparaxylene) and can be condensed by Friedel-Crafts reaction. Compared with the use of conventional phenol novolac resin hardener, this use lowers the elastic modulus around the soldering temperature and improves the adhesion with the lead frame and chip, and that the naphthalene structure is introduced in the molecule. Therefore, low thermal expansion and low water absorption can be obtained. Therefore, it is effective in preventing a decrease in the generated stress and the resulting poor adhesion to the chip against thermal shock during soldering.
【0015】このようなナフトール樹脂硬化剤の使用量
はこれを調整することにより耐半田ストレス性を最大限
に引き出すことができる。耐半田ストレス性の効果を引
き出すためには式(3)または/および(4)で示され
るナフトール樹脂硬化剤を総硬化剤量に対して30重量
%以上、更に好ましくは50重量%以上の使用が望まし
い。使用が30重量%未満だと低吸水性、低弾性及びリ
ードフレーム、チップとの密着力が不十分で耐半田スト
レス性の向上が望めない。更に式(3)、(4)中のn
の値は1〜6が望ましく、6を越えるとトランスファー
成形時の流動性が低下する。By adjusting the amount of such a naphthol resin curing agent used, solder stress resistance can be maximized. In order to bring out the effect of resistance to soldering stress, use of the naphthol resin curing agent represented by the formula (3) or / and (4) in an amount of 30% by weight or more, more preferably 50% by weight or more, based on the total amount of the curing agent. Is desirable. If the amount used is less than 30% by weight, low water absorption, low elasticity, and insufficient adhesion to lead frames and chips, and improvement in solder stress resistance cannot be expected. Further, n in the formulas (3) and (4)
The value of 1 is preferably 1 to 6, and if it exceeds 6, the fluidity during transfer molding decreases.
【0016】併用する硬化剤にはフェノール性水酸基を
有するポリマー全般を用いることができる。例えばフェ
ノールノボラック樹脂、クレゾールノボラック樹脂、ジ
シクロペンタジエン変性フェノール樹脂、ジシクロペン
タジエン変性フェノール樹脂とフェノールノボラック及
びクレゾールノボラック樹脂との共重合物、パラキシレ
ン変性フェノール樹脂等を用いることができる。これら
は単独もくしは2種以上混合して用いることができる。Polymers having a phenolic hydroxyl group can be used for the curing agent used in combination. For example, a phenol novolac resin, a cresol novolac resin, a dicyclopentadiene modified phenol resin, a copolymer of a dicyclopentadiene modified phenol resin and a phenol novolac or a cresol novolac resin, and a paraxylene modified phenol resin can be used. These can be used alone or as a mixture of two or more kinds.
【0017】本発明で用いる無機充填材としては、溶融
シリカ粉末、球状シリカ粉末、結晶シリカ粉末、2次凝
集シリカ粉末、多孔質シリカ粉末、2次凝集シリカ粉末
または多孔質シリカ粉末を粉砕したシリカ粉末、アルミ
ナ等が挙げられ、特に溶融シリカ粉末、球状シリカ粉
末、及び溶融シリカ粉末と球状シリカ粉末との混合物が
好ましい。また無機充填材の配合量としては耐半田スト
レス性と成形性のバランスから総組成物量に対して70
から90重量%が好ましい。As the inorganic filler used in the present invention, fused silica powder, spherical silica powder, crystalline silica powder, secondary agglomerated silica powder, porous silica powder, secondary agglomerated silica powder or silica obtained by pulverizing porous silica powder is used. Examples thereof include powder and alumina, and fused silica powder, spherical silica powder, and a mixture of fused silica powder and spherical silica powder are particularly preferable. The amount of the inorganic filler compounded is 70 with respect to the total amount of the composition in view of the balance between solder stress resistance and moldability.
To 90% by weight is preferred.
【0018】本発明に使用される硬化促進剤はエポキシ
基とフェノール性水酸基との反応を促進させるものであ
れば良く、一般に封止用材料に使用されているものを広
く使用することができ、例えばトリフェニルホスフィン
(TPP)、トリブチルホスフィン、トリ(4−メチル
フェニル)ホスフィン等の有機ホスフィン化合物、トリ
ブチルアミン、トリエチルアミン、ジメチルベンジルア
ミン(BDMA)、トリスジメチルアミノメチルフェノ
ール、ジアザビシクロウンデセン(DBU)等の3級ア
ミン、2−メチルイミダゾール、2−フェニルイミダゾ
ール、2−エチル−4−メチルイミダゾール等のイミダ
ゾール化合物が挙げられる。これらは単独もしくは2種
類以上混合して用いられる。The curing accelerator used in the present invention may be any one as long as it accelerates the reaction between the epoxy group and the phenolic hydroxyl group, and those generally used for sealing materials can be widely used. For example, organic phosphine compounds such as triphenylphosphine (TPP), tributylphosphine, tri (4-methylphenyl) phosphine, tributylamine, triethylamine, dimethylbenzylamine (BDMA), trisdimethylaminomethylphenol, diazabicycloundecene (DBU). ) And other tertiary amines, and 2-methylimidazole, 2-phenylimidazole, 2-ethyl-4-methylimidazole, and other imidazole compounds. These may be used alone or in combination of two or more.
【0019】本発明の封止用エポキシ樹脂組成物はエポ
キシ樹脂、硬化剤、無機充填材及び硬化促進剤を必須成
分とするが、これ以外に必要に応じてシランカップリン
グ剤、ブロム化エポキシ樹脂、3酸化アンチモン、ヘキ
サブロムベンゼン等の難燃化剤、カーボンブラック、ベ
ンガラなどの着色剤、天然ワックス、合成ワックス等の
シリコーンオイル、ゴム等の低応力剤等の種々の添加剤
を適宜配合しても良い。本発明の封止用エポキシ樹脂組
成物を成形材料として製造するには、エポキシ樹脂、硬
化剤、無機充填材、硬化促進剤、その他の添加剤をミキ
サーなどにより均一に混合した後、更に熱ロールまたは
ニーダーなどで溶融混練し、冷却後粉砕して成形材料と
することができる。これらの成形材料は電子部品あるい
は電気部品の封止、被覆、絶縁などに適用することがで
きる。The encapsulating epoxy resin composition of the present invention contains an epoxy resin, a curing agent, an inorganic filler and a curing accelerator as essential components, but in addition to this, a silane coupling agent, a brominated epoxy resin may be added as required. Various additives such as flame retardants such as antimony trioxide and hexabromobenzene, coloring agents such as carbon black and red iron oxide, silicone oils such as natural wax and synthetic wax, and low stress agents such as rubber are appropriately mixed. May be. To produce the encapsulating epoxy resin composition of the present invention as a molding material, an epoxy resin, a curing agent, an inorganic filler, a curing accelerator, and other additives are uniformly mixed with a mixer or the like, and then a heat roll is further added. Alternatively, it can be melt-kneaded with a kneader or the like, cooled and pulverized to obtain a molding material. These molding materials can be applied to sealing, coating, insulating, etc. of electronic parts or electric parts.
【0020】[0020]
【実施例】以下本発明を実施例にて具体的に説明する。EXAMPLES The present invention will be specifically described below with reference to examples.
【0021】実施例1 下記組成物 式(1)と(2)で示されるエポキシ樹脂溶融混合物 〔式(1)/式(2)=50/50(重量比)〕 24.8重量部 オルソクレゾールノボラックエポキシ樹脂 (軟化点65℃、エポキシ当量200) 24.8重量部 式(3)で示されるαナフトール樹脂硬化剤 (nは1〜6の混合物、軟化点90℃、水酸基当量243) 10.0重量部 フェノールノボラック樹脂硬化剤 (軟化点100℃、水酸基当量104) 23.4重量部 溶融シリカ粉末 332重量部 トリフェニルホスフィン 0.8重量部 カーボンブラック 2.1重量部 カルナバワックス 2.1重量部 を、ミキサーで常温で混合し、70〜100℃で2軸ロ
ールにより混練し、冷却後粉砕し成形材料とした。得ら
れた成形材料を、タブレット化し、低圧トランスファー
成形機にて175℃、70kg/cm2 、120秒の条件で
半田クラック試験用として6×6mmのチップを13.9
×13.9×2.0mmのパッケージに封止し、また半田
耐湿試験用として3×6mmのチップを7.2×11.5
×2.0mmに封入した。封止したテスト用素子について
下記の半田クラック試験及び半田耐湿性試験を行った。Example 1 The following composition Epoxy resin melt mixture represented by the formulas (1) and (2) [Formula (1) / Formula (2) = 50/50 (weight ratio)] 24.8 parts by weight Orthocresol Novolac epoxy resin (softening point 65 ° C., epoxy equivalent 200) 24.8 parts by weight α-naphthol resin curing agent represented by the formula (3) (n is a mixture of 1 to 6, softening point 90 ° C., hydroxyl equivalent 243) 10. 0 parts by weight Phenol novolac resin curing agent (softening point 100 ° C., hydroxyl equivalent 104) 23.4 parts by weight fused silica powder 332 parts by weight triphenylphosphine 0.8 parts by weight carbon black 2.1 parts by weight carnauba wax 2.1 parts by weight The parts were mixed at room temperature with a mixer, kneaded with a biaxial roll at 70 to 100 ° C., cooled and pulverized to obtain a molding material. The obtained molding material was made into a tablet, and a low pressure transfer molding machine was used to perform a solder crack test at a temperature of 175 ° C., 70 kg / cm 2 , 120 seconds for 1 × 6 × 6 mm chips 13.9.
It is sealed in a package of 13.9 x 2.0 mm, and a chip of 3 x 6 mm is used for solder moisture resistance test.
Enclosed in x 2.0 mm. The sealed test element was subjected to the following solder crack test and solder moisture resistance test.
【0022】半田クラック試験:封止したテスト用素子
を85℃、85%RHの環境下で24時間、72時間処
理後、260℃の半田槽に10秒間浸漬した。浸漬後、
顕微鏡で外観観察しクラックを確認した。 半田耐湿性試験:封止したテスト用素子を85℃、85
%RHの環境下で72時間処理後、260℃の半田槽に
10秒間浸漬した。浸漬後プレッシャークッカー試験
(125℃、100%RH)を行い回路のオープン不良
を測定した。 試験結果を表1に示す。Solder crack test: The sealed test element was treated in an environment of 85 ° C. and 85% RH for 24 hours and 72 hours, and then immersed in a solder bath at 260 ° C. for 10 seconds. After immersion
The appearance was observed with a microscope and cracks were confirmed. Solder moisture resistance test: sealed test element at 85 ° C, 85
After treatment for 72 hours in an environment of% RH, it was immersed in a solder bath at 260 ° C. for 10 seconds. After immersion, a pressure cooker test (125 ° C., 100% RH) was performed to measure the open circuit failure. The test results are shown in Table 1.
【0023】実施例2〜5 表1の処方に従って配合し、実施例1と同様にして成形
材料を得、同様に評価した。 実施例6 実施例1の式(3)で示されるαナフトール樹脂硬化剤
に変えて、式(4)で示されるβナフトール樹脂硬化剤
(n=1〜6の混合物、軟化点109℃、水酸基当量2
41)を用いて表1の処方に従って配合し、実施例1と
同様にして成形材料を得、同様に評価した。 実施例7〜11 表1の処方に従って配合し、実施例1と同様にして成形
材料を得、同様に評価した。Examples 2 to 5 Compounding was carried out according to the formulation shown in Table 1, molding compounds were obtained in the same manner as in Example 1, and evaluated in the same manner. Example 6 In place of the α-naphthol resin curing agent represented by formula (3) of Example 1, a β-naphthol resin curing agent represented by formula (4) (mixture of n = 1 to 6, softening point 109 ° C., hydroxyl group) Equivalent 2
41) was blended according to the formulation in Table 1, a molding material was obtained in the same manner as in Example 1, and the same evaluation was performed. Examples 7 to 11 Compounding was performed according to the formulation shown in Table 1, molding materials were obtained in the same manner as in Example 1, and evaluated in the same manner.
【0024】比較例1〜7 表2の処方に従って配合し、実施例1と同様にして成形
材料を得、同様に評価した。Comparative Examples 1 to 7 Compounding was performed according to the formulation shown in Table 2, and molding materials were obtained in the same manner as in Example 1 and evaluated in the same manner.
【0025】[0025]
【表1】 [Table 1]
【0026】[0026]
【表2】 [Table 2]
【0027】[0027]
【発明の効果】本発明に従うと従来技術では得ることの
できなかった耐半田ストレス性を有するエポキシ樹脂組
成物を得ることができるので、半田付け工程による急激
な温度変化による熱ストレスを受けたときの耐クラック
性に非常に優れ、更に耐湿性が良好なことから電子、電
気部品の封止用、被覆用、絶縁用に用いた場合、特に表
面実装パッケージに搭載された高集積大型チップICに
おいて、信頼性の要求が特に厳しい製品に最適である。According to the present invention, it is possible to obtain an epoxy resin composition having resistance to solder stress which could not be obtained by the prior art. Therefore, when an epoxy resin composition is subjected to thermal stress due to a rapid temperature change due to the soldering process. Has very good crack resistance and good moisture resistance, so when it is used for encapsulation, coating and insulation of electronic and electrical parts, especially in highly integrated large chip ICs mounted in surface mount packages. Ideal for products with particularly stringent reliability requirements.
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.5 識別記号 庁内整理番号 FI 技術表示箇所 C08G 59/62 NJS 8416−4J C08L 63/02 NJW 8830−4J ─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 5 Identification code Internal reference number FI Technical indication C08G 59/62 NJS 8416-4J C08L 63/02 NJW 8830-4J
Claims (1)
5’−テトラメチル−4、4’−ジヒドロキシビフェニ
ルグリシジルエーテルと式(2)で示される4、4’−
ジヒドロキシビフェニルグリシジルエーテルの重量比が
式(1)/式(2)=1/3〜3/1であるエポキシ樹
脂を総エポキシ樹脂量に対して50〜100重量%含む
エポキシ樹脂、 【化1】 【化2】 (B)フェノール樹脂硬化剤として、式(3)で示され
るαナフトール樹脂硬化剤または/および式(4)で示
されるβナフトール樹脂硬化剤を総フェノール樹脂硬化
剤量に対して30〜100重量%含むフェノール樹脂硬
化剤、 【化3】 (n=1〜6) 【化4】 (n=1〜6) (C)無機充填材及び (D)硬化促進剤 を必須成分とする半導体封止用エポキシ樹脂組成物。(A) 3, 3 ', 5 represented by the formula (1),
5'-tetramethyl-4,4'-dihydroxybiphenyl glycidyl ether and 4,4'-represented by the formula (2)
An epoxy resin containing an epoxy resin having a weight ratio of dihydroxybiphenyl glycidyl ether of the formula (1) / formula (2) = 1/3 to 3/1 in an amount of 50 to 100% by weight based on the total amount of the epoxy resin, [Chemical 2] (B) As the phenol resin curing agent, an α-naphthol resin curing agent represented by the formula (3) or / and a β-naphthol resin curing agent represented by the formula (4) is used in an amount of 30 to 100% by weight based on the total amount of the phenol resin curing agent. % Phenolic resin curing agent, (N = 1 to 6) embedded image (N = 1 to 6) An epoxy resin composition for semiconductor encapsulation containing (C) an inorganic filler and (D) a curing accelerator as essential components.
Priority Applications (1)
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---|---|---|---|
JP1482292A JP3003887B2 (en) | 1992-01-30 | 1992-01-30 | Resin composition for semiconductor encapsulation |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1482292A JP3003887B2 (en) | 1992-01-30 | 1992-01-30 | Resin composition for semiconductor encapsulation |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH05206331A true JPH05206331A (en) | 1993-08-13 |
JP3003887B2 JP3003887B2 (en) | 2000-01-31 |
Family
ID=11871735
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Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1482292A Expired - Fee Related JP3003887B2 (en) | 1992-01-30 | 1992-01-30 | Resin composition for semiconductor encapsulation |
Country Status (1)
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JP (1) | JP3003887B2 (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001226454A (en) * | 2000-02-17 | 2001-08-21 | Sumitomo Bakelite Co Ltd | Epoxy resin composition and semiconductor device |
JP2001233936A (en) * | 2000-02-23 | 2001-08-28 | Sumitomo Bakelite Co Ltd | Epoxy resin composition and semiconductor device |
KR100343376B1 (en) * | 1993-12-31 | 2002-11-23 | 고려화학 주식회사 | Method for producing hardener for sealing of semiconductor device and resin composition for sealing of semiconductor containing the hardener |
JP2007131861A (en) * | 2006-12-28 | 2007-05-31 | Hitachi Chem Co Ltd | Epoxy resin composition for sealing semiconductor and semiconductor device using the same |
JP2013194207A (en) * | 2012-03-22 | 2013-09-30 | Dic Corp | Resol-type phenolic resin composition |
-
1992
- 1992-01-30 JP JP1482292A patent/JP3003887B2/en not_active Expired - Fee Related
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100343376B1 (en) * | 1993-12-31 | 2002-11-23 | 고려화학 주식회사 | Method for producing hardener for sealing of semiconductor device and resin composition for sealing of semiconductor containing the hardener |
JP2001226454A (en) * | 2000-02-17 | 2001-08-21 | Sumitomo Bakelite Co Ltd | Epoxy resin composition and semiconductor device |
JP2001233936A (en) * | 2000-02-23 | 2001-08-28 | Sumitomo Bakelite Co Ltd | Epoxy resin composition and semiconductor device |
JP2007131861A (en) * | 2006-12-28 | 2007-05-31 | Hitachi Chem Co Ltd | Epoxy resin composition for sealing semiconductor and semiconductor device using the same |
JP2013194207A (en) * | 2012-03-22 | 2013-09-30 | Dic Corp | Resol-type phenolic resin composition |
Also Published As
Publication number | Publication date |
---|---|
JP3003887B2 (en) | 2000-01-31 |
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