JP3365065B2 - Epoxy resin composition for sealing - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an epoxy resin composition used for sealing electronic parts such as semiconductors.

[0002]

2. Description of the Related Art Conventionally, a method of sealing electronic parts such as semiconductors with a thermosetting resin composition is generally used. In this case, an epoxy resin composition is most commonly used as the thermosetting resin composition. This epoxy resin composition includes, for example, cresol novolac type epoxy resin, bisphenol A type epoxy resin, aliphatic cyclic epoxy resin and other epoxy resins; phenol novolac and other curing agents; tertiary amine, imidazole and other curing accelerators, silica. , An inorganic filler made of an inorganic powder such as alumina, a coupling agent such as a silane coupling agent, a release agent such as carnauba wax and stearic acid, and a colorant such as carbon black.

Recently, in order to reduce the size and thickness of electronic parts, the semiconductor mounting method is the conventional pin insertion method (DI).
P: dual in-line package, etc.) to a surface mounting method (SOP: small outline package, QFP: quad flat package, etc.). In the case of the surface mounting method, the semiconductor package is subjected to a high temperature treatment (for example, 210 to 270 ° C.) in a soldering process by infrared reflow, and the entire package is heated to a high temperature at that time. In the above-described package sealed with the conventional epoxy resin composition, there are cases in which problems such as cracks and a significant decrease in moisture resistance occur during this process.

The occurrence of cracks in the soldering process
It is said that moisture absorbed between post-curing and mounting is explosively vaporized and expanded by heating in the soldering process. Therefore, as a countermeasure, a method of completely drying the post-cured package, housing it in a container, sealing and shipping it is adopted. However, this method has a drawback that the work of handling the product is complicated.

Further, various improvements of the encapsulating resin composition itself have been studied. For example, JP-A-64-87616,
JP-A-1-108256 proposes a composition in which a biphenyl type epoxy resin is used as an epoxy resin and a general curing agent is used as a curing agent. In addition, JP-A-6
A composition using a dicyclopentadiene / phenol polymer as a curing agent and a general epoxy resin as an epoxy resin is proposed in 2-184020, JP-A-62-104830 and the like. However, with these proposed compositions, sufficient effects have not yet been obtained, and there is room for improvement.

In view of such circumstances, the present inventors have proposed in JP-A-3-166220 a composition containing a biphenyl type epoxy resin and a dicyclopentadiene / phenol polymer. This composition has low hygroscopicity and improved solder cracking properties. However, with the recent increase in the size of semiconductor chips, there has been a demand for further improvement in solder cracking properties in packages and the like that enclose and store large chips. Also,
It has been found that this composition may cause burrs during molding, and there is a problem to be improved in moldability.

[0007]

In view of the above circumstances,
It is an object of the present invention to solve the problem of the prior art of the occurrence of solder cracks in the soldering process, and it is a further object of the present invention to solve the problem of the occurrence of burrs during molding. . That is, an object of the present invention is to provide an epoxy resin composition for semiconductor encapsulation, which can provide a sealed product in which cracks are less likely to occur when exposed to high temperatures in a soldering process and the like. An object of the present invention is to provide an epoxy resin composition for semiconductor encapsulation, which is less likely to cause burrs.

[0008]

Means for Solving the Problems] encapsulated epoxy resin composition according to claim 1 of the present invention, dicyclopentadiene-phenol polymer type epoxy resin represented by the following general formula (A), in general following Paraxylene represented by the formula
Represented by a phenolic polymer (B) and the following general formula
It is characterized by containing a novolac-modified compound (C) having a structure .

[0009]

[Chemical 8]

[0010]

[Chemical 9]

[0011]

[0012]

[Chemical 10]

The epoxy resin composition for encapsulation according to claim 2 of the present invention is characterized in that X in the above general formula is an organic group having a biphenyl skeleton represented by the following general formula.

[0014]

[Chemical 11]

The encapsulating epoxy resin composition according to a third aspect of the present invention is characterized in that X in the above general formula is a dicyclopentadiene-based organic group represented by the following general formula. .

[0016]

[Chemical 12]

The epoxy resin composition for encapsulation according to claim 4 of the present invention is characterized in that X in the above general formula is a dicyclopentadiene-based organic group represented by the following general formula. .

[0018]

[Chemical 13]

The epoxy resin composition for encapsulation according to claim 5 of the present invention is characterized in that X in the above general formula is a dicyclopentadiene-based organic group represented by the following general formula. .

[0020]

[Chemical 14]

In the epoxy resin composition for encapsulation according to claim 6 of the present invention, the content of the novolac-modified compound (C) having the structure represented by the above general formula is 5 to 50 with respect to the total amount of the epoxy resin. It is characterized in that it is wt%.

In the epoxy resin composition for encapsulation according to claim 7 of the present invention, the ratio of the total number of epoxy groups in the epoxy resin / the total number of phenolic hydroxyl groups in the curing agent is 0.7 / 1.0 to 1.3.
/1.0.

An epoxy resin composition for encapsulation according to an eighth aspect of the present invention is characterized by containing a phosphorus-based curing accelerator.

The epoxy resin composition for encapsulation according to claim 9 of the present invention contains a polyoxyalkylene-modified silicone and a self-curing polyorganosiloxane as a stress reducing agent, and contains a polyoxyalkylene-modified silicone / self-curing agent. The weight ratio of the curable polyorganosiloxane is 1/999 to
It is characterized by being 20/80.

The present invention will be described in detail below. Since the dicyclopentadiene / phenol polymer type epoxy resin (A) represented by the above general formula, which is one of the essential components of the epoxy resin composition for encapsulation of the present invention, has a dicyclopentadiene skeleton, the resulting encapsulation is obtained. The product has low hygroscopicity and high hot strength.

The paraxylene-phenol polymer (B) represented by the above general formula, which is the second essential component, is a curing agent. By using such a curing agent as an essential component, the hygroscopicity of the cured product becomes small, and the heat resistance is the same as that when general phenol novolac is used as the curing agent. The number of repeating units b in the above general formula may be 0 or more, but is preferably in the range of 0 to 5 from the viewpoint of exhibiting effective heat resistance and / or hygroscopicity.

[0027] A compound having the structure represented by the above general formula
The volatile compound (C) has a glycidyl ether group.
Epoxy resin and pheno
It is a prepolymer obtained by reacting urnovolac.
It In this way, epoxy resin is used after prepolymerization.
As a result, the low molecular weight component (monomer) in the composition
This results in less burrs during molding.
Therefore, the molding workability can be improved. Also, above
Novolak modified compound having a structure represented by the general formula
In the above general formula, X is the following four types of organic compounds (C):
If it is the base, solder when mounting the resulting package
To further reduce the occurrence of cracks in the attaching process, etc.
You can The four types of organic groups are
Has a biphenyl skeleton represented by the above general formula
The machine base or the above general formula or the above general formula
Is a dicyclopentadiene-based organic group.

The method for obtaining the novolac-modified compound (C) having the structure represented by the above general formula is not particularly limited, and it is long at a temperature at which the epoxy resin and the phenol novolac are sufficiently melted (for example, 120 ° C. or more). Examples include a method in which both resins are melt-mixed for a time (for example, 3 hours) in the absence of a catalyst or in the presence of various catalysts to form a prepolymer.

The content ratio of the novolac-modified compound (C) having the structure represented by the above general formula in the encapsulating epoxy resin composition is 5 to 50 in all epoxy resins.
If it is less than 5% by weight, it is not possible to expect a reduction in burrs at the time of molding, and if it exceeds 50% by weight, the melt viscosity rapidly increases, which adversely affects the filling property at the time of package molding. Molding defects such as filling, wire sweep phenomenon, and deformation of die pad occur frequently.

In the present invention, other epoxy resins may be used in combination as long as the dicyclopentadiene / phenol polymer type epoxy resin (A) represented by the above general formula is contained as an essential component. For example, any number of commonly used phenol novolac type epoxy resins, orthocresol novolac type epoxy resins and the like can be used in combination as long as the effects of the present invention are not impaired. Also, as for the curing agent, if the paraxylene-phenol polymer (B) represented by the above general formula is contained as an essential component, other curing agents such as phenol novolac and cresol novolac may be used in combination. good.

The equivalence ratio of the epoxy resin and the curing agent in the encapsulating epoxy resin composition of the present invention is not particularly limited, but it is defined by the number of epoxy groups of all epoxy resins / the number of phenolic hydroxyl groups of all curing agents. Ratio is 0.7 / 1.0 to 1.3 /
1.0 is desirable, and 0.95 / 1.0-1.
2 / 1.0 is more desirable. If it is less than 0.7 / 1.0, a large amount of phenolic hydroxyl groups remain in the reaction, resulting in a decrease in moisture resistance. If it exceeds 1.3 / 1.0,
Since a large amount of unreacted epoxy groups remain, problems such as bleed-out such as mold fouling occur.

The epoxy resin composition for encapsulation of the present invention includes
In addition to the above essential components, a suitable curing accelerator, stress-reducing agent, inorganic filler, coupling agent, release agent, colorant, additive, flame retardant and the like can be added as required.

Examples of the curing accelerator that can be added to the encapsulating epoxy resin composition of the present invention include 1,8-
Tertiary amines such as diaza-bicyclo (5,4,0) undecene-7, triethylenediamine, benzyldimethylamine, triethanolamine, dimethylaminoethanol, tris (dimethylaminomethyl) phenol; 2
-Methylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole, 2-phenyl-4
-Imidazoles such as methylimidazole and 2-heptadecylimidazole; organic phosphines such as tributylphosphine, methyldiphenylphosphine, triphenylphosphine, diphenylphosphine and phenylphosphine (phosphorus curing accelerator); tetraphenylphosphonium tetraphenylborate, Examples thereof include tetraphenylboron salts such as triphenylphosphine tetraphenylborate, 2-ethyl-4-methylimidazole tetraphenylborate and N-methylmorpholine tetraphenylborate. In the present invention, when the above phosphorus-based curing accelerator is used as the curing accelerator, the moisture resistance reliability is improved.

The stress reducing agent which can be added to the encapsulating epoxy resin composition of the present invention includes, for example, a silicone polymer. In the case of a silicone polymer, a silicone compatibilizer may be added together. desirable. The silicone polymer is preferably a self-curing silicone rubber or gel, and the self-curing silicone rubber or gel has a mixture or a single structure of two kinds of siloxane compounds each having a functional group capable of reacting with each other. Examples thereof include addition polymerization type of vinyl group-containing siloxane. These self-curing silicone rubbers or gels are usually liquid before curing and are of two-part or one-part type. Specifically, there is a type in which a polydimethylsiloxane having vinyl groups at both ends and a SiH group-containing polydimethylsiloxane are cured with a platinum catalyst or the like. In the present invention, the vinyl, SiH addition type silicone rubber is most suitable. There is. Further, the silicone-based compatibilizer used together with the silicone rubber or gel is preferably a polyoxyalkylene-modified silicone having an epoxy group or a hydrogen group from the viewpoint of reactivity and compatibility, and the compounding ratio is a compatibilizing agent in a weight ratio. / Self-curing silicone rubber = 1/99
It is preferably in the range of 9 to 20/80. If this ratio is less than 1/999, the dispersibility of the silicone rubber is poor, and low stress cannot be expected. If it exceeds 20/80, the imprintability of the surface of the package molded product is likely to deteriorate. Then, by adding a stress-reducing agent, heat shock resistance can be improved.

Examples of the inorganic filler which can be added to the encapsulating epoxy resin composition of the present invention include those used in ordinary encapsulating epoxy resin compositions such as silica and alumina. Examples of the coupling agent include silane coupling agents such as γ-glycidoxypropyltrimethoxysilane and γ-aminopropyltriethoxysilane. Examples of the release agent include carnauba wax, stearic acid, montanic acid and the like, and examples of the colorant include carbon black. However, it is not limited to those illustrated here.

In order to use the encapsulating epoxy resin composition comprising the above-mentioned compounding ingredients as a molding material, the compounding ingredients can be uniformly mixed, and can be produced by a usual process of heating, melting, cooling and pulverizing. . Examples of the apparatus used at that time include a mixer, a blender, a kneader, and a roll.

[0037]

[Function] The epoxy resin composition for encapsulation according to the present invention contains the dicyclopentadiene / phenol polymer type epoxy resin (A) and the paraxylene / phenol polymer (B) so that the obtained cured product has high heat resistance. And has a low hygroscopicity. Further, the inclusion of the novolak-modified compound (C) is a prepolymer obtained by reacting the novolak-modified compound (C) with an epoxy resin and a phenol novolac, so that the low molecular weight component (monomer) in the composition decreases, It acts to increase the melt viscosity, and as a result, it is possible to reduce burrs during molding.

The novolak-modified compound (C) is an organic group having a biphenyl skeleton represented by the above general formula or the above general formula, or a dicyclopentadiene-based compound represented by the above general formula or the above general formula. In the case of the structure having the organic group of, the inclusion of the novolac-modified compound (C) acts to improve the strength during heating,
As a result, it is possible to further reduce the occurrence of cracks during the soldering process during mounting.

Further, the inclusion of a phosphorus-based curing accelerator improves the moisture resistance reliability, and the inclusion of a polyoxyalkylene-modified silicone and a self-curing polyorganosiloxane as a stress reducing agent means that a cured product is obtained. It has the effect of lowering the elastic modulus, and as a result, the heat shock resistance of the resulting packaged product can be improved.

[0040]

EXAMPLES Specific examples and comparative examples of the present invention will be shown below. ( Reference Example 1, Example 2 to Example 11 and Comparative Examples 1 to 3) The raw materials shown in Table 1 were blended at the ratios shown in the same table, and further fused silica having an average particle diameter of 14 μm was used as an inorganic filler.
0 parts by weight, 2 parts by weight of γ-aminopropyltriethoxysilane as a coupling agent, 1 part by weight of carnauba wax as a release agent, and 1 part by weight of carbon black as a colorant were prepared. By the heating roll,
Kneading was performed at a kneading temperature of 85 ° C. for 8 minutes. After that, about φ5mm
Then, the resin composition for semiconductor encapsulation (epoxy resin molding material) was produced.

Details of each raw material shown in Table 1 will be described. The dicyclopentadiene / phenol polymer type epoxy resin (A) is represented by the above general formula and has an epoxy equivalent of 262 and a melting point (softening point) of 65 ° C., “EXA7200” (Dainippon Ink and Chemicals, Inc.). (Trade name of) was used. The biphenyl type epoxy resin is represented by the following general formula (where a is 0), epoxy equivalent 195, melting point 105 ° C. epoxy resin “YX4000H” (trade name of Yuka Shell Epoxy Co., Ltd.). Was used. As the cresol novolac type epoxy resin, an epoxy resin “ESCN195XL” (trade name of Sumitomo Chemical Co., Ltd.) having an epoxy equivalent of 195 and a melting point of 70 ° C. was used.

[0042]

[Chemical 15]

Paraxylene represented by the above general formula
As the phenol polymer (B), OH equivalent 172 “Mirex 225-3L” (trade name of Mitsui Toatsu Fine Co., Ltd.) was used. Further, as a curing agent other than (B), phenol novolac "Tamanol 752" (trade name of Arakawa Chemical Industry Co., Ltd.) having an OH equivalent of 104 and a melting point of 82 ° C. was used.

As the novolak-modified compound (C) shown in the column of epoxy resin in Table 1, the following four kinds of compounds (C-
1, C-2, C- 3 and C-4) were synthesized by the method shown below and used.

(Synthesis of C-1) The above-mentioned biphenyl type epoxy resin "YX4000H"-390 parts by weight The above-mentioned phenol novolac "Tamanol 752" --- 105 parts by weight Triphenylphosphine (TPP) ---- 0. By heating a mixture of 3 parts by weight or more of raw materials at 150 ° C. for 4 hours, X is an organic group having a biphenyl skeleton represented by the above general formula (e in the formula is 0). The novolak-modified compound (C-1) having a structure represented by the general formula was synthesized.

(Synthesis of C-2) Biphenyl type epoxy resin "YL6121" --- 344 parts by weight ["YL6121" is a trade name of Yuka Shell Epoxy Co., Ltd.] The above phenol novolac "Tamanol 752" --- 105 parts by weight Triphenylphosphine (TPP) --- By mixing 0.3 parts by weight or more of the above raw materials at 150 ° C. for 4 hours, X is the above general formula (g in the formula is 0). A novolac-modified compound (C-2) having a structure represented by the above general formula, which is an organic group having a biphenyl skeleton represented by, was synthesized. The biphenyl type epoxy resin “YL6121” [trade name of Yuka Shell Epoxy Co., Ltd.] is composed of the biphenyl type epoxy resin (α) represented by the following general formula (α) and the following general formula (β). It is a mixture composed of the biphenyl type epoxy resin (β) represented, and the weight ratio of the biphenyl type epoxy resin (α) and the biphenyl type epoxy resin (β) is 1: 1.

[0047]

[Chemical 16]

[0048]

[Chemical 17]

(Synthesis of C-3) Epoxy Resin "ZX-1257" --- 514 parts by weight ["ZX-1257" is a trade name of Toto Kasei Co., Ltd.] The above-mentioned phenol novolac "Tamanol 752" --- 105 parts by weight Triphenylphosphine (TPP) --- 0.4 parts by weight of the raw materials are mixed and heated at 150 ° C. for 4 hours, whereby X is a dicyclopentadiene-based compound represented by the above general formula. The novolak-modified compound (C-3) having the structure represented by the above general formula, which is an organic group of, was synthesized. The epoxy resin “ZX-1257” is an epoxy resin (γ) having a structure represented by the following general formula (γ) and having an epoxy equivalent of 257 and a melting point (softening point) of 52 ° C.

[0050]

[Chemical 18]

(Synthesis of C-4) The above dicyclopentadiene / phenolic polymer epoxy resin "EXA7200"-364 parts by weight The above-mentioned phenol novolac "Tamanol 752" --- 105 parts by weight Triphenylphosphine (TPP) ----- By heating a mixture of 0.3 parts by weight or more of the raw material at 150 [deg.] C. for 4 hours, X is a dicyclopentadiene-based organic group represented by the above general formula. A novolak modified compound (C-4) having a structure represented by the formula was synthesized.

The synthesized (C-1), (C-2),
For (C-3) and (C-4), NMR is used.
As a result of measurement using, it was confirmed that a compound having a predetermined structure was synthesized.

2E4MZ in the column of curing accelerator in Table 1 is 2-
It shows ethyl-4-methylimidazole, and TPP shows triphenylphosphine. In addition, the stress reducing agent used in Example 11 was a compatibilizing agent with hydrogen equivalent of 2500 hydrogen group-containing polyoxyalkylene-modified silicone "MDT-20" (trade name of Toshiba Silicone Co., Ltd.) and self-curing property. Consisting of polyorganosiloxane "SE1821" [trade name of Toray Dow Corning Silicone Co., Ltd.] which is a silicone rubber,
The ratio of "SE1821" to 90 parts by weight of "-20" is 90 parts by weight. The polyorganosiloxane is a two-component type vinyl or SiH addition type silicone rubber.

The resin composition for semiconductor encapsulation (epoxy resin molding material) obtained above was molded at 170 to 175 ° C. for 90 seconds using a transfer molding machine, and then 17
Post-curing was performed at 5 ° C. for 6 hours to obtain samples for evaluation of the following moisture absorption rate, strength at heat, solder crack resistance, heat shock resistance, and moisture resistance reliability after moisture absorption soldering. Various performances were measured and evaluated by the following methods, and the obtained results are shown in Table 1.

(1) Burrs The sealing resin compositions (epoxy resin molding materials) of Reference Examples, Examples and Comparative Examples were transferred to a transfer molding machine at 20 μm.
Using a mold for burr evaluation having a slit of m
Molding was performed at 175 ° C. for 90 seconds, and the length of the burr generated in the 20 μm slit was measured and evaluated.

(2) A disk having a moisture absorption rate of 50 mm and a thickness of 3.0 mm was prepared as an evaluation sample under the above conditions.
The moisture absorption rate was determined from the change in weight when moisture was absorbed for 72 hours at 85 ° C and 85% RH.

(3) A bending test sample having a heat strength of 100 mm × 10 mm × 4 mm was prepared under the above conditions, and this test sample was used to measure J
A bending test was performed in an atmosphere of 240 ° C. in accordance with ISK-6911, and the bending strength during heating was determined from the obtained fracture stress value, which was taken as the strength during heating.

(4) Solder cracking property A semiconductor chip having a size of 8 mm × 17 mm × 0.4 mm is mounted on a lead frame made of 42 alloy using silver paste, and then this semiconductor chip has an outer width of 4 mm.
Using a 00 mil 26-pin SOP molding die, sealing molding and post-curing were performed with the sealing resin composition of each of the examples and comparative examples under the above conditions to obtain an evaluation sample.
The sample for evaluation in which the obtained semiconductor chip is sealed is allowed to absorb moisture at 85 ° C. and 85% RH for 72 hours, and then, 26
The operation of immersing in a solder bath at 0 ° C. for 10 seconds was repeated twice and then evaluated. The evaluation method was performed by observing the appearance of the sample and observing the inside of the sample with an ultrasonic probe.
The obtained results are shown in Table 1 as (number of samples with cracks) / (total number of samples immersed for 10 seconds).

(5) Heat shock resistance As in the case of the above (4) solder crack resistance test, an evaluation sample in which a semiconductor chip is sealed is prepared, and this evaluation sample is subjected to low temperature in a liquid phase. Side -65 ° C 5
For 500 minutes, a heating / cooling cycle test was performed at 150 ° C. for 5 minutes on the high temperature side for 500 cycles. The presence of cracks in the samples that underwent this cycle test was examined. The evaluation method was performed by observing the appearance of the sample. The obtained results are shown in Table 1 as (number of samples with cracks) / (total number of samples subjected to cycle test).

(6) Moisture absorption reliability after moisture absorption soldering (USPC
BT) A semiconductor chip (evaluation semiconductor element) of 8 mm × 17 mm × 0.4 mm size with a glass-based protective film, which is provided with a comb-shaped aluminum wiring circuit having a line width of 3 μm, and a lead alloy made of 42 alloy and silver. It is mounted using a paste, and then this semiconductor chip is sealed with the sealing resin composition of each Example and Comparative Example under the above conditions using a 26-pin SOP molding die having an outer width of 400 mil. Stop-molding and post-curing were performed to obtain a sample for evaluation. The obtained evaluation sample in which the obtained semiconductor element for evaluation is sealed is 8
After absorbing moisture at 5 ° C. and 85% RH for 72 hours, it was immersed in a solder bath at 260 ° C. for 10 seconds. Then 138.5 ° C, 85
A continuous energization test of 20 V for 300 hours was performed under the condition of% RH. With respect to the samples that had been subjected to this energization test, their resistance values were examined, and those having a large change in resistance value from the initial value before the test were regarded as defective. The obtained results are shown in Table 1 (number of defectives).
It is shown as / (total number of samples tested).

[0061]

[Table 1]

As is clear from Table 1, in the examples of the present invention and the reference example 1 , the occurrence of solder cracks in the soldering process is smaller than in the comparative examples. Further, in Examples 2 to 11, which also contained the novolac-modified compound (C) having the structure represented by the above general formula, the occurrence of burrs during molding was less than in Reference Example 1 and Comparative Example. .

[0063]

Since the epoxy resin composition for encapsulation of the present invention is constituted as described above, it has the following effects.

According to the encapsulating epoxy resin composition of the first aspect of the present invention, cracks are less likely to occur when the resulting encapsulating product (package) is exposed to a high temperature in a soldering process or the like. In addition to the effect , there is no burr during molding.
Since it is less likely to occur, the workability of molding is improved .

[0065]

According to the epoxy resin composition for encapsulation according to the inventions of claims 2 to 7 , in addition to the effect of the invention of claim 1, cracks are generated when exposed to a high temperature in a soldering process or the like. Further, it has the effect of being less likely to occur.

According to the eighth aspect of the present invention, the epoxy resin composition for encapsulation has the effect of improving the moisture resistance reliability of the obtained encapsulation product (package) in addition to the above effects.

According to the encapsulating epoxy resin composition of the ninth aspect of the present invention, in addition to the above effects, there is an effect that the heat shock property of the resulting encapsulation product (package) is improved.

─────────────────────────────────────────────────── ─── Continuation of front page (51) Int.Cl. ⁷ Identification code FI H01L 23/31 (56) References JP-A-7-118366 (JP, A) JP-A-6-298903 (JP, A) Special Kaihei 6-41273 (JP, A) JP 5-3270 (JP, A) JP 3-14816 (JP, A) JP 3-47827 (JP, A) JP 7-151622 ( JP, A) JP-A-6-145297 (JP, A) (58) Fields investigated (Int.Cl. ⁷ , DB name) C08G 59/32 C08G 59/62 C08L 63/00-63/10 C08L 83 / 04-83/06 H01L 23/29

Claims (9)

(57) [Claims] Table with claim 1 Dicyclopentadiene-phenol polymer type epoxy resin represented by the following general formula (A), paraxylene phenol polymer represented by the following formula (B) and the general formula Has a structure
An epoxy resin composition for encapsulation, which contains a volatile compound (C) . [Chemical 1] [Chemical 2] [Chemical 3] Wherein X is claim 1 encapsulated epoxy resin composition, wherein the organic group having a biphenyl skeleton represented by the following general formula in the above general formula. [Chemical 4] Wherein X is claim 1 encapsulated epoxy resin composition, wherein the organic group having a biphenyl skeleton represented by the following general formula in the above general formula. [Chemical 5] Wherein X is claim 1 encapsulated epoxy resin composition, wherein the dicyclopentadiene-based organic group represented by the following general formula in the above general formula. [Chemical 6] 5. X is claim 1 encapsulated epoxy resin composition, wherein the dicyclopentadiene-based organic group represented by the following general formula in the above general formula. [Chemical 7] 6. The method of claim claim 1 in which the content of novolac modified compound (C) having the structure represented by the general formula described above is characterized in that 5 to 50% by weight of the epoxy resin the total amount The epoxy resin composition for encapsulation according to any one of 5 to 5 . 7. The ratio of the number of epoxy groups of all epoxy resins / the number of phenolic hydroxyl groups of all curing agents is 0.7 / 1.0 to 1.
Claims 1 to 3, characterized in that it is 3 / 1.0.
The epoxy resin composition for encapsulation according to any one of 6 to 6 . 8. The epoxy resin composition for sealing according to any one of to contain the phosphorus-based curing accelerators claim 1, wherein up to claim 7. 9. A polyoxyalkylene-modified silicone and a self-curing polyorganosiloxane as a stress reducing agent, and a polyoxyalkylene-modified silicone /
Weight ratio of self-curing polyorganosiloxane is 1/999
The epoxy resin composition for encapsulation according to any one of claims 1 to 8 , wherein the epoxy resin composition is 20 to 80/80.