JPH05166974A - Epoxy resin composition - Google Patents
Epoxy resin compositionInfo
- Publication number
- JPH05166974A JPH05166974A JP32927791A JP32927791A JPH05166974A JP H05166974 A JPH05166974 A JP H05166974A JP 32927791 A JP32927791 A JP 32927791A JP 32927791 A JP32927791 A JP 32927791A JP H05166974 A JPH05166974 A JP H05166974A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- resin composition
- weight
- formula
- hardening agent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
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- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、耐半田ストレス性に優
れた半導体封止用エポキシ樹脂組成物に関するものであ
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an epoxy resin composition for semiconductor encapsulation which is excellent in solder stress resistance.
【０００２】[0002]
【従来の技術】高集積ＩＣデバイスは、そのほとんどが
信頼性、コスト及び量産性に優れるエポキシ樹脂封止材
料による樹脂封止方式により封止されている。エポキシ
樹脂封止材料としては、耐熱性、耐湿性、成形性に優れ
たオルソクレゾールノボラックエポキシ樹脂とノボラッ
ク型フェノール樹脂で構成される樹脂組成物が用いられ
ている。しかし、近年の高集積化、多機能化に伴ない、
高集積ＩＣパッケージは、素子の大型化、実装合理化に
伴うパッケージの小型化、薄形化の傾向が強く、従来の
ＤＩＰタイプから、小型、薄型のＳＯＪ、ＳＯＰ、ＱＦ
Ｐ、ＴＳＯＰタイプの表面実装型パッケージへ急速に移
行している。2. Description of the Related Art Most highly integrated IC devices are encapsulated by a resin encapsulation method using an epoxy resin encapsulating material which is excellent in reliability, cost and mass productivity. As the epoxy resin encapsulating material, a resin composition composed of an orthocresol novolac epoxy resin and a novolac type phenol resin, which are excellent in heat resistance, moisture resistance and moldability, is used. However, with the recent high integration and multi-functionalization,
Highly integrated IC packages have a strong tendency to be smaller and thinner due to the larger size of devices and the rationalization of mounting. Compared to the conventional DIP type, small and thin SOJs, SOPs, and QFs are used.
P and TSOP type surface mount packages are rapidly shifting.
【０００３】このことは、従来のＤＩＰタイプと違い半
田付け時にパッケージそのものが２１５〜２６０℃の高
温にさらされることとなり、大型チップを小型で薄いパ
ッケージに封入した表面実装タイプのパッケージは大き
な応力を受け、パッケージ樹脂のクラック、チップ界面
の剥離を引き起こし、ＩＣパッケージの信頼性に致命的
な問題となっている。これらの表面実装型パッケージを
封止するのに適した信頼性の高い封止用樹脂組成物が望
まれている。This means that, unlike the conventional DIP type, the package itself is exposed to a high temperature of 215 to 260 ° C. at the time of soldering, and the surface mount type package in which a large chip is enclosed in a small and thin package exerts a large stress. This causes cracking of the package resin and peeling of the chip interface, which is a fatal problem in the reliability of the IC package. A highly reliable encapsulating resin composition suitable for encapsulating these surface mount packages is desired.
【０００４】これらの問題を解決するために半田付け時
の熱衝撃を緩和する目的で、熱可塑性オリゴマーの添加
（特開昭６２−１１５８４９号公報）や各種シリコーン
化合物の添加（特開昭６２−１１５８５０号公報、６２
−１１６６５４号公報、６２−１２８１６２号公報）、
更にはシリコーン変性（特開昭６２−１３６８６０号公
報）などの手法で対処しているがいずれも半田付け時に
パッケージにクラックが生じてしまい信頼性の優れた半
導体封止用エポキシ樹脂組成物を得るまでには至らなか
った。In order to alleviate the thermal shock during soldering in order to solve these problems, addition of a thermoplastic oligomer (JP-A-62-115849) and addition of various silicone compounds (JP-A-62-158). No. 115850, 62
-116654, 62-128162),
Furthermore, methods such as silicone modification (Japanese Patent Laid-Open No. 62-136860) are used, but in all cases cracks occur in the package during soldering, and a highly reliable epoxy resin composition for semiconductor encapsulation is obtained. It didn't reach.
【０００５】一方、半田付け時の耐熱ストレス性つまり
耐半田ストレス性に優れた半導体封止用エポキシ樹脂組
成物を得るために、樹脂系としてビフェニル型エポキシ
樹脂の使用（特開昭６４−６５１１６号公報）等が、検
討されてきたがビフェニル型エポキシ樹脂の使用により
リードフレームとの密着性及び低吸水性が向上し、耐半
田ストレス性の向上、特にクラック発生が低減するが、
耐熱性が劣るため特に２５０℃以上のような高温では耐
半田ストレス性が不十分である。On the other hand, in order to obtain a semiconductor encapsulating epoxy resin composition having excellent heat stress resistance during soldering, that is, solder stress resistance, use of a biphenyl type epoxy resin as a resin system (Japanese Patent Laid-Open No. 64-65116). Gazette) has been studied, but the use of a biphenyl type epoxy resin improves the adhesion to the lead frame and the low water absorption, improves the solder stress resistance, and particularly reduces the occurrence of cracks.
Since the heat resistance is poor, the solder stress resistance is insufficient especially at a high temperature of 250 ° C. or higher.
【０００６】[0006]
【発明が解決しようとする課題】本発明は、成形性およ
び信頼性を劣化させることなく半田付け時の半田耐熱性
に優れた半導体封止用エポキシ樹脂組成物を提供するも
のである。SUMMARY OF THE INVENTION The present invention provides an epoxy resin composition for semiconductor encapsulation which is excellent in solder heat resistance during soldering without deteriorating moldability and reliability.
【０００７】[0007]
【課題を解決するための手段】本発明は（Ａ）下記式
（１）で示されるオルソクレゾールとβ−ナフトールの
共縮合ノボラックエポキシ樹脂を総エポキシ樹脂量の３
０〜１００重量％含むエポキシ樹脂、The present invention comprises (A) a co-condensed novolak epoxy resin of orthocresol and β-naphthol represented by the following formula (1) in a total epoxy resin amount of 3: 1.
Epoxy resin containing 0 to 100% by weight,
【０００８】[0008]
【化３】 （ｎ＝１〜６）[Chemical 3] (N = 1 to 6)
【０００９】（Ｂ）下記式（２）で示されるフェノール
樹脂硬化剤を総硬化剤量に対して３０〜１００重量％含
む硬化剤、(B) A curing agent containing a phenol resin curing agent represented by the following formula (2) in an amount of 30 to 100% by weight based on the total amount of the curing agent,
【００１０】[0010]
【化４】 [Chemical 4]
【００１１】（式中のＲ1 、Ｒ2 は水素、ハロゲン、低
級アルキル基の中から選択される同一もしくは異なる原
子または基、ｎ＝１〜６） （Ｃ）無機質充填材及び （Ｄ）硬化促進剤 を必須成分とする半導体封止用エポキシ樹脂組成物で、
従来のエポキシ樹脂組成物に比べ非常に優れた耐半田耐
熱性を有するものである。(Wherein R 1 and R 2 are the same or different atoms or groups selected from hydrogen, halogen and lower alkyl groups, n = 1 to 6) (C) inorganic filler and (D) curing An epoxy resin composition for semiconductor encapsulation containing an accelerator as an essential component,
It has extremely excellent solder heat resistance as compared with conventional epoxy resin compositions.
【００１２】本発明に用いるオルソクレゾールとβ−ナ
フトールの共縮合ノボラックエポキシ樹脂は、オルソク
レゾールとβ−ナフトールをホルムアルデヒドより共縮
合されたノボラック樹脂のエポキシ化物であり、その共
縮合時のβ−ナフトール量は５０重量％以上が望まし
く、式（１）の構造を主とする化合物である。更にｎは
１〜６で、６を越えると成形時の流動性に劣る。式
（１）は、低吸水性に優れ、樹脂の線膨張係数が小さ
く、成形時の離型性に優れるという特徴を有し、半田付
け時のハンダ耐熱性に良好な結果を示す。このオルソク
レゾールとβ−ナフトール共縮合ノボラックエポキシ樹
脂の使用量は、これを調節することにより半田耐熱性を
最大限に引き出すことができる。The co-condensed novolak epoxy resin of orthocresol and β-naphthol used in the present invention is an epoxidized novolak resin obtained by co-condensing orthocresol and β-naphthol from formaldehyde, and β-naphthol at the time of the co-condensation thereof. The amount is preferably 50% by weight or more, and the compound mainly has the structure of formula (1). Further, n is 1 to 6, and if it exceeds 6, the fluidity at the time of molding is poor. Formula (1) has the characteristics of excellent low water absorption, a small linear expansion coefficient of the resin, and excellent releasability at the time of molding, and shows good results for solder heat resistance during soldering. By adjusting the amounts of the orthocresol and β-naphthol co-condensed novolac epoxy resin to be used, solder heat resistance can be maximized.
【００１３】半田耐熱性の効果をだすためにはオルソク
レゾールとβ−ナフトール共縮合ノボラックエポキシ樹
脂を総エポキシ樹脂量の３０重量％以上好ましくは６０
重量％以上の使用が望ましい。３０重量％未満では、低
吸水性、低線膨張係数が充分に得られず、半田耐熱性が
不充分である。オルソクレゾールとβ−ナフトール共縮
合ノボラックエポキシ樹脂以外の他のエポキシ樹脂を併
用する場合、用いるエポキシ樹脂とは、エポキシ基を有
するポリマー全般をいう。たとえばビスフェノール型エ
ポキシ樹脂、クレゾールノボラック型エポキシ樹脂、ビ
フェニル型エポキシ樹脂、フェノールノボラック型エポ
キシ樹脂及びトリフェノールメタン型エポキシ樹脂、ア
ルキル変性トリフェノールメタン型エポキシ樹脂等の３
官能型エポキシ樹脂、トリアジン核含有エポキシ樹脂等
のことをいう。In order to obtain the effect of solder heat resistance, orthocresol and β-naphthol co-condensed novolac epoxy resin are contained in an amount of 30% by weight or more, preferably 60% by weight or more of the total amount of epoxy resin.
It is desirable to use more than weight%. If it is less than 30% by weight, low water absorption and low linear expansion coefficient cannot be sufficiently obtained, and solder heat resistance is insufficient. When orthocresol and an epoxy resin other than the β-naphthol co-condensed novolac epoxy resin are used in combination, the epoxy resin to be used refers to all polymers having an epoxy group. For example, bisphenol type epoxy resin, cresol novolac type epoxy resin, biphenyl type epoxy resin, phenol novolac type epoxy resin and triphenol methane type epoxy resin, alkyl modified triphenol methane type epoxy resin, etc.
Functional epoxy resin, triazine nucleus-containing epoxy resin and the like.
【００１４】式（２）で示されるフェノール樹脂硬化剤
は骨格中のパラキシレンを変性したものである。式中の
ｎは１〜６で、Ｒ1 、Ｒ2 は水素、ハロゲン、低級アル
キル基の中から選択される同一もしくは異なる原子また
は基である。これらの中で、ｎが６を越えると成形時の
流動性に劣る。低級アルキル基は炭素が１〜４で、４を
越えると、成形時の流動性が劣る。Ｒ1、Ｒ2としはそれ
ぞれ水素原子が好ましい。特徴としてはガラス転移温度
以上での弾性率が低く、半田付け時の内部応力が低い。
また、チップ及びリードフレームとの密着性及び低吸水
性に優れるなどの特徴を有することから耐半田ストレス
性に良好な結果を示す。このフェノール樹脂硬化剤の使
用量は、全硬化剤量に対して３０重量％以上が好まし
く、更に好ましくは６０重量％以上の使用が望ましい。
３０重量％未満だと、リードフレームとの密着性及び低
吸水性が向上せず、耐半田ストレス性が不充分である。The phenol resin curing agent represented by the formula (2) is a modification of para-xylene in the skeleton. In the formula, n is 1 to 6, and R 1 and R 2 are the same or different atoms or groups selected from hydrogen, halogen and lower alkyl groups. Among these, when n exceeds 6, the fluidity during molding is poor. The lower alkyl group has 1 to 4 carbon atoms, and when it exceeds 4, the fluidity at the time of molding becomes poor. Each of R 1 and R 2 is preferably a hydrogen atom. It features low elastic modulus above glass transition temperature and low internal stress during soldering.
Further, since it has characteristics such as excellent adhesion to the chip and the lead frame and low water absorption, it shows good results in resistance to solder stress. The amount of the phenol resin curing agent used is preferably 30% by weight or more, more preferably 60% by weight or more, based on the total amount of the curing agent.
If it is less than 30% by weight, the adhesion to the lead frame and the low water absorption will not be improved, and the solder stress resistance will be insufficient.
【００１５】式（２）で示されるフェノール樹脂硬化剤
以外に他のフェノール樹脂硬化剤を併用する場合、用い
るフェノール樹脂硬化剤とはフェノール性水酸基を有す
るポリマー全般をいう。例えば、一般にフェノールノボ
ラック樹脂、クレゾールノボラック樹脂、ジシクロペン
タジエン変性フェノール樹脂、ジシクロペンタジエン変
性フェノール樹脂とフェノールノボラック及びクレゾー
ルノボラック樹脂との共縮合物、パラキシレン変性フェ
ノール樹脂等を用いることができる。When another phenol resin curing agent is used in combination with the phenol resin curing agent represented by the formula (2), the phenol resin curing agent used means all polymers having a phenolic hydroxyl group. For example, generally, phenol novolac resin, cresol novolac resin, dicyclopentadiene modified phenol resin, co-condensation product of dicyclopentadiene modified phenol resin and phenol novolac or cresol novolac resin, paraxylene modified phenol resin and the like can be used.
【００１６】本発明で用いる無機質充填材としては、溶
融シリカ粉末、球状シリカ粉末、結晶シリカ粉末、二次
凝集シリカ粉末、多孔質シリカ粉末を粉砕したシリカ粉
末、アルミナ等が挙げられ、特に溶融シリカ粉末、球状
シリカ粉末及び溶融シリカ粉末と球状シリカ粉末との混
合物が好ましい。また無機質充填材の配合量としては、
耐半田ストレス性と成形性のバランスから、総樹脂組成
物中に７０〜９０重量％含まれるものが望ましい。Examples of the inorganic filler used in the present invention include fused silica powder, spherical silica powder, crystalline silica powder, secondary agglomerated silica powder, silica powder obtained by crushing porous silica powder, alumina, etc., and particularly fused silica. Powders, spherical silica powders and mixtures of fused silica powders and spherical silica powders are preferred. In addition, as the compounding amount of the inorganic filler,
From the standpoint of balance between solder stress resistance and moldability, it is desirable that the total resin composition contains 70 to 90% by weight.
【００１７】さらに本発明に用いる硬化促進剤はエポキ
シ基と水酸基の反応を促進するものであれば良く、一般
に封止材料に使用されているものを広く使用することが
できる。例えばトリフェニルホスフィン（ＴＰＰ）、ト
リブチルホスフィン、トリ（４−メチルフェニル）ホス
フィン等の有機ホスフィン化合物、トリブチルアミン、
トリエチルアミン、ベンジルジメチルアミン、トリスジ
メチルアミノメチルフェノール、１，８−ジアザビシク
ロ［５，４，０］−７−ウンデセン（ＤＢＵ）等の第３
級アミン、２−メチルイミダゾール、２−フェニルイミ
ダゾール、２−エチル−４−メチルイミダゾール等のイ
ミダゾール化合物等が挙げられる。これらを単独で用い
ても、あるいはその２種以上を併用することも可能であ
る。Further, the curing accelerator used in the present invention may be any one as long as it accelerates the reaction between the epoxy group and the hydroxyl group, and those generally used for the sealing material can be widely used. For example, organic phosphine compounds such as triphenylphosphine (TPP), tributylphosphine, tri (4-methylphenyl) phosphine, tributylamine,
Third such as triethylamine, benzyldimethylamine, trisdimethylaminomethylphenol, 1,8-diazabicyclo [5,4,0] -7-undecene (DBU)
Examples thereof include imidazole compounds such as secondary amine, 2-methylimidazole, 2-phenylimidazole and 2-ethyl-4-methylimidazole. These may be used alone or in combination of two or more.
【００１８】本発明の組成物は前述のもの以外、必要に
応じてカーボンブラック等の着色剤、カルナバワック
ス、合成ワックス等の離型剤、ブロム化エポキシ、三酸
化アンチモン等の難燃剤、γ−グリシドキシプロピルト
リメトキシシラン等のカップリング剤、シリコーンゴ
ム、ポリブタジエン等のゴム成分を添加することができ
る。In addition to the above, the composition of the present invention may optionally contain a coloring agent such as carbon black, a release agent such as carnauba wax and synthetic wax, a flame retardant such as brominated epoxy and antimony trioxide, and γ-. A coupling agent such as glycidoxypropyltrimethoxysilane and a rubber component such as silicone rubber and polybutadiene can be added.
【００１９】又、本発明の封止用エポキシ樹脂組成物を
成形材料として製造するには、エポキシ樹脂、硬化剤、
硬化促進剤、充填剤、その他の添加剤をミキサー等によ
って十分に均一に混合した後、さらに熱ロールまたはニ
ーダー等で溶融混練し、冷却後粉砕して成形材料とする
ことができる。これらの成形材料は電子部品あるいは電
気部品の封止、被覆、絶縁等に適用することができる。To produce the encapsulating epoxy resin composition of the present invention as a molding material, an epoxy resin, a curing agent,
A curing accelerator, a filler, and other additives are sufficiently and uniformly mixed with a mixer or the like, and then melt-kneaded with a hot roll, a kneader, or the like, cooled, and then pulverized to obtain a molding material. These molding materials can be applied to sealing, coating, insulating, etc. of electronic parts or electric parts.
【００２０】[0020]
【実施例】以下本発明を実施例で具体的に説明する。EXAMPLES The present invention will be specifically described below with reference to examples.
【００２１】実施例１ 下記組成物 オルソクレゾールとβ−ナフトールの共縮合ノボラックエポキシ樹脂 （ｎはｎ＝３が７０重量％、ｎ＝４が３０重量％の混合物、 エポキシ当量２２５、軟化点８４℃） １3.５重量部 下記式（３）で示されるフェノール樹脂硬化剤 （ｎはｎ＝２が３０重量％、ｎ＝３が７０重量％の混合物、 水酸基当量１７５．軟化点７５℃） １0.５重量 部Example 1 The following composition Co-condensed novolak epoxy resin of orthocresol and β-naphthol (n is a mixture of 70% by weight of n = 3 and 30% by weight of n = 4, epoxy equivalent 225, softening point 84 ° C.) ) 13.5 parts by weight Phenolic resin curing agent represented by the following formula (3) (n is a mixture in which n = 2 is 30% by weight and n = 3 is 70% by weight, hydroxyl equivalent 175, softening point 75 ° C.) 10. 5 parts by weight
【００２２】[0022]
【化５】 [Chemical 5]
【００２３】 溶融シリカ粉末 ７５重量部 トリフェニルホスフィン 0.２重量部 カーボンブラック 0.３重量部 カルナバワックス 0.５重量部 をミキサーで常温で混合し、７０〜１００℃で２軸ロー
ルにより混練し、冷却後粉砕した成形材料とした得られ
た成形材料をタブレット化し、低圧トランスファー成形
機にて１７５℃、７０kg／cm2 、１２０秒の条件で半田
クラック試験用として６×６mmのチップを５２ｐパッケ
ージに封入し、また半田耐湿試験用として３×６mmのチ
ップを１６ｐＳＯＰパッケージに封入した。封止したテ
スト用素子について下記の半田クラック試験及び半田耐
湿性試験を行った。75 parts by weight of fused silica powder 0.2 parts by weight of triphenylphosphine 0.3 parts by weight of carbon black 0.5 parts by weight of carnauba wax are mixed in a mixer at room temperature and kneaded by a twin-screw roll at 70 to 100 ° C. The obtained molding material was made into a molding material that was crushed after cooling, and the obtained molding material was tabletized and a 6 × 6 mm chip was put in a 52p package for solder crack testing under the conditions of 175 ° C., 70 kg / cm 2 and 120 seconds on a low-pressure transfer molding machine. And a 3 × 6 mm chip for a solder moisture resistance test in a 16 pSOP package. The sealed test element was subjected to the following solder crack test and solder moisture resistance test.
【００２４】半田クラック試験：封止したテスト用素子
を８５℃、８５％ＲＨの環境下で４８Ｈｒ及び７２Ｈｒ
処理し、その後２６０℃の半田槽に１０秒間浸漬後、顕
微鏡で外部クラックを観察した。 半田耐湿性試験：封止したテスト用素子を８５℃、８５
％ＲＨの環境下で７２Ｈｒ処理しその後２６０℃の半田
槽に１０秒間浸漬後、プレッシャークッカー試験（１２
５℃、１００％ＲＨ）を行い、回路のオープン不良を測
定した。 試験結果を表１に示す。Solder crack test: The sealed test element was subjected to an environment of 85 ° C. and 85% RH for 48 hours and 72 hours.
After processing, it was immersed in a solder bath at 260 ° C. for 10 seconds, and external cracks were observed with a microscope. Solder moisture resistance test: sealed test element at 85 ° C, 85
After 72 Hr treatment in an environment of% RH and then dipping in a solder bath at 260 ° C for 10 seconds, a pressure cooker test (12
The circuit was opened at 5 ° C. and 100% RH, and the open circuit failure was measured. The test results are shown in Table 1.
【００２５】実施例２〜５ 表１の処方にしたがって配合し、実施例１と同様にして
成形材料を得た。この成形材料でテスト用素子を封止し
た成形品を得、この成形品を用いて実施例１と同様に半
田クラック試験及び半田耐湿性試験を行った。試験結果
を表１に示す。Examples 2 to 5 Compounding was performed according to the formulation shown in Table 1, and molding materials were obtained in the same manner as in Example 1. A molded product in which a test element was sealed with this molding material was obtained, and a solder crack test and a solder moisture resistance test were conducted using this molded product in the same manner as in Example 1. The test results are shown in Table 1.
【００２６】比較例１〜５ 表１の処方にしたがって配合し、実施例１と同様にして
成形材料を得た。この成形材料でテスト用素子を封止し
た成形品を得、この成形品を用いて実施例１と同様に半
田クラック試験及び半田耐湿性試験を行った。試験結果
を表１に示す。Comparative Examples 1 to 5 Compounding was carried out according to the formulation shown in Table 1, and a molding material was obtained in the same manner as in Example 1. A molded product in which a test element was sealed with this molding material was obtained, and a solder crack test and a solder moisture resistance test were conducted using this molded product in the same manner as in Example 1. The test results are shown in Table 1.
【００２７】[0027]
【表１】 [Table 1]
【００２８】[0028]
【発明の効果】耐熱性、低吸水性、可撓性に優れた樹脂
組成物が得られる。プリント回路基板に表面実装する高
集積ＩＣパッケージ用封止材料として半田付け時の半田
耐熱性に非常に優れている。EFFECT OF THE INVENTION A resin composition having excellent heat resistance, low water absorption and flexibility can be obtained. As a sealing material for highly integrated IC packages to be surface-mounted on a printed circuit board, it has excellent solder heat resistance during soldering.
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.5 識別記号 庁内整理番号 ＦＩ 技術表示箇所 Ｃ０８Ｌ 63/00 ＭＪＳ 8830−4Ｊ ─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 5 Identification code Internal reference number FI technical display location C08L 63/00 MJS 8830-4J
Claims (1)
レゾールとβ−ナフトールの共縮合ノボラックエポキシ
樹脂を総エポキシ樹脂量の３０〜１００重量％含むエポ
キシ樹脂、 【化１】 （ｎ＝１〜６） （Ｂ）下記式（２）で示されるフェノール樹脂硬化剤を
総硬化剤量に対して３０〜１００重量％含む硬化剤、 【化２】 （式中のＲ1 、Ｒ2 は水素、ハロゲン、低級アルキル基
の中から選択される同一もしくは異なる原子または基、
ｎ＝１〜６） （Ｃ）無機質充填材及び （Ｄ）硬化促進剤 を必須成分とする半導体封止用エポキシ樹脂組成物。1. An epoxy resin containing (A) an orthocresol and β-naphthol co-condensed novolac epoxy resin represented by the following formula (1) in an amount of 30 to 100% by weight of the total epoxy resin: (N = 1 to 6) (B) A curing agent containing a phenol resin curing agent represented by the following formula (2) in an amount of 30 to 100% by weight based on the total amount of the curing agent: (Wherein R 1 and R 2 are the same or different atoms or groups selected from hydrogen, halogen and lower alkyl groups,
n = 1 to 6) An epoxy resin composition for semiconductor encapsulation, which comprises (C) an inorganic filler and (D) a curing accelerator as essential components.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP32927791A JP2963260B2 (en) | 1991-12-13 | 1991-12-13 | Epoxy resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP32927791A JP2963260B2 (en) | 1991-12-13 | 1991-12-13 | Epoxy resin composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH05166974A true JPH05166974A (en) | 1993-07-02 |
| JP2963260B2 JP2963260B2 (en) | 1999-10-18 |
Family
ID=18219656
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP32927791A Expired - Fee Related JP2963260B2 (en) | 1991-12-13 | 1991-12-13 | Epoxy resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2963260B2 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2010013406A1 (en) * | 2008-08-01 | 2010-02-04 | 住友ベークライト株式会社 | Resin composition for semiconductor encapsulation and semiconductor device using the same |
| JP2013010903A (en) * | 2011-06-30 | 2013-01-17 | Dic Corp | Epoxy resin, curing resin composition, cured product thereof, semiconductor sealing material, and printed wiring board |
| US8424652B2 (en) | 2007-03-23 | 2013-04-23 | Otis Elevator Company | Electromagnet and elevator door coupler |
| TWI624487B (en) * | 2014-02-21 | 2018-05-21 | Nipponkayaku Kk | Epoxy resin, epoxy resin composition and cured product thereof |
-
1991
- 1991-12-13 JP JP32927791A patent/JP2963260B2/en not_active Expired - Fee Related
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8424652B2 (en) | 2007-03-23 | 2013-04-23 | Otis Elevator Company | Electromagnet and elevator door coupler |
| WO2010013406A1 (en) * | 2008-08-01 | 2010-02-04 | 住友ベークライト株式会社 | Resin composition for semiconductor encapsulation and semiconductor device using the same |
| JPWO2010013406A1 (en) * | 2008-08-01 | 2012-01-05 | 住友ベークライト株式会社 | Semiconductor sealing resin composition and semiconductor device using the same |
| US8552572B2 (en) | 2008-08-01 | 2013-10-08 | Sumitomo Bakelite Co., Ltd. | Resin composition for encapsulating semiconductor and semiconductor device using the same |
| JP5549590B2 (en) * | 2008-08-01 | 2014-07-16 | 住友ベークライト株式会社 | Semiconductor sealing resin composition and semiconductor device using the same |
| JP2013010903A (en) * | 2011-06-30 | 2013-01-17 | Dic Corp | Epoxy resin, curing resin composition, cured product thereof, semiconductor sealing material, and printed wiring board |
| TWI624487B (en) * | 2014-02-21 | 2018-05-21 | Nipponkayaku Kk | Epoxy resin, epoxy resin composition and cured product thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2963260B2 (en) | 1999-10-18 |
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