JPH06100658A - Epoxy resin composition - Google Patents

Abstract

PURPOSE:To obtain a semiconductor-sealing epoxy resin composition excellent in soldering cracking resistance and humidity resistance by mixing a specified epoxy resin with a cresol resin curing agent and then with an inorganic filler and a cure accelerator. CONSTITUTION:An epoxy resin component comprising 30-100wt.%, based on the total epoxy resin content, epoxy resin of formula I wherein R1 to R8 are each H, halogen or alkyl (e.g. 3,3',5,5'-tetramethyl-4,4'-dihydroxybiphenyl glycidyl ether) is mixed with 30-100wt.%, based on the total curing agent content, cresol resin curing agent of formula II. The obtained resin composition is further mixed with an inorganic filler (e.g. fused silica powder) and a cure accelerator (e.g. 2-methylimidazole) as essential components and a flame retardant, a colorant, etc., as optional components to produce a semiconductor-sealing epoxy resin composition.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an epoxy resin composition for semiconductor encapsulation which is excellent in resistance to solder stress in surface mounting semiconductor devices.

[0002]

2. Description of the Related Art Conventionally, electronic parts such as diodes, transistors and integrated circuits have been sealed with a thermosetting resin. Especially in integrated circuits, O-cresol novolac epoxy resin which is excellent in heat resistance and moisture resistance is used as a novolak. An epoxy resin cured with a type phenolic resin is used. However, in recent years, as the integration of integrated circuits has become higher and higher, the chips have become larger and smaller, and the packages are small and thin QFPs, SOPs, SOJs, TSs that are surface-mounted from the conventional DIP type.
It has changed to OP, TQFP, PLCC. That is, a large chip is enclosed in a small and thin package, and problems such as cracks caused by stress and deterioration of moisture resistance due to these cracks have been greatly highlighted. In particular, when exposed to a high temperature of 200 ° C. or more in the soldering process, moisture resistance is deteriorated due to cracking of the package and peeling of the resin and the chip. It has been desired to develop a highly reliable encapsulating resin composition suitable for encapsulating these large chips. In order to solve these problems, the use of an epoxy resin represented by the following formula (1) as an epoxy resin (Japanese Patent Laid-Open No. 64-65116) has been proposed.

[0003]

[Chemical 3]

It has been studied. By using the epoxy resin represented by the formula (1), it is possible to reduce the viscosity of the resin system. Therefore, by adding a larger amount of fused silica powder, it is possible to reduce the thermal expansion coefficient and the water absorption after molding the composition, and thus the solder stress resistance can be improved. The sexuality was improved. However, increasing the elastic modulus by blending a large amount of fused silica powder is one of the harmful effects,
Further improvement in solder stress resistance is required.

[0005]

In the present invention, the epoxy resin represented by the formula (1) is used as the epoxy resin to solve the above problems, and the epoxy resin is used as a curing agent in order to achieve a stress reduction due to a decrease in elastic modulus. An object of the present invention is to provide a semiconductor encapsulating epoxy resin composition in which the solder stress resistance of a semiconductor package during mounting on a substrate is remarkably improved by using the cresol resin curing agent represented by the formula (2).

[0006]

The present invention provides (A) an epoxy resin represented by the following formula (1):

[0007]

[Chemical 4]

An epoxy resin containing 30 to 100% by weight of the total epoxy resin, (B) a cresol resin curing agent represented by the following formula (2)

[0009]

[Chemical 5]

An epoxy resin composition for encapsulating a semiconductor, which comprises, as essential components, a curing agent containing 30 to 100% by weight of the total curing agent, (C) an inorganic filler, and (D) a curing accelerator. It has excellent solder stress resistance as compared with conventional epoxy resin compositions.

The biphenyl type epoxy resin represented by the structure of the formula (1) is a bifunctional epoxy resin having two epoxy groups in one molecule and has a low melt viscosity as compared with the conventional polyfunctional epoxy resin and is used in transfer molding. Has excellent fluidity. Therefore, a large amount of fused silica powder of the composition can be blended, low thermal expansion and low water absorption can be achieved, and an epoxy resin composition having excellent solder stress resistance can be obtained. By adjusting the amount of the biphenyl type epoxy resin used, solder stress resistance can be maximized. In order to obtain the effect of resistance to solder stress, it is desirable to use the biphenyl type epoxy resin represented by the formula (1) in an amount of 30% by weight or more, preferably 50% by weight or more based on the total amount of epoxy resin. If it is less than 30% by weight, low thermal expansion and low water absorption cannot be obtained, and solder stress resistance is insufficient. Further, in the formula, R _{1 to} R ₄ are preferably methyl groups, and R _{5 to} R ₈ are preferably hydrogen atoms.

When another epoxy resin is used in combination with the biphenyl type epoxy resin represented by the formula (1), the epoxy resin to be used means all polymers and oligomers having an epoxy group. For example, bisphenol type epoxy resin, cresol novolac type epoxy resin, phenol novolac type epoxy resin, triphenol methane type epoxy resin, trifunctional epoxy resin such as alkyl modified triphenol methane type epoxy resin, triazine nucleus-containing epoxy resin, etc. Say.

The curing agent represented by the molecular structure of formula (2) is a bifunctional curing agent obtained by a condensation reaction using orthocresol and cyclohexane. Compared with the use of a conventional phenol novolac resin curing agent, this use can lower the elastic modulus near the soldering temperature, improve the adhesion to the lead frame and the semiconductor chip, and achieve low water absorption. Therefore, it is effective in reducing the generated stress due to thermal shock during soldering and preventing the defective peeling from the semiconductor chip, the lead frame and the like due to it. By adjusting the amount of such a cresol resin curing agent used, solder stress resistance can be maximized. In order to bring out the effect of solder stress resistance, the cresol resin curing agent represented by the formula (2) is used in an amount of 30% by weight based on the total amount of the curing agent.
More preferably, 50% by weight or more is used. If the amount used is less than 30% by weight, low elasticity, low water absorption and the like, and insufficient adhesion to the lead frame and semiconductor chip, it cannot be expected to improve solder stress resistance.

When using other than the cresol resin curing agent represented by the formula (2) in combination, what is used mainly means polymers and oligomers having a phenolic hydroxyl group in general. For example, phenol novolac resin, cresol novolac resin, dicyclopentadiene modified phenol resin, copolymer of dicyclopentadiene modified phenol resin with phenol novolac and cresol novolac resin, paraxylene modified phenol resin, triphenol methane resin, phenol and cresol A condensate with salicylaldehyde or the like can be used.

As the inorganic filler used in the present invention, fused silica powder, spherical silica powder, crystalline silica powder, secondary agglomerated silica powder, porous silica powder, secondary agglomerated silica powder or silica obtained by pulverizing porous silica powder is used. Examples thereof include powder and alumina, and fused silica powder, spherical silica powder, and a mixture of fused silica powder and spherical silica powder are particularly preferable. In addition, the compounding amount of the inorganic filler is 70 to 9 relative to the total amount of the composition in view of the balance between solder stress resistance and moldability.
0% by weight is preferred.

The curing accelerator used in the present invention may be any one as long as it accelerates the reaction between the epoxy group and the hydroxyl group, and those generally used for sealing materials can be widely used. Zabicyclo undecene (DBU),
Triphenylphosphine (TPP), dimethylbenzylamine (BDMA) and 2-methylimidazole (2MZ)
Etc. are used alone or in combination of two or more. The encapsulating epoxy resin composition of the present invention contains an epoxy resin, a curing agent, an inorganic filler, and a curing accelerator as essential components, but other than this, a silane coupling agent, a brominated epoxy resin, and trioxide may be added if necessary. Flame retardants such as antimony and hexabromobenzene, colorants such as carbon black and red iron oxide, mold release agents such as natural wax and synthetic wax, and various additives such as low-stress additives such as silicone oil and rubber. But there is no problem.

In order to produce the encapsulating epoxy resin composition of the present invention as a molding material, an epoxy resin, a curing agent,
A curing accelerator, a filler, and other additives are sufficiently and uniformly mixed with a mixer or the like, and then the mixture is melt-kneaded with a hot roll or a kneader, cooled, and then pulverized to obtain a molding material. These molding materials can be applied to sealing, coating, insulating, etc. of electronic parts or electric parts.

[0018]

EXAMPLES The present invention will be specifically described below with reference to examples. Example 1 9.3 parts by weight of an epoxy resin represented by the formula (3) (softening point 110 ° C., epoxy equivalent 190 g / eq)

[0019]

[Chemical 6]

Ortho-cresol novolac epoxy resin (softening point 65 ° C., epoxy equivalent 200 g / eq) 2.3 parts by weight Cresol resin curing agent represented by the formula (2) (softening point 203 ° C., hydroxyl equivalent 148 g / eq) 6.7 parts by weight Phenol novolac resin curing agent (softening point 90 ° C., hydroxyl equivalent 105 g / eq) 1.7 parts by weight fused silica powder 78.8 parts by weight triphenylphosphine 0.2 parts by weight carbon black 0.5 parts by weight 0.5 part by weight of carnauba wax was mixed at room temperature with a mixer, kneaded with a twin-screw roll at 70 to 100 ° C., cooled, and ground to obtain a molding material. The obtained molding material is made into a tablet, and a 6 × 6 mm chip is sealed in a 52p package for a solder crack test under the conditions of 175 ° C., 70 kg / cm ² and 120 seconds with a low-pressure transfer molding machine, and solder moisture resistance. A 3 × 6 mm chip was encapsulated in a 16 pSOP package for a sex test. The following solder crack test and solder moisture resistance test were performed on the sealed test element. Solder crack test: sealed test element at 85 ° C, 8
After 48 hours and 72 hours of treatment in an environment of 5% RH, the pieces were immersed in a solder bath at 260 ° C. for 10 seconds, and then external cracks were observed with a microscope. Solder moisture resistance test: Sealed test element at 85 ° C for 8
After 72 hours of treatment in an environment of 5% RH, and after dipping in a solder bath at 260 ° C. for 10 seconds, a pressure cooker test (125 ° C., 100% RH) was performed to measure the open circuit failure. The test results are shown in Table 1.

Examples 2 to 5 Compounding was carried out according to the formulation shown in Table 1, and a molding material was obtained in the same manner as in Example 1. Using this molding material, a molded product sealed for testing was obtained, and a solder crack test and a solder moisture resistance test were carried out in the same manner as in Example 1 using this molded product. The test results are shown in Table 1.

Comparative Examples 1 to 4 Compounding was carried out according to the formulation shown in Table 1, and molding materials were obtained in the same manner as in Example 1. Using this molding material, a molded product sealed for testing was obtained, and a solder crack test and a solder moisture resistance test were carried out in the same manner as in Example 1 using this molded product. The test results are shown in Table 1.

[0023]

[Table 1]

[0024]

According to the present invention, it is possible to obtain an epoxy resin composition having a solder stress resistance which could not be obtained by the prior art. Therefore, when an epoxy resin composition is subjected to a thermal stress due to a rapid temperature change due to a soldering process. Has very good crack resistance and good moisture resistance, so when used for encapsulation, coating, insulation, etc. of electronic and electrical parts, especially highly integrated large chip IC mounted in surface mount package It is suitable for products for which reliability is highly required.

Continuation of front page (51) Int.Cl. ⁵ Identification number Office reference number FI technical display location C08L 63/00 NJW 8830-4J H01L 23/29 23/31

Claims (1)

[Claims] 1. An epoxy resin represented by the following formula (1): An epoxy resin containing 30 to 100% by weight based on the total epoxy resin, (B) a cresol resin curing agent represented by the following formula (2): A curing agent containing 30 to 100% by weight based on the total curing agent,
An epoxy resin composition for semiconductor encapsulation, which comprises (C) an inorganic filler and (D) a curing accelerator as essential components.