JPH0520493B2 - - Google Patents

Info

Publication number
JPH0520493B2
JPH0520493B2 JP59139108A JP13910884A JPH0520493B2 JP H0520493 B2 JPH0520493 B2 JP H0520493B2 JP 59139108 A JP59139108 A JP 59139108A JP 13910884 A JP13910884 A JP 13910884A JP H0520493 B2 JPH0520493 B2 JP H0520493B2
Authority
JP
Japan
Prior art keywords
wire
ball
bonding
strength
conductivity
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59139108A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6120693A (ja
Inventor
Shigemi Yamane
Koichiro Atsumi
Tetsuo Ando
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Priority to JP59139108A priority Critical patent/JPS6120693A/ja
Publication of JPS6120693A publication Critical patent/JPS6120693A/ja
Publication of JPH0520493B2 publication Critical patent/JPH0520493B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H01B1/026—Alloys based on copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550°C
    • B23K35/302—Cu as the principal constituent
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5525—Materials of bond wires comprising metals or metalloids, e.g. silver comprising copper [Cu]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Wire Bonding (AREA)
JP59139108A 1984-07-06 1984-07-06 ボンデイングワイヤ− Granted JPS6120693A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59139108A JPS6120693A (ja) 1984-07-06 1984-07-06 ボンデイングワイヤ−

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59139108A JPS6120693A (ja) 1984-07-06 1984-07-06 ボンデイングワイヤ−

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP6095481A Division JP2501303B2 (ja) 1994-04-11 1994-04-11 半導体装置

Publications (2)

Publication Number Publication Date
JPS6120693A JPS6120693A (ja) 1986-01-29
JPH0520493B2 true JPH0520493B2 (enExample) 1993-03-19

Family

ID=15237669

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59139108A Granted JPS6120693A (ja) 1984-07-06 1984-07-06 ボンデイングワイヤ−

Country Status (1)

Country Link
JP (1) JPS6120693A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109402445A (zh) * 2018-11-09 2019-03-01 上海理工大学 一种抗氧化铜基合金键合引线及其制备方法

Families Citing this family (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6199645A (ja) * 1984-10-20 1986-05-17 Tanaka Denshi Kogyo Kk 半導体素子のボンデイング用銅線
JPS6199646A (ja) * 1984-10-20 1986-05-17 Tanaka Denshi Kogyo Kk 半導体素子のボンデイング用銅線
JPS6280241A (ja) * 1985-10-01 1987-04-13 Tanaka Denshi Kogyo Kk 半導体素子のボンデイング用銅線
JPH0785483B2 (ja) * 1986-07-15 1995-09-13 株式会社東芝 半導体装置
JPH0785484B2 (ja) * 1986-07-16 1995-09-13 株式会社東芝 半導体装置
JPH0785485B2 (ja) * 1986-07-23 1995-09-13 株式会社東芝 半導体装置
JPS6364211A (ja) * 1986-09-05 1988-03-22 古河電気工業株式会社 銅細線とその製造方法
JPS63310932A (ja) * 1987-06-11 1988-12-19 Kurasawa Kogaku Kogyo Kk 銅合金
JPS643903A (en) * 1987-06-25 1989-01-09 Furukawa Electric Co Ltd Thin copper wire for electronic devices and manufacture thereof
US6608284B1 (en) 2000-05-17 2003-08-19 Illinois Tool Works Inc. Weld wire with enhanced slag removal
JP2006021711A (ja) 2004-07-09 2006-01-26 Honda Motor Co Ltd 車両用空調装置
JP4705078B2 (ja) * 2006-08-31 2011-06-22 新日鉄マテリアルズ株式会社 半導体装置用銅合金ボンディングワイヤ
US8610291B2 (en) 2006-08-31 2013-12-17 Nippon Steel & Sumikin Materials Co., Ltd. Copper alloy bonding wire for semiconductor device
JP4691533B2 (ja) * 2006-08-31 2011-06-01 新日鉄マテリアルズ株式会社 半導体装置用銅合金ボンディングワイヤ
JP5074773B2 (ja) * 2007-01-10 2012-11-14 住友電気工業株式会社 銅合金およびその製造方法ならびに銅合金を用いた電線・ケーブル
JP5270467B2 (ja) * 2009-06-18 2013-08-21 タツタ電線株式会社 Ｃｕボンディングワイヤ
CN102459668A (zh) 2009-06-24 2012-05-16 新日铁高新材料株式会社 半导体用铜合金接合线
JP5550369B2 (ja) 2010-02-03 2014-07-16 新日鉄住金マテリアルズ株式会社 半導体用銅ボンディングワイヤとその接合構造
WO2011129256A1 (ja) * 2010-04-14 2011-10-20 タツタ電線株式会社 ボンディングワイヤ
CN101850481B (zh) * 2010-06-22 2012-03-07 哈尔滨工业大学 一种用于紫铜厚大构件熔化焊的铜合金焊丝及其制备方法
SG190479A1 (en) * 2011-12-01 2013-06-28 Heraeus Materials Tech Gmbh Secondary alloyed 1n copper wire for bonding in microelectronics device
SG190480A1 (en) * 2011-12-01 2013-06-28 Heraeus Materials Tech Gmbh 3n copper wire with trace additions for bonding in microelectronics device
CN102560184B (zh) * 2012-01-17 2013-09-18 宁波敖达金属新材料有限公司 无铅易切削高导电率的钙铜材料
TWI605559B (zh) * 2014-04-21 2017-11-11 新日鐵住金高新材料股份有限公司 Bonding wire for semiconductor device
CN112038313B (zh) * 2015-05-26 2025-02-28 日铁新材料股份有限公司 半导体装置用接合线
WO2016189752A1 (ja) * 2015-05-26 2016-12-01 日鉄住金マイクロメタル株式会社 半導体装置用ボンディングワイヤ
TWI628671B (zh) * 2015-05-26 2018-07-01 日鐵住金新材料股份有限公司 半導體裝置用接合導線
CN106489199B (zh) 2015-06-15 2019-09-03 日铁新材料股份有限公司 半导体装置用接合线
SG11201604430YA (en) 2015-07-23 2017-02-27 Nippon Micrometal Corp Bonding wire for semiconductor device
WO2017221434A1 (ja) * 2016-06-20 2017-12-28 日鉄住金マイクロメタル株式会社 半導体装置用ボンディングワイヤ
JP6710141B2 (ja) * 2016-10-14 2020-06-17 田中電子工業株式会社 ボールボンディング用銅合金線
CN106514044A (zh) * 2016-11-30 2017-03-22 安徽华众焊业有限公司 铜基钎焊膏
SG11201811428WA (en) 2017-02-22 2019-01-30 Nippon Steel Chemical & Material Co Ltd Bonding wire for semiconductor device
KR20190120420A (ko) 2017-12-28 2019-10-23 닛데쓰마이크로메탈가부시키가이샤 반도체 장치용 본딩 와이어

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59139663A (ja) * 1983-01-31 1984-08-10 Mitsubishi Metal Corp 半導体装置のワイヤ・ボンデイング用Ｃｕ合金細線
JPS59139662A (ja) * 1983-01-31 1984-08-10 Mitsubishi Metal Corp 半導体装置のワイヤ・ボンデイング用Ｃｕ合金細線
JPS60124960A (ja) * 1983-12-09 1985-07-04 Sumitomo Electric Ind Ltd 半導体素子結線用線
JPS60236253A (ja) * 1984-05-10 1985-11-25 Furukawa Electric Co Ltd:The 半導体用ボンデイング細線

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109402445A (zh) * 2018-11-09 2019-03-01 上海理工大学 一种抗氧化铜基合金键合引线及其制备方法

Also Published As

Publication number Publication date
JPS6120693A (ja) 1986-01-29

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