JPH0519975Y2 - - Google Patents

Info

Publication number
JPH0519975Y2
JPH0519975Y2 JP1987065646U JP6564687U JPH0519975Y2 JP H0519975 Y2 JPH0519975 Y2 JP H0519975Y2 JP 1987065646 U JP1987065646 U JP 1987065646U JP 6564687 U JP6564687 U JP 6564687U JP H0519975 Y2 JPH0519975 Y2 JP H0519975Y2
Authority
JP
Japan
Prior art keywords
thick film
film conductor
principal plane
hole
conductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1987065646U
Other languages
English (en)
Japanese (ja)
Other versions
JPS63172173U (US07943777-20110517-C00090.png
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987065646U priority Critical patent/JPH0519975Y2/ja
Publication of JPS63172173U publication Critical patent/JPS63172173U/ja
Application granted granted Critical
Publication of JPH0519975Y2 publication Critical patent/JPH0519975Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP1987065646U 1987-04-28 1987-04-28 Expired - Lifetime JPH0519975Y2 (US07943777-20110517-C00090.png)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987065646U JPH0519975Y2 (US07943777-20110517-C00090.png) 1987-04-28 1987-04-28

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987065646U JPH0519975Y2 (US07943777-20110517-C00090.png) 1987-04-28 1987-04-28

Publications (2)

Publication Number Publication Date
JPS63172173U JPS63172173U (US07943777-20110517-C00090.png) 1988-11-09
JPH0519975Y2 true JPH0519975Y2 (US07943777-20110517-C00090.png) 1993-05-25

Family

ID=30902914

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987065646U Expired - Lifetime JPH0519975Y2 (US07943777-20110517-C00090.png) 1987-04-28 1987-04-28

Country Status (1)

Country Link
JP (1) JPH0519975Y2 (US07943777-20110517-C00090.png)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5245059A (en) * 1975-10-07 1977-04-08 Fujitsu Ltd Method of producing ceramic circuit substrate
JPS5384165A (en) * 1976-12-29 1978-07-25 Mitsumi Electric Co Ltd Method of producing hyb ic

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5245059A (en) * 1975-10-07 1977-04-08 Fujitsu Ltd Method of producing ceramic circuit substrate
JPS5384165A (en) * 1976-12-29 1978-07-25 Mitsumi Electric Co Ltd Method of producing hyb ic

Also Published As

Publication number Publication date
JPS63172173U (US07943777-20110517-C00090.png) 1988-11-09

Similar Documents

Publication Publication Date Title
EP0052920B1 (en) Electronic circuit interconnection system
JPH08213510A (ja) 熱伝導性を強化した半導体チップ・パッケージ
JP2003502852A (ja) 多層プリント回路板へチップを装着するための構成
US5109601A (en) Method of marking a thin film package
JP3016910B2 (ja) 半導体モジュール構造
JPS59126665A (ja) 厚膜混成集積回路
JPH0519975Y2 (US07943777-20110517-C00090.png)
US4965700A (en) Thin film package for mixed bonding of chips
JP2636602B2 (ja) 半導体装置
JPS6359535B2 (US07943777-20110517-C00090.png)
JPS5847713Y2 (ja) 感熱記録ヘッド用薄膜混成回路
JPH0636592Y2 (ja) 混成集積回路装置
JPH0735413Y2 (ja) 混成集積回路におけるチツプ電子部品の取付構造
JPH0636601Y2 (ja) 回路基板
JPH0423322Y2 (US07943777-20110517-C00090.png)
JPH0729660Y2 (ja) 回路装置
JPS61245555A (ja) 半導体用端子接続構体
JPH10163002A (ja) チップ型電子部品とその製造方法
JPH11111737A (ja) 半導体装置
JP2863358B2 (ja) セラミック多層基板
JPH0231794Y2 (US07943777-20110517-C00090.png)
JPH065731A (ja) セラミックパッケージ及び半導体装置
JPS59124789A (ja) 混成集積回路装置
JPH0714981A (ja) 半導体装置
JPS61144049A (ja) 混成集積回路用基板