JPH0519820B2 - - Google Patents

Info

Publication number
JPH0519820B2
JPH0519820B2 JP58109572A JP10957283A JPH0519820B2 JP H0519820 B2 JPH0519820 B2 JP H0519820B2 JP 58109572 A JP58109572 A JP 58109572A JP 10957283 A JP10957283 A JP 10957283A JP H0519820 B2 JPH0519820 B2 JP H0519820B2
Authority
JP
Japan
Prior art keywords
copper
lead frame
plating layer
semiconductor
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP58109572A
Other languages
English (en)
Japanese (ja)
Other versions
JPS601853A (ja
Inventor
Ryozo Yamagishi
Osamu Yoshioka
Yoshiaki Wakashima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Cable Ltd
Hitachi Ltd
Original Assignee
Hitachi Cable Ltd
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Cable Ltd, Hitachi Ltd filed Critical Hitachi Cable Ltd
Priority to JP10957283A priority Critical patent/JPS601853A/ja
Publication of JPS601853A publication Critical patent/JPS601853A/ja
Publication of JPH0519820B2 publication Critical patent/JPH0519820B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49579—Lead-frames or other flat leads characterised by the materials of the lead frames or layers thereon
    • H01L23/49582—Metallic layers on lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP10957283A 1983-06-17 1983-06-17 半導体用リ−ドフレ−ム Granted JPS601853A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10957283A JPS601853A (ja) 1983-06-17 1983-06-17 半導体用リ−ドフレ−ム

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10957283A JPS601853A (ja) 1983-06-17 1983-06-17 半導体用リ−ドフレ−ム

Publications (2)

Publication Number Publication Date
JPS601853A JPS601853A (ja) 1985-01-08
JPH0519820B2 true JPH0519820B2 (enrdf_load_stackoverflow) 1993-03-17

Family

ID=14513646

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10957283A Granted JPS601853A (ja) 1983-06-17 1983-06-17 半導体用リ−ドフレ−ム

Country Status (1)

Country Link
JP (1) JPS601853A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9802214B2 (en) 2010-07-04 2017-10-31 Ice-World Holding B.V. Play fountain

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100266726B1 (ko) * 1995-09-29 2000-09-15 기타지마 요시토시 리드프레임과 이 리드프레임을 갖춘 반도체장치

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58181888A (ja) * 1982-04-02 1983-10-24 Furukawa Electric Co Ltd:The 銀被覆材料とその製造方法
JPS5976453A (ja) * 1982-10-19 1984-05-01 Mitsubishi Metal Corp 半導体装置のリ−ド材用Ｃｕ合金クラツド材

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9802214B2 (en) 2010-07-04 2017-10-31 Ice-World Holding B.V. Play fountain

Also Published As

Publication number Publication date
JPS601853A (ja) 1985-01-08

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