JPH0519318B2 - - Google Patents

Info

Publication number
JPH0519318B2
JPH0519318B2 JP4480187A JP4480187A JPH0519318B2 JP H0519318 B2 JPH0519318 B2 JP H0519318B2 JP 4480187 A JP4480187 A JP 4480187A JP 4480187 A JP4480187 A JP 4480187A JP H0519318 B2 JPH0519318 B2 JP H0519318B2
Authority
JP
Japan
Prior art keywords
copper foil
weight
parts
double
epoxy resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP4480187A
Other languages
English (en)
Japanese (ja)
Other versions
JPS63211796A (ja
Inventor
Masayuki Noda
Minoru Yonekura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Shin Kobe Electric Machinery Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Kobe Electric Machinery Co Ltd filed Critical Shin Kobe Electric Machinery Co Ltd
Priority to JP4480187A priority Critical patent/JPS63211796A/ja
Publication of JPS63211796A publication Critical patent/JPS63211796A/ja
Publication of JPH0519318B2 publication Critical patent/JPH0519318B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP4480187A 1987-02-27 1987-02-27 多層積層板の製造法 Granted JPS63211796A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4480187A JPS63211796A (ja) 1987-02-27 1987-02-27 多層積層板の製造法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4480187A JPS63211796A (ja) 1987-02-27 1987-02-27 多層積層板の製造法

Publications (2)

Publication Number Publication Date
JPS63211796A JPS63211796A (ja) 1988-09-02
JPH0519318B2 true JPH0519318B2 (OSRAM) 1993-03-16

Family

ID=12701528

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4480187A Granted JPS63211796A (ja) 1987-02-27 1987-02-27 多層積層板の製造法

Country Status (1)

Country Link
JP (1) JPS63211796A (OSRAM)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3541360B2 (ja) * 2002-05-17 2004-07-07 独立行政法人 科学技術振興機構 多層回路構造の形成方法及び多層回路構造を有する基体
EP3950762A1 (en) * 2019-03-28 2022-02-09 Nitto Denko Corporation Resin composition and method for producing adhesive structure

Also Published As

Publication number Publication date
JPS63211796A (ja) 1988-09-02

Similar Documents

Publication Publication Date Title
JP2603053B2 (ja) ビアホール充填用導体ペースト組成物並びにそれを用いた両面及び多層プリント基板とその製造方法
EP0434013B1 (en) Epoxy resin-impregnated glass cloth sheet having adhesive layer
JPH10256687A (ja) ビアホール充填用導体ペースト組成物とそれを用いたプリント配線基板
TW526694B (en) Multilayer flexible wired circuit board and producing method thereof
JPH0519318B2 (OSRAM)
JP4468081B2 (ja) 多層配線基板用導電性ペースト組成物
JP4422555B2 (ja) 多層配線基板用導電性ペースト組成物
JPH0258885A (ja) プリント配線板用銅張り絶縁フィルム
JPH05261861A (ja) 積層板
JP4481734B2 (ja) 多層配線基板用導電性ペースト組成物
JP3728059B2 (ja) 多層配線基板
JP4481733B2 (ja) 多層配線基板用導電性ペースト組成物
JP2591447B2 (ja) 多層基板とその製造方法
JP2002109956A (ja) 導体ペーストおよびそれを用いた配線基板の製造方法
JPH0795626B2 (ja) 金属板入多層プリント基板の製造方法
JPH0138136B2 (OSRAM)
JPH07214725A (ja) 金属箔張り積層板の製造法およびそれに用いる金属箔
JPH01235293A (ja) 電気積層板の製造方法
JP2633286B2 (ja) 電気積層板の製造方法
JP2004119463A (ja) 導電性組成物およびそれを用いた配線基板ならびにその製造方法
JPS6154581B2 (OSRAM)
JP2000068619A (ja) 絶縁層を介する配線間の接続用導電材料及び配線板の製造法
JPH01244852A (ja) 電気積層板の製造方法
JPS63265628A (ja) 金属ベ−ス銅張板およびその製造法
JPH11158439A (ja) 接着剤付き銅箔